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更新日: 集計期間:Feb 18, 2026~Mar 17, 2026
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Heat sinkの製品一覧

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Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

  • Other electronic parts
  • Heat sink

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

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Heat sink for pin-mounted devices, P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts
  • Heat sink

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Water-cooled heat sink

Outstanding cooling effect!

Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.

  • Other semiconductor manufacturing equipment
  • Heat sink

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