Joining Technology Product List and Ranking from 35 Manufacturers, Suppliers and Companies

CFRP/CFRTP molding, processing, and joining technology

A comprehensive book that covers a wide range of technologies related to the molding, processing, and joining of CFRP/CFRTP, as well as resin, surface modification, non-destructive testing, and recycling.

Company：S&T出版
Price：10,000 yen-100,000 yen

Technical and Reference Books
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[New Product] Silicon Carbide SiC Hexaloy SA Joining Technology and Mass Production Support

JFC's silicon carbide (SiC) has been enhanced with "Hexaloy SA." We solve problems with joining technology and mass production techniques through mold forming.

Our company has added "Hexalloy SA" to our specialty in silicon carbide. With bonding technology and mass production techniques through mold forming, we have increased our options for problem-solving alongside the conventional SCP series. Silicon carbide is a material that excels in corrosion resistance and has good sliding properties in liquids. We conduct integrated in-house production from raw material formulation to firing, processing, and inspection using our unique technology. 【Hexalloy SA Bonding Technology】 By bonding silicon carbide to itself, it is possible to form internal flow paths and reduce the weight of components through hollowing. Compared to adhesive bonding, it excels in strength, reliability, thermal conductivity, and degassing properties. 【Characteristics of Silicon Carbide】 ● Compared to other fine ceramics, it has a smaller decrease in mechanical strength at high temperatures (over 1000°C) and excellent wear resistance. ● Due to its strong covalent bonding, it is the hardest among fine ceramics, has excellent corrosion resistance, and good sliding properties in liquids. ● Suitable for mechanical seals and bearings for chemical pumps. *For detailed property values, please refer to the catalog.

Company：JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
Price：Other

Fine Ceramics
Other machine elements
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High airtightness joining technology "Airtight Projection Welding"

A challenge to reduce CO2 emissions through welding technology.

It is a projection welding technology with high airtightness (patent pending). It can be applied to the joining of pressure piping and is proposed as an alternative technology to conventional brazing. The key points of the alternative proposal include cost reduction through shortened takt time due to instant welding, as well as simultaneous reduction of CO2 emissions since high-temperature brazing is not required. It has already been delivered to multiple automobile manufacturers and is a highly reliable technology.

Company：セイエン
Price：Other

Engine parts
Fuel system parts
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Examples of production: complex structure jigs, hollow heat sinks, metal filtration filters.

Method for manufacturing bottom bushes of direct blow molds or neck bushes of two-axis stretch blow molds! Joining technology that does not require welding or adhesion: [Diffusion Bonding].

We will introduce examples of production using diffusion bonding, including complex structure jigs, hollow heat sinks, and metal filtration filters. With diffusion bonding, it is possible to create molds with flow paths that could not be made using traditional mold manufacturing methods such as "cutting" or "casting." In particular, by incorporating precise flow paths within the mold that maximize cooling efficiency, production efficiency can be dramatically improved, resulting in a significant reduction in manufacturing costs. By stacking and bonding laminated materials, we can provide innovative molds that are more rational and have higher production efficiency without being constrained by manufacturing process limitations. 【Features】 ■ Creation of molds with cooling flow paths is possible using diffusion bonding ■ Significant reduction in manufacturing costs is achievable ■ Provision of more rational and highly efficient innovative molds ■ Capable of handling large sizes up to 1000 mm x 1000 mm *For more details, please refer to the PDF document or feel free to contact us.

Company：ヤマテック
Price：Other

Mold Design
Other molds
Contract manufacturing
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Electric Diffusion Bonding Technology "ELEBON"

Utilizing resistance heating that generates heat by passing electricity through metal parts! It is possible to join metals and non-ferrous metals.

"ELEBON" is a current diffusion bonding technology that can firmly join metals together. It allows for bonding in a short time frame of several seconds to a few minutes. No filler materials such as solder are required. We also offer a "Bonding Prototype Package" for those considering whether current diffusion bonding can be applied, as well as for first-time customers. For more details, please contact us. 【Features】 ■ Firmly bonds metals together ■ Short bonding time (several seconds to a few minutes) ■ No filler materials such as solder required ■ Capable of bonding different materials and shapes ■ Achieves high strength, high precision, and high efficiency *For more details, please refer to the PDF materials or feel free to contact us.

Company：ECO-A
Price：Other

Processing Contract
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Laser-based dissimilar metal joining technology

Composite of high-performance materials 'Multi-Material' - Proposing fusion bonding technology between different metals.

Joining technologies that replace bolt, rivet, and clinch fastening Main benefits: ■ Weight reduction ■ Reduction in the number of parts ■ Reduction in manufacturing hours ■ Flexibility for new designs ■ Local reinforcement, non-magnetic, biocompatibility, corrosion resistance, hardening, etc. *For more details, please refer to the catalog or feel free to contact us.

Company：キャステム
Price：Other

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Metal and resin bonding technology without using adhesives! TRI SYSTEM

Design can be achieved without shape constraints! Introducing a metal and resin bonding technology that firmly joins metal and resin without the use of adhesives, demonstrating excellent sealing properties.

The "TRI SYSTEM" is a technology that firmly bonds metal and resin without the use of adhesives, demonstrating excellent sealing properties. It is widely adopted by customers in the smartphone manufacturing industry for integrating metal appearance and lightweight resin during mold forming. ■ History of TRI Technology Mass Production September 2014 - Present: Application of TRI System by major Japanese manufacturers November 2015 - Present: Application of TRI System by major South Korean manufacturers September 2017 - Present: Numerous applications of TRI System by major Chinese manufacturers September 2018 - Present: Application of TRI System by Vietnamese manufacturers We have extensive mass production experience and know-how in bonding technology, enabling us to accommodate various technical requirements. When forcibly peeled apart, the bonding strength is so powerful that the structure of the resin remains intact. Additionally, since the metal and resin are uniformly bonded, it is possible to create a high airtight state. The ability to bond even complex shapes allows for design without constraints. 【Features】 ■ Strong bonding strength ■ High sealing performance ■ Adaptable to complex shapes ■ Excellent reliability ■ High applicability for mass production *For more details, please refer to the PDF document or feel free to contact us.

Company：GEO Nation
Price：Other

Contract manufacturing
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Introduction to Processing Technology

Introducing our technologies, such as "solid-state bonding technology" for stud connections that leave no traces on thin plates!

This is an introduction to the processing technologies conducted by Akashi Machinery Co., Ltd. The "solid-state joining technology" enables stud joining of aluminum plates with a thickness of 0.6mm without any indentation, which is considered difficult with welding. In addition, we excel in "deep drawing technology" for difficult-to-process materials such as stainless steel and titanium, as well as "aluminum impact forming technology," which allows for the creation of deep-drawn products in a single process. As a metal processing manufacturer, we produce metal products used in industrial equipment and more. Please feel free to contact us for any challenges or concerns you may have. 【Technologies】 ■ Solid-state joining technology ■ Deep drawing technology ■ Aluminum precision forging technology ■ Aluminum impact forming technology *For more details, please refer to the PDF materials or feel free to contact us.

Company：曙機械本社・工場
Price：Other

Processing Contract
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Rivet joining technology

Change some of the all-cutting parts to pressed or machined parts to utilize metal pressure deformation for joining!

Our company possesses joining technology that utilizes the riveting method to combine parts of split all-cut components to manufacture processed products. This results in significant reductions in material costs and processing time, while achieving high precision and maintaining high quality. 【Benefits】 ■ Low cost ■ High precision ■ High strength ■ Energy saving ■ Resource saving ■ Waste reduction *For more details, please download the PDF or contact us.

Company：共進
Price：Other

Processing Contract
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New bonding technology for resin and metal.

Achieving strong connections through chemical etching with Amalfa processing! Introduction of new bonding technology.

We introduce a new bonding technology for resin and metal that does not require adhesives or fastening components. By bonding resin and metal at the interface level, it becomes possible to create parts with new designs and functions that maximize the characteristics of both materials. Additionally, due to the physical bonding utilizing surface roughening treatment, bonding can be achieved with almost all types of resin. 【Features】 ■ No adhesives or fastening components required ■ Prototypes can be made from just one piece ■ Compatible with a wide range of materials such as copper and SUS ■ Material processing test support ■ Strong connections achieved through chemical etching with Amalpha treatment *For more details, please refer to the PDF document or feel free to contact us.

Company：さくらGS 横浜工場
Price：Other

Processing Contract
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SUNAOYA Co., Ltd.

Next-generation multi-material bonding using molecular bonding technology.

Molecular bonding technology is a technique that firmly bonds materials together using "chemical bonds" instead of adhesives (intermolecular forces). It enables the joining of materials that were traditionally difficult to bond. Moreover, this bonding offers high strength and high reliability, expanding the possibilities for next-generation manufacturing. *SUNAOYA is a technology trading company that owns and supports the development of molecular bonding technology from the Iou Chemical Research Institute.

Company：公益財団法人名古屋産業振興公社名古屋国際見本市委員会
Price：Other

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New curing technology for carbon fiber and welding joining technology.

Development of mass production systems through automation and robotics! It will be possible to solve issues.

Carbon fiber used in automotive body materials and applications requiring hardness typically involves a method where epoxy resin is coated onto non-baked carbon fiber, followed by the application of heat to promote resin exchange. Our company has developed a high-speed baking processing technology that is more than several dozen times faster than conventional baking processing machines. We believe that establishing a mass production system through automated robotics will enable us to solve existing issues. Additionally, welding of carbon fiber has become possible through a special welding fixture developed by our company, which is expected to expand the use of carbon fiber across a wide range of applications. 【Features】 ■ Maintains strength superior to conventional methods and allows for weight reduction of over 1/10 (compared to our own products) ■ No corrosion whatsoever ■ Creates a safe working environment with no spray dissolution ■ Significant reduction in total work processes and costs (specification of colors, reduction and simplification of painting equipment, shortening of painting processes and processing times, simplification of storage management for painted parts and products) *For more details, please refer to the PDF document or feel free to contact us.

Company：吉川塩ビ工業所
Price：Other

fiber
Other services
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We propose joining methods suitable for each product, such as infrared, ultrasonic, and vibration welding.

The development power to realize "This is what I wanted!" Introducing the manufacturing technology that supports Yamato Manufacturing.

Our company has a variety of joining technologies and can propose suitable joining methods for each product. We have three joining technologies: "Infrared welding," which joins resins using heat and pressure from infrared; "Vibration welding," which joins resins by rubbing them together to generate frictional heat; and "Ultrasonic welding," which applies pressure while transmitting ultrasonic vibrations to melt and join the joint area. Additionally, we have various manufacturing technologies, including injection molding and various filter products. 【Main Production Equipment (Excerpt)】 ■ Injection molding machines 75t–550t: 18 units ■ Filter paper folding machines: 2 units ■ Vibration welding machines (Branson): 2 units ■ Infrared welding machines: 1 unit ■ Ultrasonic welding machines 3600W: 3 units *For more details, please download the PDF or feel free to contact us.

Company：ヤマト製作所本社、本社工場、第2工場、第3工場、組立工場
Price：Other

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Presentation of joining technology data: Ultra-thin bonding layers enable dissimilar material bonding and laminated bonding!

Semicon Japan 2025: Achieving over 10 MPa in shear tensile strength! Enables the joining of dissimilar materials such as metals, resins, and ceramics necessary for improving heat dissipation characteristics!

【Exhibition Information】 We will be showcasing "CAM bonding capable of joining dissimilar materials" at SEMICON Japan 2025. ■ Dates: December 17-19, 2025 ■ Booth: Chubu Pavilion / E4141 Our company conducts trial processing, develops specialized CAM agents, and engages in process development using CAM bonding technology. This bonding technology combines chemical bonding and fusion. It is environmentally friendly, easy to apply, and cost-effective. A CAM agent is applied and dried on the metal surface to form an organic film, and the workpieces are bonded together through thermal pressing. You can read detailed technical documents that describe the specific features and functions. 【Examples of Bondable Materials】 ■ Metals: Aluminum, Copper, Steel, Titanium ■ Resins: Nylon, PBT, CFRP ■ Ceramics: Alumina, Glass ■ Zero thermal resistance is also possible.

Company：輝創輝創株式会社
Price：Other

Processing Contract
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Precision joining technology for balloon components

Introducing precision joining technology for balloon components, including seamless joints and multiple assemblies!

Our company understands the complexities involved in products that require intricate assembly and possesses the expertise necessary to maintain high quality. By supporting the research and development team with structural design and various specifications, we achieve early market entry for products and strengthen competitiveness. We have a process for seamlessly joining FPC and balloon components, assembling multiple balloons, and improving FPC strength. 【Features】 ■ Seamless joining of FPC and balloon components ■ Assembly of multiple balloons ■ Process for improving FPC strength *For more details, please refer to the PDF document or feel free to contact us.

Company：Diagsensor
Price：Other

Assembly Machine
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Introduction of Exhibiting Companies at Robot Festa Fukushima 2025

Taisei Plus Co., Ltd.

Introducing NMT, a technology for joining metals and resins. It integrates various metals and resins.

Company：福島県次世代産業課
Price：Other

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High integration and low-temperature bonding technology in MEMS processes

~Anodic bonding, thin film metal bonding, hermetic packaging, vacuum sealing~

★How can we achieve a balance between cost and reliability for the practical application and competitiveness of MEMS!? ★A thorough explanation of the know-how for wafer-level packaging, which will be a key technology!! 【Lecture Summary】 Wafer-level packaging has become a key technology for the practical application and competitiveness of MEMS. In this lecture, we will explain the entire scope of MEMS wafer-level packaging, from key points to know-how, using abundant real-world examples.

Company：AndTech
Price：10,000 yen-100,000 yen

Technical Seminar
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Adhesive-free joining technology for metals and resins "TRI SYSTEM"

The bonding film created by surface treatment of metals achieves a strong bond with resin. It can be applied to complex shapes, significantly increasing design flexibility.

The "TRI SYSTEM" is a technology that firmly joins metals and resins without using adhesives. It is adopted in fields that require high sealing performance, bonding strength, and mass production, such as smartphones and lithium-ion batteries. Additionally, because the metal and resin are uniformly bonded, it is possible to create a high airtight state. It can also bond complex shapes, greatly enhancing design flexibility. 【Features】 ■ Metals and resins are uniformly bonded, creating a high airtight state. ■ The bonded areas after mold injection molding ensure high reliability in subsequent processes (NC processing, anodizing, etc.). ■ The lifespan of the TRI film after TRI treatment is one month, allowing for stock production. ■ Bonding tests for recycled resins and aluminum are also possible. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：GEO Nation
Price：Other

Contract manufacturing
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Joining Technology Product List and Ranking from 35 Manufacturers, Suppliers and Companies | IPROS GMS

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