Feature! Laser Micromachining: Processing Holes in Glass
Special Feature! Laser Microprocessing: Hole Processing in Glass
Our company offers contract processing services for laser fine machining using ultra-short pulse lasers, providing fine hole processing and small hole processing for various materials. Our website features examples of fine hole processing on substrates such as stainless steel (SUS304), titanium (Ti), copper (Cu), nickel (Ni), CFRP, and glass (alkali-free glass, quartz glass), so please take a look. Now, we would like to introduce our glass fine hole processing. We have developed a process for creating through holes of φ50μm in 0.45mm thick quartz glass. Until now, our limit for through hole drilling in glass of similar thickness using ultra-short pulse lasers was around Φ100μm. However, with the new process, we are now able to process smaller diameter long holes. Moving forward, we will continue our development with the aim of accommodating thicker materials and different hole diameters.
- Company：光機械製作所 HIKARI LASER LAB.
- Price：Other
