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Resin(5v) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
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Resin Product List

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[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3

Room temperature curing × High thermal conductivity 3.3W/mK × Flexibility! An epoxy resin suitable for stress relief. Ideal for gap filler applications, flame retardant equivalent to V-0.

The TE-7172K3 is a two-component, room-temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It can cure at 25°C without the need for heating equipment, making it energy-efficient and adaptable to flexible production processes. Its most notable feature is its high thermal conductivity of 3.3 W/m·K, which is effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb stress and prevent cracking in substrates and modules. The cured material exhibits balanced properties with a glass transition temperature of -20°C, a coefficient of linear expansion of 24 ppm/K, and a Shore D hardness of 45, combining heat resistance and flexibility. Moreover, it has flame retardant properties (equivalent to UL94 V-0 at 5mm thickness), making it safe for use in electronic devices that require safety. This improved version enhances heat resistance and toughness while inheriting the features of the conventional TE-7172K2. Applications include gap fillers, heat dissipation insulation materials, and encapsulation of electronic components where stress relief is required.

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[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

This is a two-component, room temperature curing epoxy resin for new product development. It has high thermal conductivity and flexibility. [Property table available]

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6408FRK

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6408FRK

Room temperature curing × high transparency × flame retardant equivalent to V-0 epoxy resin. Flexibility enhancement to suppress cracking! A new proposal for room temperature curing epoxy.

"TE-6408FRK" is a room temperature curing two-component epoxy resin, suitable for coating and adhesive applications. It can cure at 25°C, eliminating the need for heating equipment, allowing for energy-efficient and effective work. A major feature of this product is its flexible cured material. It demonstrates over 90% transparency (420-600nm transmission), making it suitable for applications that require high aesthetic quality. Additionally, it possesses flame retardancy (equivalent to UL94 V-0 at 5mm thickness), contributing to safety assurance. It can be widely used for coating electronic components, bonding plastics and metals, and clear applications that require aesthetic appeal. [Features] - Two-component room temperature curing epoxy resin (mixing ratio 100:30) - Flexible cured material (tensile elongation of 230%, crack prevention effect) - High transparency (over 90% transmission at 420-600nm) - Low viscosity and good workability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if you need them.

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Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-6430

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-6430

Room temperature curing type × high thermal conductivity 2.4W/mK! A two-component epoxy resin with excellent heat dissipation insulation. Suitable for thermal management of motors, coils, and sensors.

"TE-6430" is a two-component, room-temperature curing epoxy resin (hard type) developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to its ability to cure at room temperature, and it remains low in viscosity after mixing, making it easy to handle. This product has a thermal conductivity of 2.4 W/m·K, making it effective for heat dissipation measures for electronic components that generate heat. Additionally, it possesses flame retardancy equivalent to UL94 V-0 (5mm thickness), allowing for safe use in applications where safety is a concern. 【Features】 ■ Two-component, room-temperature curing epoxy resin (hard type) ■ High thermal conductivity: 2.4 W/m·K ■ Flame retardancy: UL94 V-0 equivalent (5mm thickness) ■ Good workability with low viscosity after mixing ■ High insulation and low water absorption improve the reliability of electronic devices *For more details, we have published the product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

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PC GF20% Black

PC GF20% Black

Filled with fiberglass, improving mechanical strength. Can also be used as a flame-retardant material.

"PC GF20% Black" is a polycarbonate resin filled with glass fiber, which enhances mechanical strength such as bending strength. It also has high flame retardancy (V-0/1.5mm) and is a light-blocking grade, similar to unfilled PC black. It is suitable for impellers, fins, housing covers, and metal alternative parts. 【Features】 ■ GF20% filled polycarbonate resin ■ Improved mechanical strength compared to standard PC grade ■ V-0 flame retardancy ■ High light-blocking performance *Please feel free to contact us for more details about the material.

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High-performance spherical phenolic resin "LPS-V"

High-performance spherical phenolic resin "LPS-V"

It is a spherical phenolic resin with good fluidity and high filling capability.

The spherical phenolic resin "LPS Series" is a spherical form of the oldest type of thermosetting resin, phenolic resin, created through a special method. It allows for particle size control ranging from an average diameter of 5μm to 500μm. There are reactive uncured types, thermally insoluble cured types, and intermediate semi-cured types. Its spherical shape provides excellent flowability. 【Features】 - Spherical shape with good flowability, enabling high filling capacity - Carbon fibers fixed inside and on the surface of the spheres, allowing for the production of carbides in their original shape - High purity with no ash content For more details, please contact us or download the catalog.

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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HyperCel STAR AX Ion Exchange Resin

HyperCel STAR AX Ion Exchange Resin

Advanced salt-resistant anion exchange chromatography resin boasting excellent recovery capability.

HyperCel STAR AX is a salt-tolerant anion exchange resin designed for bioprocessing. ■ High DBC (dynamic binding capacity) with a short residence time (less than 2 minutes) ■ Direct capture of proteins or removal of impurities from undiluted feedstock at moderate to high conductivity ■ Excellent selectivity across a wide range of conductivity ■ Rapid processing, improved economic efficiency of the process

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[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-7170K

Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-7170K

Room temperature curing × high thermal conductivity × flexibility! An epoxy resin suitable for stress relief. Low viscosity and good workability, equivalent to UL94 V-0.

The "TE-7170K" is a two-component, room temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It cures at 25°C without the need for heating equipment, making it energy-efficient and easy to handle on-site. This product has a thermal conductivity of 0.9 W/m·K, making it effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb and alleviate stress, helping to suppress the occurrence of cracks in substrates and components. It is suitable for applications that require high reliability. With a low viscosity design of 3,500 mPa·s (25°C), it excels in filling details and provides a sufficient working time of approximately 3 hours. 【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:20) ■ Effective for heat dissipation measures with a thermal conductivity of 0.9 W/m·K ■ Flexible design that effectively alleviates stress and prevents cracking ■ Good workability with low viscosity and approximately 3 hours of usable time *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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Heating and Pressurizing Automatic Embedding Machine "Simple Met 4000"

Heating and Pressurizing Automatic Embedding Machine "Simple Met 4000"

Introducing a heating and pressure automatic embedding machine with high durability that can accommodate two units even in a small space!

The "Simple Met 4000" is a heating and pressurizing automatic embedding machine with dimensions W311×D662×H498mm (524mm when the door is open). The noise level reaches a maximum of 62db at a distance of 1 meter from the front of the machine during the up and down movement of the ram associated with the opening of the mold closure. Please feel free to contact us if you have any inquiries. 【Features】 ■ Increased productivity (high durability) ■ Time reduction (short embedding cycle) ■ Space-saving (can accommodate two units in a narrow space) ■ Comes with mold assembly *For more details, please refer to the PDF document or feel free to contact us.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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General-purpose potting resin TE-6302 low viscosity/high strength product

General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

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Single-component heat-curing epoxy resin for home appliances TE-7901K

Single-component heat-curing epoxy resin for home appliances TE-7901K

One-liquid type × high thermal conductivity! Contributes to improving the durability of home appliances.

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-6420FR

Room temperature curing × high heat resistance × flame retardant V-0 equivalent! Epoxy resin for sealing electrical and electronic components. No heating equipment required! Contributes to energy savings with room temperature curing type.

"TE-6420FR" is a two-component, room temperature curing epoxy resin developed for the encapsulation of electrical and electronic components. It does not require heating equipment and can cure at 25°C, achieving an energy-efficient and effective working environment. This product features a low viscosity design with a mixing viscosity of approximately 2,000 mPa·s (25°C), allowing excellent filling capability for intricate details and accommodating complex component shapes and filler-less encapsulation. The curing conditions can be flexibly selected as 25°C for 6 hours, 40°C for 3 hours, or 50°C for 1 hour. 【Features】 - Room temperature curing type (no heating operation required, caution with heat generation), efficient short curing time - Low viscosity design suitable for precise filling - High heat resistance: Tg 126°C - Flame retardant: UL94 V-0 equivalent (5mm thickness) - High insulation: Volume resistivity > 1×10^15 Ω·cm *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

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Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Two-component room temperature curing epoxy resin TE-6430 for electronic devices

Room temperature curing type × high thermal conductivity! Epoxy resin excellent in heat dissipation insulation.

In the electronics industry, as products become smaller and more high-performance, achieving both insulation and heat dissipation has become an important challenge. In particular, electronic components with high-density mounting tend to generate heat, and insulation failure can lead to product malfunctions. TE-6430 achieves both high thermal conductivity and excellent insulation, contributing to the reliability of electronic devices. 【Usage Scenarios】 - Insulation and heat dissipation measures for motors, coils, and sensors - Protection and insulation of electronic components - Component mounting on circuit boards 【Benefits of Implementation】 - Increased longevity of electronic devices - Improved product reliability - Enhanced design flexibility

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Nylon fixative (fixation treatment for acid dyes)

Nylon fixative (fixation treatment for acid dyes)

Our "water-soluble phenolic resin" strongly bonds and adheres to nylon fibers and acidic dyes.

As an example of the applications of our water-soluble phenolic resin, we would like to introduce the "Nylon Fixing Agent." Our water-soluble phenolic resin is a resol resin made from dihydroxydiphenylsulfone (DHDPS) and phenolsulfonic acid. DHDPS has an electron-withdrawing sulfonyl group at its center, which gives it a much stronger hydrogen bonding capability at both ends compared to ordinary compounds like phenol, cresol, or tannic acid, allowing it to form strong hydrogen bonds with the azo groups of acidic dyes. By utilizing the ionic bonding strength between the terminal amino groups of nylon fibers and the sulfonic acid groups of the water-soluble phenolic resin, as well as the hydrogen bonding strength between the azo groups of acidic dyes and the hydroxyl groups of the water-soluble phenolic resin, the dye is fixed onto the fibers. *For more details, please refer to the PDF document or feel free to contact us.*

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Two-component room temperature curing epoxy resin TE-6430 for automotive use

Two-component room temperature curing epoxy resin TE-6430 for automotive use

Room temperature curing type × high thermal conductivity! Contributing to the bonding of automotive parts.

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. This is particularly important in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, where the performance of adhesives is critical. Improper adhesion can lead to component detachment or malfunction, potentially resulting in serious accidents. TE-6430, with its high thermal conductivity and flame retardancy, contributes to enhancing safety and reliability in the adhesion of automotive parts. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - Improved heat dissipation due to high thermal conductivity - Enhanced safety due to flame retardancy - Improved workability due to low viscosity

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TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

TE-7901K High Reliability Heat Dissipation Epoxy Resin for Electronic Devices

One-liquid type × High thermal conductivity 6.5W/mK! Contributes to the reliability improvement of electronic devices.

In the electronics industry, thermal management is crucial to ensure the long-term reliability of products. Particularly for electronic components used in high-temperature environments or under heavy loads, heat dissipation performance becomes a key factor that influences product lifespan. If appropriate heat dissipation measures are not implemented, overheating of components can lead to performance degradation or failure, potentially compromising the overall reliability of the product. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, contributing to the improvement of electronic device reliability. 【Application Scenarios】 - Sealing of electronic components that generate heat, such as motors, coils, and power devices - Electronic devices used in high-temperature environments - Electronic devices where reliability is essential 【Benefits of Implementation】 - Suppression of component overheating, extending product lifespan - Improvement of product reliability - Assurance of stable quality

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