It is a Y-shaped vacuum suction chuck.
It is suitable for transporting 300mm wafer sizes (random access compatible). It is widely used in atmospheric environment robots and holds the back surface of the workpiece by vacuum suction (negative pressure). By applying a conductive Teflon coating to the chuck surface, it prevents the transported workpieces from damage and scratches caused by static electricity.
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basic information
Transported item: SEMI standard 300mm, mainly silicon wafers, etc. Material: High-purity alumina ceramic sintered body Surface treatment: Conductive Teflon coating Wafer holding method: Vacuum suction Total length: 242mm Thickness: 3mm
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
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