Polyimide laminate (750μm)
Thickness 750μm, tensile strength 170MPa! Excellent heat resistance due to being adhesive-free.
This product is a laminated board made by laminating and thermally bonding a polyimide film that has been activated on its surface through plasma treatment. It has a thickness of 750μm and is available in the size of 360×360×0.75mm. It excels in heat resistance due to the absence of adhesives. Please feel free to contact us if you have any inquiries. 【Specifications】 ■Thickness: 750μm ■Tensile Strength: 170MPa ■Bending Strength: 120MPa ■Volume Resistivity: 1×10^15Ω·cm ■Surface Resistance: 1×10^14Ω ■Heat Resistance Temperature: Continuous 200℃ / Short-term 400℃ *For more details, please refer to the related links or feel free to contact us.
- Company:ハギテック 本社工場
- Price:Other