We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Forming Equipment.
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Forming Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Forming Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ダルトン Tokyo//Industrial Machinery
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. シンクロン Kanagawa//Industrial Machinery
  4. 4 エスタカヤ電子工業 Okayama//Electronic Components and Semiconductors
  5. 5 SPD研究所 Shizuoka//Industrial Electrical Equipment
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Forming Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Porous silicon formation device (anodization device) ダルトン
  2. Conductive carbon thin film formation device (arc discharge sputtering device) 神港精機 東京支店
  3. New High-Speed IAD Vacuum Thin Film Formation Device BIS-1300 シンクロン
  4. 4 Formation of stud bumps エスタカヤ電子工業
  5. 5 SPD Research Institute, Inc. - Business Introduction SPD研究所

Forming Equipment Product List

16～20 item / All 20 items

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Clean Zone Device KOACH T 500-F Rental

Clean Zone Device KOACH T 500-F Rental

A clean space is realized in an open environment! Bench-type clean zone equipment.

The KOACH T 500-F is a clean zone formation device that allows for easier high-definition purification of tabletop spaces. (Equipped with FERENA / Original ultra-precision filter) It has a proven track record in many research and testing institutions. Born from a shift in thinking that involves opposing push hoods, it has realized an open clean zone that does not require surrounding or partitioning. Relocation and layout changes are simple. 【Features】 ○ The flexible hose allows for visualization of the local airflow conditions around the equipment. ○ For contamination control, only the necessary areas indoors can be locally purified. ○ The opposing airflow suppresses the attraction of surrounding air, so there is hardly any decrease in cleanliness within the zone even at positions away from the discharge surface. ○ After turning on the switch, an ISO Class 1 open super clean zone can be formed in just 110 seconds, anywhere and anytime. For more details, please contact us or download the catalog.

  • Rental/lease

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Optical Thin Film Formation Device Genesis-AR Series

Optical Thin Film Formation Device Genesis-AR Series

Ideal for film formation on high curvature lenses and ball lenses, which is difficult with sputtering.

In the optical thin film process, by using the ALD (Atomic Layer Deposition) method, which is different from the commonly used deposition and sputtering techniques, it has become possible to form high-quality thin films with excellent conformity on substrates such as ball lenses and high-curvature lenses, which have been considered difficult until now. 【Overview】 ○ Up to 50 φ10 inch substrates can be processed at once (25 substrates × 2 axes) 　* This varies depending on the substrate shape and conditions. ○ Equipped with a substrate rotation mechanism.

  • lens

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Core technology supporting OSRDA: FSNIP

Core technology supporting OSRDA: FSNIP

Can be manufactured with small devices and in small area factories! Achieving an excellent method that does not cause alignment shifts.

We would like to introduce our technology, 'FSNIP (Free Substrate material Narrow pitch Imprinted Process).' By transferring conductive paste onto a substrate using the imprinting method, we can simultaneously form wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm. Due to the transfer wiring method, it can be manufactured with low-cost equipment and in small area factories, and because wiring and bumps are formed simultaneously, it achieves an excellent method that does not result in alignment shifts. 【Features】 ■ Transfer of conductive paste onto the substrate using the imprinting method ■ Simultaneous formation of wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm ■ Can be manufactured with low-cost equipment and in small area factories ■ No alignment shifts occur *For more details, please refer to the PDF document or feel free to contact us.

  • Special Processing Machinery

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Vacuum film formation devices and surface analysis devices: Years of cultivated vacuum technology in this one book!

Vacuum film formation devices and surface analysis devices: Years of cultivated vacuum technology in this one book!

Years of cultivated vacuum technology! A product lineup related to vacuum equipment and scientific instruments!

This is the comprehensive catalog of Pascal Corporation, which possesses a global perspective in vacuum machinery and equipment, as well as physical and chemical instruments and devices. We constantly focus on the forefront of the times, anticipate new technologies and product needs, and continue to provide products that are beneficial to our users. We offer a lineup that includes the time-of-flight atomic scattering surface analysis device "TOFLAS-3000," which enables the polarity discrimination and structural analysis of insulator surfaces, element identification, and in-situ analysis in electric and magnetic fields—capabilities that were impossible with conventional ion scattering surface analysis devices—as well as "vacuum thin film formation devices" and "surface analysis devices." [Excerpt of Contents] ■ Vacuum devices and components ■ Surface analysis devices ■ Low-temperature related equipment ■ Agilent vacuum equipment (formerly Varian) ■ Other vacuum-related products, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment
  • Analytical Equipment and Devices
  • others

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Formation of stud bumps

Formation of stud bumps

We will accommodate various stud bump processing according to your specifications.

Stud bump processing is essential in flip chip mounting technology. Our company can form stud bumps even from a single wafer. We can also process two-tier bumps. We provide leveling support. We can accommodate wafer sizes up to a maximum of 12 inches. We support individual chips, bare wafers, tape-mounted wafers, and reconstructed wafers.

  • Wafer

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