Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 01, 2026～Apr 28, 2026
This ranking is based on the number of page views on our site.
61～67 item / All 67 items
Mass production micro ball mounter compatible with up to 12-inch wafers.
This machine is a wafer ball mounter equipped with flux printing and ball mounting functions. With its unique non-contact ball mounting method, it can stably mount micro balls on the wafer without causing damage. It can also accommodate even smaller balls!!
For 5.25-inch bays, integrated chassis/front bezel! Model number change of "HDM-07B".
The "HDM-07C" is a mount for converting a 5-inch bay into a 3.5-inch open bay. It features a flush mounting type, allowing the front of the 3.5-inch device and the front bezel to align, creating a unified and tidy appearance. It can accommodate I/O front panels, card readers, FDDs, and more. 【Specifications】 ■ For 5.25-inch bays ■ Integrated chassis/front bezel ■ Size: W148.3×D139×H42.65mm ■ Material: Plastic ■ Color: Black ■ Compliant with RoHS Directive (10 substances) *For more details, please download the PDF or feel free to contact us.
Concave fixed type! Use it by aligning a 3.5-inch device with the back of the front bezel.
The "HDM-08C-BK" is a mount for converting a 5-inch bay into a 3.5-inch open bay. It is a recessed fixed type. It is used by aligning a 3.5-inch device with the back of the front bezel, allowing the 3.5-inch device to sit deeper due to the thickness of the bezel. It can accommodate FDDs, MO drives, card readers, and more. A recess is provided at the lower right of the opening for easy access to the eject button. 【Specifications】 ■ Metal chassis ■ Plastic bezel ■ Color: Black ■ Accessories: 8 mounting screws ■ Compliant with RoHS Directive (10 substances) *For more details, please download the PDF or feel free to contact us.
For left alignment, wiring is easy in mixed environments with 3.5-inch HDDs! This is a model change of "HDM-27A."
The "HDM-27B" is a conversion mount that allows you to install one 2.5-inch SSD/HDD in a single 3.5-inch bay. Being an integrated mount, it can be securely fixed more easily compared to products that require combining multiple parts. The screw holes for bay fixation have the same spacing as the front two or back two holes of a 3.5-inch HDD. By matching the internal black-painted case, it creates a calm atmosphere. 【Specifications】 ■ For 3.5-inch bays ■ Size: W101.5×D100×H11.55mm ■ Material: Aluminum ■ Color: Black ■ Accessories: 8 fixing screws ■ Compliant with RoHS Directive (10 substances) *For more details, please download the PDF or feel free to contact us.
The color of the mount is black! It is inconspicuous, making it suitable for illuminated PCs and cases with internal black paint.
The "HDM-29B" is a conversion mount that allows you to install one 2.5-inch SSD/HDD in a single 3.5-inch bay. As it is an integrated mount, it can be securely fixed more easily compared to products that combine multiple parts. The screw holes for bay fixation have the same hole spacing/inch as a 3.5-inch HDD. (Both side and bottom) This ensures high compatibility with cases that use dedicated fixtures like rails or bottom fixation. 【Specifications】 ■ Size: W101.5×D120×H15mm ■ Material: Metal ■ Color: Black ■ Compliant with RoHS Directive (10 substances) *For more details, please download the PDF or feel free to contact us.
Introducing the ERS dicing peripheral equipment that can attach wafers to tape without bubbles.
The "SMM-100" is a semi-automatic tape mounter that accurately adheres wafers and dicing tape to a tape frame. The table can be heated to ensure the appropriate temperature is applied to the wafer. It is equipped with an ionizer to prevent tape static. Additionally, as an option, rings other than the specified tape frame can be accommodated by exchanging the set plate. 【Features】 ■ The table can be heated to ensure the appropriate temperature is applied to the wafer. ■ Equipped with an ionizer to prevent tape static. ■ The application of tape and wafers is performed automatically at the set speed. ■ The thickness adjustment of the wafer can be set by raising or lowering the table height. ■ Bonding of IC substrates (fully molded) is also possible. *For detailed information or product catalogs, please access the related link.
Implementation machine equipped with an automatic feeder exchange system.
The "NXTR A model" is a mounting machine equipped with a smart loader that enhances functionality to maintain high quality and productivity, while freeing operators from setup changes and material replenishment tasks. By adopting dedicated feeders and base buffers, the number of components that can be mounted has been significantly increased. In combination with the smart loader, it supports a wider variety of production operations. Additionally, depending on the production variety, the number of robots in the modules and the types of heads to be mounted can be freely selected, achieving optimal production equipment. 【Features】 ■ Automatic feeder exchange ■ Abundant component mounting ■ Head replacement possible with one action ■ Appropriate module configuration according to production needs ■ Minimum investment on a module basis *For more details, please download the PDF or feel free to contact us.
