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Heat sink Product List and Ranking from 63 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. ザワード Tokyo//Trading company/Wholesale
  3. LSIクーラー Tokyo//Industrial Electrical Equipment
  4. 4 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  5. 5 リーダー Osaka//others
Go to Company Ranking

Heat sink Product ranking

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  3. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  4. 4 Power semiconductor fan and heat sink integrated forced air cooling unit Axuas Co., Ltd.
  5. 5 Water-cooled heat sink 高木製作所

Heat sink Product List

46～60 item / All 737 items

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Freshly cut heat sink "100W100L12H"

Freshly cut heat sink "100W100L12H"

Wide manufacturing capabilities! Our heat sinks can also provide additional processing and supply of accessories.

We would like to introduce our newly launched heat sink, '100W100L12H'. The materials used are aluminum (A1060 or A6063) and copper (C1100). We can manufacture both small and large sizes with a narrow pitch. Additionally, to reduce the unit cost of aluminum and copper products, we sometimes create molds and jigs to minimize material waste and unnecessary processing. However, this processing method does not require molds, allowing for small-scale production as well. 【Features】 ■ Can make fins thinner ■ Can be manufactured with a narrow pitch (for both small and large sizes) ■ No initial investment required ■ Possible to manufacture in small quantities ■ Capable of wide-range production *For more details, please refer to the related links or feel free to contact us.

  • Heat exchanger

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Zaward Corporation Product Catalog

Zaward Corporation Product Catalog

We accommodate a wide range of construction methods to meet your needs! Introducing our lineup and features.

This catalog introduces products we handle, such as "heat sinks," "fan motors," "coolers," and "embedded power supplies." In the "heat sink" section, we provide detailed information on the consideration process as well as thermal design and thermal simulation services. The content is designed to be easy to reference when considering implementation. Please feel free to download and take a look. [Contents] ■ Heat Sink ■ Fan Motor ■ Cooler ■ Embedded Power Supply *For more details, please refer to the PDF document or feel free to contact us.

  • Heat exchanger
  • Fan motor

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Zaward "Comprehensive Catalog of Heat Dissipation Components"

Zaward "Comprehensive Catalog of Heat Dissipation Components"

A variety of heat dissipation components such as heat sinks and fan motors are included. Reference material for thermal design.

This catalog includes a wide range of standard heat sink products. It features performance graphs detailing the characteristics and thermal resistance of different manufacturing methods for heat sinks, as well as introducing additional functions such as fan motor failure prevention and rotational speed detection. You can smoothly select products with performance suited to your applications. Additionally, it includes the benefits of our "thermal design and thermal simulation services" and examples of thermal analysis. Please check them together. 【Features】 ■ Selection of heat sinks based on performance ■ Waterproof and dustproof fan motors are also included ■ Embedded power supplies are featured ■ Manufacturing range for lengths and widths is also introduced ■ Thoughtfully designed binding *Our company primarily handles custom products. Please feel free to contact us for design/development inquiries.

  • Fan motor

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[Prototype Case of Sand Casting] HEAT SINK (Prototype)

[Prototype Case of Sand Casting] HEAT SINK (Prototype)

A successful case of casting a fin with a thickness of 1.25mm using gravity casting in die-casting prototyping!

We would like to introduce a prototype case of the "HEAT SINK." The product weight is 800g, and the dimensions are 280×110×55. We successfully cast the die-cast (mass production) prototype with a fin thickness of 1.25mm using gravity casting (self-weight). 【Overview】 ■ Material: AC4B-F ■ Delivery Industry: Automotive-related ■ Supported Lot Size: 1 to 100 pieces ■ Product Weight: 800g ■ Product Size: 280×110×55 *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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[Technical Column #07] Explanation of the Principle of Heat Sinks

[Technical Column #07] Explanation of the Principle of Heat Sinks

Absorbing heat and releasing it into the air! Introducing methods to improve the mechanism and heat dissipation.

This article explains the principles of heat sinks and the mechanisms of heat dissipation. Our company has a technology called "Sugohie" that enhances the heat dissipation properties of heat sinks and similar products. In this column, we will introduce not only the principles of heat sinks but also the principles and benefits of "Sugohie." If you are considering improving heat dissipation performance, please take this as a reference. 【Contents (excerpt)】 ■ A clear explanation of the principles of heat sinks ■ What is a heat sink (radiator)? ■ The principles of heat sinks and the mechanisms of heat dissipation ■ Reasons why heat sinks are necessary ■ Heat sinks and thermal resistance *For detailed content of the column, you can view it through the related links. For more information, please feel free to contact us.

  • Plating Equipment

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[Technical Column #15] The Size of Heat Sink Surface Area and Its Heat Dissipation Effect

[Technical Column #15] The Size of Heat Sink Surface Area and Its Heat Dissipation Effect

We will introduce points to consider during design and original technologies to enhance cooling effects through plating!

The heat sink's heat dissipation effect varies depending on its surface area. In this column, we will introduce what size of surface area is preferable, as well as the mechanism and necessity of heat dissipation in heat sinks. Additionally, in the latter part of the column, we will present our original technology that enhances cooling effects without changing the base material. For more details, please refer to the related links. [Content Overview (Excerpt)] ■ What is the ideal surface area for heat sinks? ■ Comparison of heat sink shapes and thermal resistance ■ The necessity of heat sinks and the mechanism of heat dissipation ■ Key points for optimizing heat sink design ■ Enhancing heat dissipation effects compactly without increasing surface area *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.

  • Other electronic parts
  • Plating Equipment

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Introduction to Cooling Technology: Heat Sink

Introduction to Cooling Technology: Heat Sink

Various manufacturing methods tailored to applications such as size and environment! We provide optimal heat dissipation solutions.

We offer large, high-performance, and durable heat sinks as a heat dissipation solution for high-heat devices such as industrial IGBTs and communication base stations. We provide optimal heat dissipation solutions through various manufacturing methods tailored to the application, including size and environment. [Heat Sink Structures and Manufacturing Methods] ■ Aluminum Extrusion ■ Skyv Processing ■ Stacked Fins ■ Solder-Free, Press-Fit, Stacked Fins ■ IGBT Heat Sinks for Transportation Vehicles ■ Fin Shapes *For more details, please refer to the PDF materials or feel free to contact us.

  • Cooling system

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[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

Fresh refrigerant spreads evenly within the plane! It is possible to reduce temperature unevenness, improve cooling efficiency, and achieve low thermal resistance.

A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources such as CPUs. Many designs utilize a structure called "fins" to release heat into the air or to flow water internally to absorb heat. Our company designs, manufactures, and sells water-cooled heat sinks, which we refer to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh coolant to evenly distribute across the surface, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Structure】 ■ Matrix structure ■ Distribution flow path ■ Microchannel flow paths arranged across the entire cooling surface ■ Internal structure that evenly distributes coolant to all flow paths *For more details, please refer to the PDF materials or feel free to contact us.

  • Other environmental equipment
  • Heat exchanger

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Concerns Submitted to WELCON: Heat Sink Edition

Concerns Submitted to WELCON: Heat Sink Edition

We will introduce the concerns about heat sinks submitted to WELCON!

WELCON's heat sinks enable uniform cooling and are characterized by their high cooling performance with minimal refrigerant usage. In this document, we will introduce the concerns related to heat sink cooling that have been raised by our company, which has been involved for many years in the planning, method examination, analysis verification, prototype development, evaluation, and mass production of heat sinks.

  • Cooling system

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【Comparison data available!】WELCON's water-cooled heat sink brochure

【Comparison data available!】WELCON's water-cooled heat sink brochure

A must-see for those struggling with heat generation! Introducing uniform cooling and low refrigerant heat sinks.

Due to the increase in computational load and high output, the heat generated by chips and light sources has increased, and we often hear the following concerns: - Air cooling cannot sufficiently cool the high heat generation. - I want to try water cooling, but I wonder if it will leak. - Considering carbon neutrality, I want a cooling method that reduces environmental impact and power consumption. Therefore, we are releasing a brochure on heat sinks as a reference for considering water cooling! Please feel free to download the brochure.

  • Cooling system

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Heat sink for LSI

Heat sink for LSI

Heat sink for LSI

Introducing a heat sink developed to dissipate heat generated by the acceleration of CPUs in a more compact space, specifically for LSI applications. ■□■ Features ■□■ ■ A compact design that increases surface area by machining slits into a small heat sink or block to create fin structures with corner pins, resulting in excellent thermal resistance. ■ A heat sink that allows for the free setting of dimensions for height, width, and length, as well as corner pin dimensions, to solve various issues related to space during design. For other functions and details, please contact us.

  • Other electronic parts

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Medium-sized heat sink

Medium-sized heat sink

Medium-sized heat sink

This is an introduction to a series of medium-sized heat sinks, with a total of 276 types available, designed for cooling electronic devices that are becoming more densely packed due to the power enhancement of semiconductor devices, aimed at providing the most rational solutions for all users. ■□■Features■□■ ■Medium-sized products can be complexly processed using large machining centers. ■A wide variety of extruded materials are available, allowing customers to choose materials that meet their needs. For other functions and details, please contact us.

  • Other electronic parts

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Eravant Heatsinks

Eravant Heatsinks

The type is millimeter wave component, and the supported power is 15W/45W/95W!

We would like to introduce the 'Eravant Heatsinks' that we handle. We offer the SUA series "Universal Amplifier Heatsinks." The types are for millimeter-wave components, with power ratings of 15W, 45W, and 95W. Please feel free to contact us when you need assistance. 【Product Lineup】 ■SUA series "Universal Amplifier Heatsinks" *For more details, please refer to the related links or feel free to contact us.

  • Amplifier

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Heat sink

Heat sink

Quickly transfers heat.

This is a radiator for electronic components that prevents the destruction of elements by quickly transferring and cooling heat. It typically consists of a base plate for mounting heat-generating elements and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or employing cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

  • Other electronic parts

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Heat sink for pin-mounted devices, P/FP/U series

Heat sink for pin-mounted devices, P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts

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