We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Mounting Technology.
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Mounting Technology Product List and Ranking from 12 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Mounting Technology Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 三幸電機 Aichi//Industrial Electrical Equipment
  2. 光山電気工業 拡販推進 Gunma//Industrial Electrical Equipment
  3. 函館電子 Hokkaido//Electronic Components and Semiconductors
  4. 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 新潟精密 Niigata//Industrial Electrical Equipment
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Mounting Technology Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. [EMS Implementation Technology] 0603 Size Chip Component Mounting Technology 三幸電機
  2. "Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology 函館電子
  3. High-reliability mounting technology for electrical equipment 沖電気工業 産業営業本部　産業営業統括室
  4. COB implementation technology 光山電気工業 拡販推進
  5. Kanda Industrial Co., Ltd. SMT Business 神田工業

Mounting Technology Product List

16～20 item / All 20 items

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Notice of Participation in Japan Manufacturing World

Notice of Participation in Japan Manufacturing World

We will exhibit at the 34th Design and Manufacturing Solutions Expo. We will showcase our technologies related to manufacturing that we have developed at Sony.

We will introduce our technology that addresses your concerns related to product design, manufacturing, and other aspects of manufacturing, as well as help realize your ideas of "I want to try this." If you have time, please visit our booth. 【Exhibition Information】 - Exhibition Name: Japan Manufacturing World 34th Design & Manufacturing Solutions Expo - Dates: June 22, 2022 (Wednesday) to June 24, 2022 (Friday) - Opening Hours: 10:00 AM to 6:00 PM (Ends at 5:00 PM only on June 24) - Venue: Tokyo Big Sight - Booth Number: 14-31 - Official Website: https://www.japan-mfg.jp/ja-jp.html 【Main Exhibition Contents】 - Element technologies to realize "I want to create this product" - Design capabilities that give you a "step" ahead of competitors - Implementation technologies that support the miniaturization and weight reduction of Sony products - Sony-quality manufacturing that can also accommodate medical devices - Custom power supplies/chargers tailored to a wide variety of needs You can check the list of manufacturing services available for download in PDF format.

  • Other contract services
  • Contract manufacturing

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!

**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.

  • Technical Seminar
  • LED Module
  • LED lighting

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Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Trends in transparent resin: resin with phosphors! Low-stress resin! High refractive index! New manufacturing methods (multi-wavelength tandem, MCM, organic LED).

Speaker: Mr. Gen Murakami, President of Mototen Co., Ltd., Doctor of Engineering Venue: Tekno Kawasaki, 5th Floor, Room 5 Date and Time: March 29, 2011 (Tuesday) 12:30-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Implementation and packaging technology of MEMS devices and improvement of reliability.

Implementation and packaging technology of MEMS devices and improvement of reliability.

★How to enhance reliability in terms of joint distortion and joint strength!? ★Increase reliability through semiconductor integration!

Speaker Part 1: Toshiba Corporation, Research and Development Center, Advanced BEOL Technology Development Department, Responsible Person Part 2: Misuzu Industries Co., Ltd., Responsible Person Part 3: Koga Research Institute Sensor Consultant / Part-time Lecturer at Ibaraki University / Industry-Academia-Government Collaboration Coordinator, Ph.D. Tomo Shimada Target Audience: Engineers and researchers related to MEMS devices and microfabrication processes Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1 [Tokyo, Nihonbashi] Access: 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the JR Toei Asakusa Line, towards Asakusabashi/ Oshiage Date and Time: December 22, 2011 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 51,450 yen (including tax and text fee) for 2 people from one company *Limited to Tech-Zone members who apply by December 8. Membership registration is free. *After December 8, the [Regular Price] will be 54,600 yen (including tax and text fee) for 2 people from one company.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

The heat dissipation and heat resistance of components required due to the increase in large currents!

- Sealing, Bonding, Mounting Technology, Reliability Evaluation - High-Power Devices: the Advanced Materials and the Mounting Technology ★ The heat dissipation and heat resistance required for components due to increased current! ★ The demand for inverters is rising with the energy-saving of devices and the spread of EVs and HEVs. What are the future technological trends of power devices, which are the core technology!? 【Venue】 Kawasaki City International Exchange Center, Conference Room 1【Kanagawa, Kawasaki】 12 minutes on foot from Motosumiyoshi Station on the Tokyu Toyoko Line Date and Time June 27, 2013 (Thursday) 10:15-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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