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Resin(100) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
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Resin Product List

241～255 item / All 278 items

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests for the electrical property modification of composite olefin resins.

Olefin resins, which are non-polar plastics made only from carbon and hydrogen, are represented by polyethylene (PE) and polypropylene (PP). Both are produced in large quantities as materials through addition polymerization and are used in various molded products that benefit our daily lives. PE is adjusted for density and undergoes stretching treatment in post-processing to change its crystallinity for different applications; generally, it is soft and commonly known for low-temperature injection molded products and packaging films. In contrast, PP, with a melting point of 165°C and a density of 0.9, has high crystallinity and excellent chemical resistance. It is not only tough enough to withstand prolonged use at temperatures above 100°C under pressure but also produces a wide variety of durable products, ranging from injection molded items like large containers to extruded functional films and bags for various industries, as well as hollow molded products like bottles. For more details, please contact us or refer to our catalog.

  • Static electricity eliminator

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

  • Other polymer materials

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300℃ High Heat Resistant Resin TE-2107

300℃ High Heat Resistant Resin TE-2107

It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Printed Circuit Board
  • Other electronic parts

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Impregnating sealant "5100"

Impregnating sealant "5100"

Seal the gaps inside the electric wires and wire harnesses. A new sealing method to replace O-rings and potting.

"5100" is a sealant suitable for sealing gaps inside electric wires, wire harnesses, and similar applications. It maintains flexibility even after curing, making it suitable for sealing gaps in molded parts of connectors and sensors. Have you ever experienced oil or humid air leaking through gaps inside a wire harness? Or have you encountered situations where the insulation was damaged during use, allowing water to enter? In such scenarios, our impregnating liquid "5100" demonstrates high reliability. Additionally, "5100" retains high flexibility even after curing. Due to the differences in thermal expansion coefficients between resin and metal molded products, gaps can significantly shift when subjected to thermal shock. Even in such cases, "5100" moves with the shifting gaps, helping to minimize their occurrence. 【Basic Properties】 ■Material Acrylic resin ■Heat Resistance -40℃ to 150℃ 【Target Materials】 ■Fluoropolymer wires ■Cross-linked polyethylene wires ■Super engineering plastics such as PPS and PEEK ■Engineering plastics such as PA6, PA66, POM, and PBT

  • Other cable related products

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Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Beginners

8. Characteristics of Polyamide Amine Curing Agents 9. Others 10. Amine Curing Agents Applicable to Various Uses of Epoxy Resins 10-1 Lining 10-2 Coatings 10-3 Reinforcement for Civil Engineering and Construction Structures 10-4 Adhesives 10-5 Electrical Insulation Materials 10-6 Tooling 11. Q&A on Epoxy Curing Agents Q1: Estimated Demand for Curing Agents for Epoxy Resins by Application Q2: Estimated Demand for Epoxy Resin Curing Agents Q3: Selection Method for Curing Agents by Performance Q3-1 Adhesives Q3-2 Chemical Resistance Q3-3 Heat Resistance Q3-4 Electrical Insulation Q3-5 Heat Resistance Q3-6 Moisture and Water Resistance Q3-7 Flexibility Q3-8 Impact Resistance Q4: Causes of Various Troubles Q4-1 Causes of Insufficient Curing Q4-2 Method for Determining Insufficiently Cured Areas Q4-3 Causes of Bubble Formation Q4-4 Causes of Resin Cracking After (or During) Curing Q4-5 Causes of Delamination After (or During) Curing 12. Examples of Epoxy Resin Performance: Photos

  • glue
  • plastic
  • Technical Seminar

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Water-absorbing resin "Aqua Keep"

Water-absorbing resin "Aqua Keep"

A resin that absorbs 1000 times its own weight in water! It is used in diapers, various hygiene products, and industrial products.

"Aqua Keep" is a highly absorbent resin that our company has been researching and developing for many years. By adding meticulous design tailored to user requirements to a resin that absorbs water up to 1000 times its own weight, we have incorporated various functions. Utilizing this functionality, it is used in products such as disposable diapers, various hygiene products, and industrial products, receiving high quality evaluations from users. [Features] - A resin that absorbs water up to 1000 times its own weight - Various functions added through meticulous design tailored to user requirements - High quality evaluations from users - Produced in Japan, Singapore, France, and South Korea, and used worldwide *For more details, please refer to the related link page or feel free to contact us.

  • Other polymer materials

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

  • Other polymer materials
  • glue
  • Other electronic parts

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Development of next-generation glass alternative materials and their optical properties, impact resistance, application examples, EU standards.

Development of next-generation glass alternative materials and their optical properties, impact resistance, application examples, EU standards.

Now, let's explain the necessary optical properties and impact resistance, as well as future goals, based on examples of developments!

★Automotive windows, residential windows, transparent resins for tablets and smartphones, etc. Glass alternative materials are expected to see significant demand growth in the future! ☆A representative from a company dealing with typical glass alternative resins (PC, PMMA, COP) will explain the current required optical properties, impact resistance, and future targets based on market development examples! ★Transparency, refractive index, solar heat gain coefficient, ultraviolet absorption/shielding rate, impact resistance, etc.! 【Venue】 Tokyo Chuo Ward Industrial Hall 4F, Meeting Room 2 【Tokyo, Chuo Ward】 Date and Time July 23, 2013 (Tuesday) 11:00-16:00

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Basics and synthesis of epoxy resin hardeners, and improvement of heat resistance, moisture resistance, and impact resistance.

Basics and synthesis of epoxy resin hardeners, and improvement of heat resistance, moisture resistance, and impact resistance.

A one-day seminar to master heat resistance, moisture resistance, impact resistance, and curing speed to meet the required characteristics of sealing materials, adhesives, electronic substrates, and composite materials.

【Lecturers】 1. Shigeki Inatomi, Technical Advisor (Former Asahi Kasei Fellow), Asahi Kasei Corporation 2. Yoshio Tanioka, Team Leader, Structural Materials Section, Electrical Structural Materials Department, Nagase ChemteX Corporation 3. Masahiko Yamanaka, Group Leader, Senior Researcher, Research and Development Division, Shin Nippon Rika Co., Ltd. 4. Masaki Yoshii, Chief Researcher, Semiconductor Materials Division, Hitachi Chemical Company, Ltd. 【Venue】Industrial Promotion Hall, Room 2【Kawasaki Station, Kanagawa】 【Date and Time】November 25, 2010 (Thursday) 10:00 AM - 4:30 PM 【Capacity】30 people *Registration will close once full. Please apply early.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Low viscosity UV-curable resin TRU-0201K

Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

  • Other polymer materials
  • Coating Agent

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Miolex suitable for use as insulation plates for molding machines and molds [machining].

Miolex suitable for use as insulation plates for molding machines and molds [machining].

Thickness tolerance of ±0.01 is possible! A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep rate (%): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) in a temperature-controlled environment using numerous machine tools, 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
  • Other polymer materials

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Coloring agent for urethane resin "ZA Color"

Coloring agent for urethane resin "ZA Color"

Widely usable! Unlike plasticizer-based colorants, there is no impact on physical properties such as bleeding.

"ZA Color" is a paste-like coloring agent that uses a polyether polyol as a toner base and disperses various pigments at a high concentration. The molecular weight of the toner base is 2000, and the OH value is 56. It has excellent long-term storage stability, and the pigments selected do not have issues with weather resistance. It can be widely used as a coloring agent for urethane-based flooring materials, waterproofing materials, and foamed products. 【Features】 ■ Easy to mix into the resin, providing excellent workability ■ Excellent long-term storage stability ■ No impact on physical properties such as bleeding compared to plasticizer-based coloring agents ■ Pigments selected do not have issues with weather resistance ■ Custom color matching is also possible upon request *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

  • Other polymer materials

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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Other electronic parts
  • glue

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