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Heat sink Product List and Ranking from 63 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. ザワード Tokyo//Trading company/Wholesale
  3. LSIクーラー Tokyo//Industrial Electrical Equipment
  4. 4 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  5. 5 リーダー Osaka//others
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Heat sink Product ranking

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  3. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  4. 4 Power semiconductor fan and heat sink integrated forced air cooling unit Axuas Co., Ltd.
  5. 5 Water-cooled heat sink 高木製作所

Heat sink Product List

61～75 item / All 737 items

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink for forced air cooling.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow-type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices equipped with aluminum extrusion.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Comb Fit Heat Sink YK/YU/YX・YC Series

Comb Fit Heat Sink YK/YU/YX・YC Series

Achieving high-performance heat sinks with our unique aluminum pressure welding technology!

The Comb Fit Heat Sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It realizes excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and middle fins → The width of the fins can be freely set by changing the number of middle fins (Width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb Fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air. → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together with pressure, the metals adhere to each other, improving thermal conductivity between the base and fins. → The stress generated during press-fitting and work hardening are combined to join the fins and base. → The joining strength is incomparable to simply pushing the fins into the base. *Online meetings are also possible, so please feel free to contact us.

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[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

Support from thermal design to provide the right products! Free provision of analysis through simulation software and actual measurement data for thermal countermeasures!

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We propose suitable costs while shortening development time. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also possible, so please feel free to contact us.

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Thermal management for electronics! Optimal heat sinks for performance and cost.

Thermal management for electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be freely made according to specifications for each output capacity. - Simple structure that does not require wind tunnel sheet metal. - Both sides of devices such as power modules can be mounted. 【YK Series/YU Series】 - Single-sided base type. - Fin arrangement can be freely configured according to unit composition. ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type. - Customization is possible by selecting from the standard lineup. ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, with customization options available. ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages like TO220. - Numerous standard lineup options, with dimension customization possible. ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, suitable for air cooling. - Small-scale prototypes can be produced, with dimension and processing customization available.

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Crimp-type heat sink / comb fit

Crimp-type heat sink / comb fit

Heat sink compatible with high-output LEDs! Customization available according to application and structure.

As specialists in thermal dissipation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural convection heat dissipation fins in addition to forced air cooling. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Dissipation Fins for Driver Circuits P Series" - Heat dissipation fins with mounting terminals for TO-220 packages. - A wide variety of standard lineup is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We propose heat dissipation fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fish attracting lights. *Online meetings are also possible, so please feel free to contact us.

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Flexible heat sink

Flexible heat sink

The heat sink fits the curved surface! The fin shape and size can be customized according to your requirements.

We offer a "Flexible Heat Sink" that elegantly solves the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that were previously difficult to install on, maximizing the heat dissipation effect. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.

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Aluminum processing heat sink heat dissipation plate

Aluminum processing heat sink heat dissipation plate

With over 20 years of experience with Japanese manufacturers, our commitment to quality, cost, and delivery compliance is highly regarded.

●We will procure appropriate materials and carry out work according to the customer's product usage. ●Unlike manufacturers that handle everything in-house, we provide feedback in the form of high product completion, cost reduction, and high quality.

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Active heat sink

Active heat sink

Standard products are available for sale from one piece, and same-day shipping is possible! We also accommodate additional processing and customization! Leave it to us from prototyping to mass production!

This is a heat sink that directly attaches a fan for forced cooling.

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Heat sink series with fixed tabs

Heat sink series with fixed tabs

Standard products are available for sale from one piece and can be shipped on the same day! We also accommodate additional processing and customization! Leave it to us from prototypes to mass production!

You can select a combination of our standard push pins and springs, which are abundantly available, according to your usage environment and purchase them as a set.

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  • fan

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Push pin type heat sink

Push pin type heat sink

A method to secure the heat sink and board with push pins, using the tension of a spring to hold the heat sink in place.

We provide a total solution that includes push pins, springs, and thermal interfaces, fixing the heat sink to the board with push pins and holding the heat sink with the tension of the spring, according to your specifications.

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Custom Heat Sink (Guide)

Custom Heat Sink (Guide)

Standard products are available for sale from one piece, and same-day shipping is possible! We also accommodate additional processing and customization! Leave it to us from prototyping to mass production!

Guide to Custom Heat Sinks If you cannot find the desired heat sink among our standard products, we also offer custom heat sink manufacturing.

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