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Heat sink Product List and Ranking from 63 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jul 01, 2026~Jul 28, 2026
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 01, 2026~Jul 28, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. LSIクーラー Tokyo//Industrial Electrical Equipment
  3. 松井製作所 Osaka//Ferrous/Non-ferrous metals
  4. 4 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  5. 5 ザワード Tokyo//Trading company/Wholesale

Heat sink Product ranking

Last Updated: Aggregation Period:Jul 01, 2026~Jul 28, 2026
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  3. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  4. [Video Material] What is Geometric Tolerance Position? Explanation of the Basics! 松井製作所
  5. 4 "FK-244-08-D-PAK" SMT Heat Sink Axuas Co., Ltd.

Heat sink Product List

691~720 item / All 754 items

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LA V HB 3 "High Power & High Reliability" Fan-equipped Heat Sink

You can choose the fan voltage (DC24V or AC230V) and size according to your application!

We, Aqua Co., Ltd., are the official domestic distributor of Fischer Elektronik. The "LA V HB 3" fan-equipped aluminum heat sink features: - Width 389 x Height 121 mm, with an axial fan and air flow chamber - Heat sink lengths available in 100, 150, 200, 250, and 300 mm - Forced air circulation by the fan (DC24V or AC230V) achieves high heat dissipation performance.

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Heat sink for IGBT modules for industrial robots

High-efficiency heat sinks that support the acceleration of industrial robots.

In the industrial robot industry, there is a trend towards faster operation and higher output, which is increasing the load on IGBT modules. This, in turn, raises the risk of performance degradation and failure due to heat. Temperature management is a critical issue, especially for robots that operate at high frequencies or require precise control. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high-density IGBTs, contributing to stable operation and longer lifespan of robots. 【Usage Scenarios】 - High-speed transport robots - Precision assembly robots - Welding robots - Painting robots 【Benefits of Implementation】 - Suppression of temperature rise in IGBT modules - Improved operational stability of robots - Enhanced system reliability - Reduced maintenance frequency

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Heat sink for IGBT modules for UPS

High-efficiency heat sink supporting stable operation of UPS.

In the UPS industry, proper temperature management of IGBT modules is essential to ensure system reliability. To maintain a stable power supply as a backup during power outages, it is necessary to prevent performance degradation and failure due to overheating of the IGBT modules. Our heat sinks for IGBT modules efficiently suppress the temperature rise of high thermal density IGBTs, contributing to the stable operation of UPS systems. 【Application Scenarios】 - Data centers - Server rooms - Medical equipment - Emergency power supplies 【Benefits of Implementation】 - Extended lifespan of IGBT modules - Improved system reliability - Continued stable power supply - Reduced maintenance costs

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L size specification in 1mm increments! 50mm square fan-equipped heat sink LAM5

Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!

"We can't find a standard size that fits," "We want to eliminate the hassle of additional processing in-house"… We solve such design and procurement challenges. Fischer Elektronik's fan-equipped heat sink, the "LAM5 series," condenses powerful cooling performance into a compact 50mm x 50mm profile. Its greatest feature is the flexibility to specify the length in 1mm increments to match your thermal design. Achieve thermal management for power semiconductors without compromising on size. Our authorized distributor, Aquas, provides thorough support. Features of the LAM5 series: 【Custom Size Design】 Length (L) can be specified in 1mm increments, allowing you to maximize the use of dead space in the housing. 【Space-Saving 50mm Square】 An optimal compact size for board mounting, suitable for cooling power semiconductors like TO-247 and TO-220. 【High Cooling Efficiency】 Forced air cooling with a high-performance axial fan achieves several times the heat dissipation performance of natural cooling, contributing to product miniaturization. 【Consistent Support for Additional Processing】 We also accept drilling and tapping for device mounting. Delivered ready for immediate integration. 【Authorized Distributor Support】 Supported by the domestic authorized distributor, Aquas Co., Ltd.

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Universal size of 62mm! Fan-equipped heat sink with L size specified in 1mm increments.

For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.

"The standard size does not fit in the housing" and "the heat dissipation area is slightly insufficient"… such design challenges are solved by Fischer Elektronik's "LA 6 series." With a compact cross-section of 62mm wide by 74mm high, it condenses powerful cooling performance. The biggest feature is its flexible customization that allows customers to specify the length in 1mm increments to match their designs. There is no need to adjust your design to fit off-the-shelf products; we support your ideal thermal management with the shortest delivery time. 【Length specification in 1mm increments】 No need to be constrained by fixed sizes in the catalog; we accommodate cuts in millimeter increments. It fits your design perfectly. 【Exquisite size】 Adopting a "width of 62mm" that is optimal for medium power modules and multiple individual semiconductor placements. 【High-efficiency forced air cooling】 Combining a unique hollow structure with a high-performance fan achieves excellent thermal resistance values, contributing to product miniaturization. 【Comprehensive support for additional processing and customization】 We also accept drilling and tapping. Delivered in a state ready for immediate assembly upon arrival. 【Close collaboration with the manufacturer】 AquaS, the authorized distributor, supports you in collaboration with the manufacturer.

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  • Other semiconductors
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List of LED Heat Sinks for Industrial Equipment

For inspection lights in industrial equipment. LED heat sinks that can be selected based on application and shape.

In the application of inspection lights for industrial equipment, stable light output and long lifespan are required. Particularly in the detection of fine defects and quality control, it is important to properly manage the heat generated by LEDs to consistently maintain performance. If heat is not managed appropriately, it can lead to reduced light output and shortened lifespan, potentially resulting in decreased inspection accuracy and production line stoppages. Our LED heat sinks address these challenges with a diverse lineup and excellent heat dissipation performance, contributing to the reliability of inspection lights. 【Usage Scenarios】 - Product inspection lines in factories - Visual inspection of precision parts - Quality control processes 【Benefits of Implementation】 - Maintenance and improvement of inspection accuracy - Extended lifespan of LED lighting - Stable operation of production lines

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φ98×H50 round pin fin heat sink Al99.5

Round pin fin heat sink with large size and high heat dissipation performance.

This is a round pin fin heat sink that adopts a large size of φ98×H50mm. Its high-density pin fin structure efficiently disrupts the airflow, demonstrating excellent heat dissipation performance in forced air cooling environments. By using aluminum alloy (Al99.5), it achieves both lightweight and high thermal conductivity, effectively addressing the thermal management of high-heat-generating devices. When combined with fans or blowers, it can be used in a wide range of applications, including power semiconductors, power modules, and industrial electronic equipment.

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LF PAK compatible surface mount heat sink

Copper SMT heat sink optimal for heat dissipation measures of small power semiconductors.

The FK 250 06 LF PAK is a surface mount (SMT/SMD) heat sink compatible with various power semiconductor packages, including LF PAK (SOT-669). It uses high thermal conductivity copper (Cu) to efficiently dissipate heat from surface mount devices that generate heat, such as MOSFETs and power ICs. With a compact design of 8×15×6.5mm, it is suitable for heat dissipation measures in high-density mounting boards and limited spaces. The solderable surface specification allows for direct soldering to the board and is compatible with reflow mounting processes. It can be used as a thermal management component in electronic devices that require reliability, such as industrial equipment, power circuits, and communication devices. As a surface mount heat sink manufactured by Fischer Elektronik, it contributes to temperature rise suppression of small power semiconductors and extends the lifespan of electronic devices.

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  • Other semiconductors
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Heat sealant for AL/AL (easy peel type)

It is an easy-peel type heat sealant for AL/AL!

"IS#18-5 Matt D-4" is an easy-peel type heat sealant for AL/AL applications. It can be used for pharmaceutical packaging. 【Features】 ■ Heat sealant for AL/AL ■ Easy-peel type ■ Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF document or feel free to contact us through our website.

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PVC-based heat sealant (low viscosity type)

Good handling! Low viscosity type of LD#830 Clear modification!

"LD#830MR Clear Modified" is a low-viscosity heat sealant type of "LD#830 Clear Modified." It has excellent handling properties. It can be used for food packaging and pharmaceutical packaging (PTP) PVC-based heat sealants. 【Features】 - Low-viscosity type of "LD#830 Clear Modified" - Good handling properties - Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF document or feel free to contact us through our website.

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EVA-based heat sealant (water-based emulsion type)

Water-based emulsion type! Excellent adhesion to OPP and PET!

"LD#PC18" is a water-based emulsion type heat sealant. It excels in hot tack properties compared to other low-temperature sealing grades of EVA. It can be used for pharmaceutical and food packaging. 【Features】 ■ Water-based emulsion type ■ Excellent adhesion to OPP and PET ■ Superior hot tack properties ■ Appearance is milky white *For more details, please refer to the PDF materials or feel free to contact us through our website.

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Heat sealant for CAB film

It has excellent adhesion to CAB film.

"LD#S555 Clear" is a heat sealant developed for CAB (Cellulose Acetate Butyrate) film. It excels in adhesion to CAB film and can be used for edge molding. 【Features】 ■ For CAB (Cellulose Acetate Butyrate) film ■ Excellent adhesion ■ Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF materials or feel free to contact us through our website.

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PVC-based heat sealant (strong adhesion type)

Strong adhesion type! Excellent handling performance!

"LD#S837G Clear" is a strong adhesive type and low viscosity type of the PVC-based heat sealant "LD#830 Clear Revised." It has excellent moisture resistance. It can be used for PVC-based heat sealants for pharmaceutical packaging (PTP) and food packaging. 【Features】 ■ Strong adhesive type and low viscosity type of "LD#830 Clear Revised" ■ Excellent handling properties ■ Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF materials or feel free to contact us through our website.

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AL/AL heat sealant (strong adhesion)

It is a heat sealant for AL/AL!

The "SC-25 Coat" is a heat sealant developed for AL/AL applications. It is characterized by its high adhesion strength. It can be used for food packaging. [Features] - Heat sealant for AL/AL - High adhesion strength - Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF materials or feel free to contact us through our company website.

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AL/AL heat sealant

Heat sealant for AL/AL!

"T-200-25 Clear" is a heat sealant developed for AL/AL. It has excellent blocking properties. It can be used for food packaging. 【Features】 ■ Heat sealant for AL/AL ■ Excellent blocking properties ■ Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF document or feel free to contact us through our website.

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PP-based polyolefin heat sealant

Dechlorinated PVC type! It is primarily composed of modified polyolefin resin and has excellent moisture resistance.

"Disper #11 Modified" is a polyolefin-based heat sealant. It has excellent low-temperature sealing properties and is a non-PVC type product with outstanding moisture resistance. It can be used for food packaging and pharmaceutical packaging (PTP) heat sealants. 【Features】 ■ Non-PVC type ■ Excellent low-temperature sealing properties ■ Outstanding moisture resistance ■ Hygiene certification: Ministry of Health Notification No. 370 *For more details, please refer to the PDF materials or feel free to contact us through our website.

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Case study of heat sink thermal dissipation evaluation.

We thermally compared a high thermal conductivity wooden heat sink and an aluminum heat sink!

We will introduce a case study comparing a heat sink made of high thermal conductivity resin with an aluminum heat sink thermally. In heating experiments using LED chips, the base temperature difference between the high thermal conductivity resin and aluminum was 7 to 8°C, while the temperature difference of the LED element was about 10°C. Additionally, when observing the thermal conductivity distribution of the high thermal conductivity resin, it was found that the thermal conductivity was distributed along the flow of the resin. [Case Overview] ■ Content - Comparison of heat sinks made of high thermal conductivity resin and aluminum ■ Experiment 1 - Heating experiment using LED chips ■ Experiment 2 - Observation of thermal conductivity distribution of high thermal conductivity resin *For more details, please refer to the PDF document or feel free to contact us.

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Other heat sink HP-100C

Cooling can be performed in combination with air-cooled or water-cooled heat sinks.

Heat pipe for transferring heat

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[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)

[Free trial available - Specialized book] ★ Thorough explanation of heat problem countermeasures associated with the high-speed operation of high-performance semiconductors and the high-density implementation of devices.

- Response to 5G, high-speed, and miniaturization - ■ Key Points of This Document Design and Application of Heat Sinks - Resolution of hotspot issues in next-generation power devices - Increase in maximum heat transport per unit - Composite use of graphite and metal materials and application of heat spreaders Development and Application Examples of TIM (Thermal Interface Material) - Orientation technology for transporting large amounts of heat in the thickness direction - Emergence of high thermal conductivity in TIM and reduction of contact thermal resistance - Achievement of high thermal conductivity with less filler content Development of Heat Dissipation Substrates - Improvement of high thermal conductivity and heat shock characteristics of metal-based substrates - Enhancement of thermal conductivity in silicon nitride substrates Prospects for Next-Generation Cooling Technologies - Outlook and challenges of boiling cooling technology - Boiling heat transfer under electric field application Examples of Heat Dissipation Design for Devices - Approach to thermal design and thermal verification, simulation technology - Response to thermal design based on substrate heat dissipation, component technology - Design and evaluation of submerged processor chips aimed at liquid immersion cooling - Key points of thermal design in mobile devices

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Pin Fin Heat Sink W14 x L14 x H6.5mm

Corner-type pin fin heat sink "ICK S 14 x 14 x 6.5"

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. ICK S 14 x 14 x 6.5 Square pin fin heat sink with a width of 14mm, height of 6.5mm, and length of 14mm. You can check out our wide variety of pin fin heat sinks on our website. *Please feel free to contact us for more details.

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  • Other semiconductors
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Axial flow fan equipped hollow heat sink LA14 (120x120 mm)

Heat sink with axial fan, selectable up to a length of 400mm.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. Hollow-type heat sink with LA14 axial fan The hollow-type heat sink with a width of 120mm and height of 120mm is equipped with an axial fan, allowing for more effective heat dissipation. Lengths can be selected from 100mm, 150mm, 200mm, 250mm, 300mm, and 400mm. *Please feel free to contact us for more details.

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  • Other semiconductors
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SK85-100-SA Extruded Heat Sink

Width 160mm, Height 40mm, Length 100mm

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. The SK85 series is an extruded heat sink with a width of 160mm and a height of 40mm. You can choose from the following lengths: 37.5mm / 50mm / 75mm / 100mm / 150mm / 1000mm. *Please feel free to contact us for more details.

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  • Other semiconductors
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SK85-37.5-SA Extruded Heat Sink

Width 160mm, Height 40mm, Length 37.5mm

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. The SK85 series is an extruded heat sink with a width of 160mm and a height of 40mm. Lengths available are 37.5mm, 50mm, 75mm, 100mm, 150mm, and 1000mm. *Please feel free to contact us for more details.

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  • Other semiconductors
  • Heat sink

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LA-9-100-24 | Hollow-type heat sink with axial fan

Forced air cooling heat sink combining a hollow type heat sink with dimensions of 80mm width, 83mm height, and 100mm length, and a DC24V axial fan.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. Hollow Heat Sink with LA9 Axial Fan The hollow heat sink, measuring 80mm in width and 83mm in height, is equipped with an axial fan, allowing for efficient heat dissipation in a compact design. Lengths are available in 100mm, 150mm, 200mm, 250mm, and 300mm. *Please feel free to contact us for more details.

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  • Other semiconductors
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Axial fan equipped hollow-type heat sink LA 7 100 24 V

Forced air cooling using a hollow heat sink with a width of 125mm, height of 74mm, length of 100mm, combined with a DC24V axial fan.

Our company, Aquas, is the official domestic distributor of the global German manufacturer Fischer Elektronik. LA7 Axial Fan Equipped Hollow Heat Sink The hollow heat sink, measuring 125mm in width and 74mm in height, is equipped with an axial fan, allowing for efficient heat dissipation. You can choose from lengths of 100mm, 150mm, 200mm, 250mm, or 300mm. The axial fan is available in 12V DC or 24V DC options. There is also a version with an air flow chamber called "LA V 7." *Please feel free to contact us for more details.

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  • Other semiconductors
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"LA 17 150 24 V" axial flow fan equipped heat sink

Efficient heat dissipation achieved with a hollow heat sink measuring 122mm in width, 120mm in height, and 150mm in length, along with an axial fan.

Our company, Aquas, is the official domestic distributor of the global German manufacturer Fischer Elektronik. LA17 Hollow Heat Sink with Axial Fan The hollow heat sink, measuring 122mm in width and 120mm in height, is equipped with an axial fan, allowing for efficient heat dissipation in a compact design. Lengths are available in 100, 150, 200, 250, 300, and 400mm. The axial fan can be selected in 24V DC or 230V AC. *Please feel free to contact us for more details.

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  • Other semiconductors
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"LA 6 100 24 V" heat sink with axial fan

Efficient heat dissipation achieved with a hollow heat sink measuring 62mm in width, 74mm in height, and 100mm in length, along with a DC24V axial fan.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. LA6 Hollow Heat Sink with Axial Fan The hollow heat sink, measuring 62mm in width and 74mm in height, is equipped with an axial fan, allowing for efficient heat dissipation in a compact design. Lengths are available in 100mm, 150mm, 200mm, 250mm, and 300mm. The axial fan can be selected in 12V DC or 24V DC. There is also the "LA V 6" model with an airflow chamber. *Please feel free to contact us for more details.

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  • Other semiconductors
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"FK-250-08-LF-PAK" SMT Heat Sink

Copper heat sink that can be directly soldered to an SMT board, with a width of 15mm, height of 8mm, and length of 8mm.

Our company, Aquas, is the official domestic distributor of the global German manufacturer Fischer Elektronik. FK 250 08 LF PAK Copper heat sink with a width of 15mm, height of 8mm, and length of 8mm. It can be directly soldered (mounted) onto the circuit board. Taped products are also available. *Please feel free to contact us for more details.

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  • Other semiconductors
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