This is a Bernoulli chuck designed for warped wafers and thin wafers.
This is a Bernoulli chuck that accommodates warped wafers and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warp amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli force attracts the workpiece to the substrate. To prevent shifting during transport, guides at the edge limit displacement. It levitates without contact except at the edges. One chuck is designed for one size of wafer. Since the attracting force is due to Bernoulli, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers. Additionally, it is non-contact on both sides, making it effective for wafers that cannot be contacted.
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basic information
Material: Aluminum Surface treatment: Black anodizing Wafer holding method: Suction with cyclone pads and edge holding with guide (PEEK) (Contact materials can be made in various types) Utility: 30–80 L/min (varies depending on work size and thickness)
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
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