Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
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Particles in photoresist solution and SOG can be measured from 0.1 μm.
High counting efficiency 0 Measurement of particle count in 0.1μm photoresist solution and SOG Robust support system with domestic manufacturing and maintenance!
Particles of 0.15μm can be measured from photoresist solutions and SOG, etc.
Liquid Particle Counter KS-41A Measures particles from 0.15μm in photoresist solutions and SOG Robust support system with domestic manufacturing and maintenance
![[Proposal for the Semiconductor Field] Surface Inspection Equipment and Resist](https://image.mono.ipros.com/public/product/image/3e2/2001051139/IPROS77522177597453788506.png?w=280&h=280)
We will propose solutions in the semiconductor field, which we specialize in, tailored to our customers' needs!
In addition to our expertise in nano-order surface analysis equipment, we also propose resist solutions and maskless exposure devices for semiconductor processes.
Formation of resist by electrophoretic method
It is a negative-type photoresist solution. The resist is formed using an electrophoretic method.
Introducing the design and implementation perspective on "applying solder adhesion prevention to unnecessary areas"!
"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.
![[Analysis Case] Structural Analysis of Positive-Type Photoresist](https://image.mono.ipros.com/public/product/image/626/2000351678/IPROS6157569533070954827.jpg?w=280&h=280)
Structural analysis of photosensitizers is possible using thermal decomposition GC/MS method.
Positive-type photoresists are widely used as photolithography materials in semiconductor device manufacturing. The materials used in the resist vary significantly depending on the exposure light source, but for g-line and i-line resists, phenolic novolak resin is generally used as the base resin, and naphthoquinone diazide compounds are used as the photosensitizer. This case study introduces an example where naphthoquinone diazide compounds were decomposed using thermal decomposition GC/MS method to estimate the structure of the parent nucleus.
A detailed explanation of the old yet new "Novolak resin," which is still widely used.
Semiconductors and liquid crystal devices are manufactured by repeating the lithography process multiple times. During these dozens of repetitions, the need for cutting-edge fine patterns is limited to a few processes, such as the gate process, while the majority uses thicker line width patterns. Novolak resist is used for these thick patterns. Of course, depending on the device, chemical amplification resist for KrF (248 nm) may also be used here. Therefore, in semiconductor devices, while not all processes use thick line widths, novolak resist is still used, and in considerable amounts. Additionally, in emerging countries like China, semiconductor device manufacturing involves producing older generation devices, where novolak resist is naturally used. Furthermore, in liquid crystal manufacturing, novolak resist is used in all processes (5 processes). There seem to be device manufacturers that use 4 processes due to the use of halftone masks. The introduction of chemical amplification resist, which is high sensitivity and high resolution, is also being considered, but practical application has not been achieved due to the significantly larger substrate sizes compared to semiconductors and the difficulty in controlling the usage environment.
Electrodeposition process of negative-type photoresist to achieve high-precision plating areas.
The Erecote EU-XC process is a photoresist electrophoretic process that achieves high-precision partial plating on uneven surfaces and three-dimensional shapes. This electrophoretic resist has excellent chemical resistance and can be used as a resist for silver cyanide plating, as well as for gold plating and copper sulfate plating. It features excellent edge coverage and achieves high-precision developability. It is a negative-type electrophoretic photoresist that enables precise partial plating and can also be used as an etching resist.
Electron beam lithography equipment, EUV exposure equipment, nanoimprint lithography applications. Two types available: powder and solution!
AQM's H-SiOx is a negative-type resist available in both powder and solution forms. It offers performance comparable to Dow XR-154 and FOX. Each form has its own characteristics. 【Powder】 Long-term storage possible: Can be stored for up to one year, allowing for gradual use over an extended period. Immediate availability: Can be obtained quickly when needed. Consistent viscosity: Does not thicken as it is mixed before use. Adjustable concentration: Capable of creating a wide range of film thicknesses tailored to applications. Highest level of line width: Achieves a line width of 7nm. 【Liquid】 Available for purchase in small quantities: Can be tailored to the required amount. Short delivery time: Delivery can be made within one month after order. Made to order: Can be delivered with a longer shelf life. Highest level of line width: Achieves a line width of 7nm. For inquiries, please contact our representative, Kitano.
Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.
3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies such as MENS devices, techniques for processing complex and delicate patterns in three-dimensional structures are required. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.
High aspect ratio resist
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To achieve high-precision metal patterns, high-resolution photoresists with excellent adhesion and meltability are being researched and developed. For more details, please download the catalog or contact us.
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Flame-retardant flexible substrate thermosetting solder resist
This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.
Ideal for various optical lens processing such as aspheric and Fresnel lenses, as well as fine, precise, and high-quality processing like roll processing.
This is an introduction to "Accubite Resist" handled by Micro Diamond Corporation.
If you want to learn about photoresists, which are essential for semiconductor manufacturing, please take a look!
Our company manufactures and sells electrodeposited resist, but many of our customers are not familiar with photoresist itself. Therefore, we believed there was a need for a basic knowledge page and have created one on photoresist. Some of you may have thought about the following: What exactly is photoresist? I don't really understand the difference between negative and positive types... I can't form a concrete image... If you have such questions, please feel free to download our catalog!! Additionally, we also accept technical inquiries regarding electrodeposited resist, so please contact us through the inquiry form.
![[Developed Product] Negative Type Anionic Electrophoretic Photoresist](https://image.mono.ipros.com/public/product/image/7c6/2001425387/IPROS60122774361252602580.png?w=280&h=280)
It is a negative-type anion electrostatic photoresist!
Since it is an anionic electrophoretic negative-type photoresist, the developer and stripping solution will be alkaline. The developer and stripping solution are not specialized products.
![[Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics](https://image.mono.ipros.com/public/product/image/2a8/2001535271/IPROS17545468171226721677.jpg?w=280&h=280)
What is the role of solder resist? Introducing its importance, types, and characteristics! / Leave the design, development, and manufacturing of printed circuit boards to Nippo! /
Solder resist is an ink or film-like protective material applied to the surface of printed circuit boards (PCBs) that serves to protect the circuits on the substrate. During the soldering process, there is a risk of short circuits due to solder bridges, but the presence of solder resist prevents shorts between circuits, thereby enhancing the reliability of the product. It also effectively protects the substrate from moisture and chemicals, contributing to corrosion prevention. There are two types of solder resist: "liquid type" and "film type." < Liquid Type > This type involves applying ink-like material using screen printing or spraying, making it suitable for complex-shaped substrates. Many products contain components with high heat resistance and chemical resistance tailored to specific applications, characterized by flexibility during the assembly process. < Film Type > The film type involves adhering sheet-like resist to the substrate and curing it with UV light. It allows for uniform and high-precision application, making it suitable for fine patterns and high-density substrates. A benefit is that there are fewer processes using release agents, resulting in a clean finish. Nippo conducts the design, development, and manufacturing of printed circuit boards. Please feel free to contact us.
Excellent adhesion to various metals and glass! Natural rubber-based etching resist photosensitive liquid.
The "Photoresist for Etching Nameplates and Similar Applications" is a resist that can be etched with acid or alkali, primarily composed of cyclized rubber. It has good adhesion to various metals and is suitable as an etching resist for various nameplates and plaques. Additionally, we offer developers, diluents, and thin film solutions as auxiliary agents. We have both oil-based and water-based types primarily composed of PVA. 【Features】 ■ Transparent ■ Low tackiness ■ Short exposure time ■ Excellent as an electroplating resist ■ Strong resistance to acids and alkalis *For more details, please refer to the PDF document or feel free to contact us.
In the developing room, surface leveling, dust removal with a roller, followed by coating and preliminary drying will be carried out!
Our company performs "resist" processing using equipment in the production line. Using a horizontal continuous double-sided spray coater, liquid resist ink is coated by scanning along an axis perpendicular to the transport direction with an air atomization spray. After applying to the surface, the substrate is automatically flipped to coat the reverse side as well. Additionally, during the pre-drying process, solvents in the resist ink are removed. 【Process】 ■ Surface leveling ■ Debris removal roller ■ Coating ■ Pre-drying *For more details, please refer to the PDF document or feel free to contact us.
Specifications such as terminal size, clearance, and solder mask thickness are included!
In the automotive industry, the reliability of electronic substrates is extremely important. Products that can withstand harsh environments are required, and the proper selection and formation of solder resist are essential for maintaining the long-term performance of the products. Improper design or formation of solder resist can lead to failures caused by vibration and temperature changes. Our materials on solder resist formation technology contribute to improving the reliability of electronic substrates for automotive applications. 【Usage Scenarios】 - In-vehicle electronic devices - ECU (Electronic Control Unit) - Various sensors 【Effects of Implementation】 - Improved substrate quality - Increased product lifespan - Reduced risk of failure
Presented is a document summarizing the specifications for heat dissipation measures for game consoles!
In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become crucial. In particular, to handle high thermal density within limited space, the selection of appropriate solder resist is essential. Inappropriate solder resist can hinder heat conduction, potentially leading to decreased product performance or failure. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are useful for product selection. 【Application Scenarios】 - Circuit board design for high-performance gaming consoles - Selection of circuit boards requiring heat dissipation measures - Design of compact and high-density mounted circuit boards 【Benefits of Implementation】 - Improved heat dissipation through appropriate solder resist selection - Enhanced product reliability - Reduction in design workload
![[Research Document] Global Market for Patterning Materials](https://image.mono.ipros.com/public/product/image/8f2/2001476562/IPROS01207571865170748609.jpeg?w=280&h=280)
World Market for Patterning Materials: 193NM Immersion Resist, Positive 193 NM Dry Resist, Positive 248 N ...
This research report (Global Patterning Materials Market) investigates and analyzes the current state and outlook for the global patterning materials market over the next five years. It includes information on the overview of the global patterning materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the patterning materials market include 193NM immersion resist, positive 193 NM dry resist, positive 248 NM resist, I-Line/G-Line resist, and others. The segments by application include automotive sensors, DRAM, glass printed circuit boards, MEMS & NEMS devices, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of patterning materials. The report also includes the market share of major companies in patterning materials, product and business overviews, and sales performance.
We are offering materials that will assist in the design of high-precision industrial robot circuit boards!
In the industrial robot industry, the reliability of the circuit board is crucial for achieving high-precision movements. Particularly in circuit boards related to positioning and control, the accuracy of the solder resist significantly impacts the robot's performance. Defects in the solder resist can lead to malfunctions or failures, potentially resulting in decreased production efficiency. Our materials on solder resist formation technology include specifications such as terminal size, clearance, solder mask thickness, and surface treatment, which are helpful in product selection. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Robot hands performing delicate tasks - Industrial robots used in harsh environments 【Benefits of Implementation】 - Improved robot performance through optimized circuit board design - Reduced risk of failure by achieving reliable circuit boards - Shortened product selection time
We present materials that include specifications such as terminal size, clearance, and solder mask thickness!
In the aerospace industry, there is a constant demand for lightweight products. In the design of printed circuit boards, solder resist significantly impacts component mounting density and reliability, making proper selection crucial. The selection of solder resist contributes to product miniaturization and weight reduction. Our materials on solder resist formation technology can help address these challenges. 【Application Scenarios】 - Electronics for aircraft and spacecraft - Circuit board designs requiring weight reduction - High-density mounting circuit boards 【Benefits of Implementation】 - Optimization of circuit board design - Weight reduction of products - Improved reliability
We present materials that are helpful for high-density smartphone circuit board design!
In the smartphone industry, high-density mounting of printed circuit boards is required due to miniaturization and increased functionality. It is particularly important to enhance the component placement density within limited space and ensure the reliability of electrical connections. Proper design of solder resist is essential for solving these challenges. Our materials on solder resist formation technology support the optimization of design for high-density mounting. 【Usage Scenarios】 - Design of high-density mounting boards - Optimization of component placement - Improvement of electrical connection reliability 【Effects of Implementation】 - Increased efficiency in board design - Miniaturization and high performance of products - Improved yield
Specifications such as terminal size, clearance, and solder mask thickness are listed.
In the IoT device industry, high durability that can withstand harsh environments is required. Especially for devices exposed to temperature changes, vibrations, and humidity, the reliability of printed circuit boards is a crucial factor that influences product lifespan. The proper selection and formation of solder resist are essential to protect the substrate from these external factors and ensure the long-term operation of the device. Our materials on solder resist formation technology will be helpful when selecting products. 【Usage Scenarios】 - Outdoor IoT devices - Industrial IoT equipment - IoT devices used in harsh environments 【Benefits of Implementation】 - Improved substrate protection performance - Enhanced product reliability - Assurance of long-term product lifespan
Presentation of technical materials on solder resist technology that contributes to server acceleration.
In the server industry, there is a demand for improved data processing speeds and stability in signal transmission. Particularly, as high-density implementation progresses, the precision of solder resist becomes crucial. Inadequate solder resist can lead to signal interference and short circuits on the substrate, potentially resulting in a decline in server performance. Our materials on solder resist formation technology include specifications such as terminal size, clearance, and solder mask thickness, which are helpful in product selection. 【Usage Scenarios】 - Servers performing high-speed data communication - Servers using high-density implementation substrates - Servers where signal integrity is critical 【Benefits of Implementation】 - Stabilization of signal transmission - Improved reliability of the substrate - Reduction in product selection time
Specifications such as terminal size, clearance, and solder mask thickness are listed.
In the telecommunications infrastructure industry, particularly in the field of signal integrity, the reliability of printed circuit boards is crucial. To ensure accurate signal transmission, precision in component placement on the board is required. Proper design and formation of solder resist prevent short circuits and disconnections, contributing to the long-term stability of the product. Our materials on solder resist formation technology are helpful during product selection. 【Usage Scenarios】 - PCB design for communication devices - Protection of signal transmission paths - Shielding of high-frequency circuits 【Benefits of Implementation】 - Improved board reliability - Increased product lifespan - Stabilization of signal quality
