Technical Documentation on Solder Resist Formation for Game Consoles
Presented is a document summarizing the specifications for heat dissipation measures for game consoles!
In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become crucial. In particular, to handle high thermal density within limited space, the selection of appropriate solder resist is essential. Inappropriate solder resist can hinder heat conduction, potentially leading to decreased product performance or failure. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are useful for product selection. 【Application Scenarios】 - Circuit board design for high-performance gaming consoles - Selection of circuit boards requiring heat dissipation measures - Design of compact and high-density mounted circuit boards 【Benefits of Implementation】 - Improved heat dissipation through appropriate solder resist selection - Enhanced product reliability - Reduction in design workload
- Company:プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
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