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Chuck×ジェーイーエル - List of Manufacturers, Suppliers, Companies and Products

Chuck Product List

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Edge grip chuck

Edge grip chuck

This is a transport chuck for wafers that have been processed on the back side and are not to be contacted.

Since the wafer can be centered during transport, it is suitable for transporting to stages such as drop-in stages. The front and rear directions of the wafer are guided and held by an air cylinder. The wafer is held by clamping the outer circumference without contacting the back surface. By clamping the outer circumference, centering of the wafer is possible. High-speed transport is achievable. The presence or absence of the wafer can be confirmed by the amount of movement of the guide.

  • Other semiconductor manufacturing equipment

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Polaris Chuck

Polaris Chuck

It is suitable for transporting wafers with warping or those that leak with a suction chuck.

It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.

  • Other semiconductor manufacturing equipment

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3D-01661 suction chuck

3D-01661 suction chuck

It is a Y-shaped vacuum suction chuck.

It is suitable for transporting 300mm wafer sizes (random access compatible). It is widely used in atmospheric environment robots and holds the back surface of the workpiece by vacuum suction (negative pressure). By applying a conductive Teflon coating to the chuck surface, it prevents the transported workpieces from damage and scratches caused by static electricity.

  • Other semiconductor manufacturing equipment

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Bernoulli chuck (contact type)

Bernoulli chuck (contact type)

Bernoulli chuck compatible with warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warpage amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli effect is used to suction the workpiece against the substrate. To prevent shifting during transport, it is held in place by the frictional force of friction rubber. The chuck side makes contact, but it can be used interchangeably for different wafer sizes (note that this may not be possible depending on the combination), allowing for a thinner chuck compared to non-contact types. Since the suction is based on Bernoulli's principle, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers.

  • Other semiconductor manufacturing equipment

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Bernoulli chuck (non-contact type)

Bernoulli chuck (non-contact type)

This is a Bernoulli chuck designed for warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped wafers and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warp amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli force attracts the workpiece to the substrate. To prevent shifting during transport, guides at the edge limit displacement. It levitates without contact except at the edges. One chuck is designed for one size of wafer. Since the attracting force is due to Bernoulli, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers. Additionally, it is non-contact on both sides, making it effective for wafers that cannot be contacted.

  • Other semiconductor manufacturing equipment

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Drop-in chuck

Drop-in chuck

It is suitable for transporting wafers with warping or those that leak with a suction chuck.

It is suitable for transporting wafers with warping and those that leak with a suction chuck. This is a chuck for transporting wafers that can make contact with the back surface of the outer circumference and the edge. It utilizes a tapered guide to hold the wafer within a certain range by its own weight. Transporting wafers with contact restrictions from the outer circumference at an affordable price. By adding an optional substrate presence sensor, it allows for confirmation of the presence of the wafer (when used in the atmosphere).

  • Other semiconductor manufacturing equipment
  • Other semiconductor manufacturing equipment

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