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Heat sink(CPU) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Heat sink Product List

16～30 item / All 34 items

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Heat sink for LSI

Heat sink for LSI

Heat sink for LSI

Introducing a heat sink developed to dissipate heat generated by the acceleration of CPUs in a more compact space, specifically for LSI applications. ■□■ Features ■□■ ■ A compact design that increases surface area by machining slits into a small heat sink or block to create fin structures with corner pins, resulting in excellent thermal resistance. ■ A heat sink that allows for the free setting of dimensions for height, width, and length, as well as corner pin dimensions, to solve various issues related to space during design. For other functions and details, please contact us.

  • Other electronic parts

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Copper water-cooled heat sink

Copper water-cooled heat sink

Immediate delivery is possible for in-stock items! We have a range of standard products available from 20mm square to 1m long, suitable for various applications.

We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. As these are in stock, we can deliver them immediately, and we also sell peripheral equipment such as cooling water circulation devices. Additionally, we are open to inquiries for custom products. 【Features】 ■ Exceptional cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery available for in-stock items ■ Peripheral equipment such as cooling water circulation devices also for sale ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
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"ICK PGA 14x14x12" PGA heat sink

"ICK PGA 14x14x12" PGA heat sink

CPU and processor heat sink measuring 36mm x 36mm x 12.3mm.

Our company, Aquas, is the official domestic distributor of the German global manufacturer Fischer Elektronik. ICK PGA 14x14x12 PGA heat sink with dimensions W36mm x L36mm x H12.3mm Other size variations can be found on our website. *Please feel free to contact us for more details.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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LattePanda with pure copper heat sink

LattePanda with pure copper heat sink

Because it is made of pure copper, it can efficiently cool heat even in summer.

This product is a heat sink suitable for cooling small surface-mounted components such as the CPU and motor driver of the LattePanda. Made of pure copper, it can efficiently dissipate heat even in summer. Additionally, this product includes five heat sinks, and by installing all of them, you can cover the heat sources of the LattePanda and stabilize the temperature. 【Specifications】 ■ Made of pure copper ■ Self-adhesive ■ Dimensions: 13.2 x 12.1 x 4.8 mm ■ Weight: 32g *For more details, please refer to the external link or PDF materials, or feel free to contact us.

  • others

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General-purpose heat sinks "KF Series / VF Series"

General-purpose heat sinks "KF Series / VF Series"

Available for delivery with fixed parts installed. For those who want to enhance cooling performance, we recommend forced air cooling.

We provide heat sinks for various applications such as power supplies and power conditioners. The general-purpose "KF" type can also be offered with nut spacers and push pins for mounting on the circuit board. Additionally, we can attach thermal spacers and thermal conductive double-sided tape. We can accommodate forced air cooling with fans, and we accept custom manufacturing from molds according to customer requests for image processing boards and switching power supplies. 【Features】 ■ The "KF series" can meet a variety of requests. ■ The "VF series" can be soldered to the circuit board. ■ Can be provided with pressed-in nut spacers and attached thermal spacers. ■ By utilizing simulation software, we can propose specifications that meet your needs. *For more details, please contact us.

  • s1.jpg
  • s2.jpg
  • others

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LattePanda with cooling fan aluminum heat sink

LattePanda with cooling fan aluminum heat sink

By using a 2-pin jumper connector, you can easily connect to the CN2 header on the board.

The product features a thermal pad with adhesive on the back, which can be attached to the metal shield on the board. By using an aluminum case, the CPU's heat is quickly absorbed, demonstrating high performance. 【Specifications】 ■ Operating Voltage: 5V ■ Operating Current: 0.14A ■ Rated Speed: 7500RPM ■ Cable Length: 18cm ■ Interface Type: 2.54mm 2-pin DuPont female connector ■ Dimensions: 35 x 35 x 10 mm / 1.38 x 1.38 x 0.39" ■ Fan Dimensions: 30 x 30 x 7 mm / 1.18 x 1.18 x 0.28" ■ Weight: 14g *For more details, please refer to the external link or PDF materials, or feel free to contact us.

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Microchannel Heat Sink 'M4040/M2020'

Microchannel Heat Sink 'M4040/M2020'

Uniform temperature across the entire surface with matrix flow channels! We also accommodate custom orders and mass production.

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment

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[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

If you're looking to enhance the performance of heat management components while also achieving miniaturization, weight reduction, and energy efficiency, this is a must-see!

Our company designs, manufactures, and sells microchannel heat sinks. We can suppress the temperature rise to 40°C for a heat generation of 260W/cm². The microchannel flow paths are arranged across the entire cooling surface, ensuring that the refrigerant is evenly distributed throughout all flow paths. Fresh refrigerant uniformly spreads within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Features】 ■ Suppresses temperature rise to 40°C for a heat generation of 260W/cm² ■ Microchannel flow paths are arranged across the entire cooling surface ■ Internal structure ensures even distribution of refrigerant across all flow paths ■ Reduces refrigerant volume ■ No need to significantly lower the refrigerant inlet temperature *For more details, please refer to the PDF document or feel free to contact us.

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[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

Fresh refrigerant spreads evenly within the plane! It is possible to reduce temperature unevenness, improve cooling efficiency, and achieve low thermal resistance.

A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources such as CPUs. Many designs utilize a structure called "fins" to release heat into the air or to flow water internally to absorb heat. Our company designs, manufactures, and sells water-cooled heat sinks, which we refer to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh coolant to evenly distribute across the surface, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Structure】 ■ Matrix structure ■ Distribution flow path ■ Microchannel flow paths arranged across the entire cooling surface ■ Internal structure that evenly distributes coolant to all flow paths *For more details, please refer to the PDF materials or feel free to contact us.

  • Other environmental equipment
  • Heat exchanger

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

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Low thermal expansion, high thermal conductivity, heat sink.

Low thermal expansion, high thermal conductivity, heat sink.

The optimal heat sink requires a balance between thermal expansion rate and conductivity.

Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.

  • Non-ferrous metals
  • Other semiconductors
  • diode

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices equipped with aluminum extrusion.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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