Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 45 items
Particles in photoresist solution and SOG can be measured from 0.1 μm.
High counting efficiency 0 Measurement of particle count in 0.1μm photoresist solution and SOG Robust support system with domestic manufacturing and maintenance!
Particles of 0.15μm can be measured from photoresist solutions and SOG, etc.
Liquid Particle Counter KS-41A Measures particles from 0.15μm in photoresist solutions and SOG Robust support system with domestic manufacturing and maintenance
![[Proposal for the Semiconductor Field] Surface Inspection Equipment and Resist](https://image.mono.ipros.com/public/product/image/3e2/2001051139/IPROS77522177597453788506.png?w=280&h=280)
We will propose solutions in the semiconductor field, which we specialize in, tailored to our customers' needs!
In addition to our expertise in nano-order surface analysis equipment, we also propose resist solutions and maskless exposure devices for semiconductor processes.
Formation of resist by electrophoretic method
It is a negative-type photoresist solution. The resist is formed using an electrophoretic method.
Introducing the design and implementation perspective on "applying solder adhesion prevention to unnecessary areas"!
"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.
A detailed explanation of the old yet new "Novolak resin," which is still widely used.
Semiconductors and liquid crystal devices are manufactured by repeating the lithography process multiple times. During these dozens of repetitions, the need for cutting-edge fine patterns is limited to a few processes, such as the gate process, while the majority uses thicker line width patterns. Novolak resist is used for these thick patterns. Of course, depending on the device, chemical amplification resist for KrF (248 nm) may also be used here. Therefore, in semiconductor devices, while not all processes use thick line widths, novolak resist is still used, and in considerable amounts. Additionally, in emerging countries like China, semiconductor device manufacturing involves producing older generation devices, where novolak resist is naturally used. Furthermore, in liquid crystal manufacturing, novolak resist is used in all processes (5 processes). There seem to be device manufacturers that use 4 processes due to the use of halftone masks. The introduction of chemical amplification resist, which is high sensitivity and high resolution, is also being considered, but practical application has not been achieved due to the significantly larger substrate sizes compared to semiconductors and the difficulty in controlling the usage environment.
Electrodeposition process of negative-type photoresist to achieve high-precision plating areas.
The Erecote EU-XC process is a photoresist electrophoretic process that achieves high-precision partial plating on uneven surfaces and three-dimensional shapes. This electrophoretic resist has excellent chemical resistance and can be used as a resist for silver cyanide plating, as well as for gold plating and copper sulfate plating. It features excellent edge coverage and achieves high-precision developability. It is a negative-type electrophoretic photoresist that enables precise partial plating and can also be used as an etching resist.
Electron beam lithography equipment, EUV exposure equipment, nanoimprint lithography applications. Two types available: powder and solution!
AQM's H-SiOx is a negative-type resist available in both powder and solution forms. It offers performance comparable to Dow XR-154 and FOX. Each form has its own characteristics. 【Powder】 Long-term storage possible: Can be stored for up to one year, allowing for gradual use over an extended period. Immediate availability: Can be obtained quickly when needed. Consistent viscosity: Does not thicken as it is mixed before use. Adjustable concentration: Capable of creating a wide range of film thicknesses tailored to applications. Highest level of line width: Achieves a line width of 7nm. 【Liquid】 Available for purchase in small quantities: Can be tailored to the required amount. Short delivery time: Delivery can be made within one month after order. Made to order: Can be delivered with a longer shelf life. Highest level of line width: Achieves a line width of 7nm. For inquiries, please contact our representative, Kitano.
Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.
3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies such as MENS devices, techniques for processing complex and delicate patterns in three-dimensional structures are required. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.
High aspect ratio resist
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To achieve high-precision metal patterns, high-resolution photoresists with excellent adhesion and meltability are being researched and developed. For more details, please download the catalog or contact us.
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Flame-retardant flexible substrate thermosetting solder resist
This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.
Ideal for various optical lens processing such as aspheric and Fresnel lenses, as well as fine, precise, and high-quality processing like roll processing.
This is an introduction to "Accubite Resist" handled by Micro Diamond Corporation.
If you want to learn about photoresists, which are essential for semiconductor manufacturing, please take a look!
Our company manufactures and sells electrodeposited resist, but many of our customers are not familiar with photoresist itself. Therefore, we believed there was a need for a basic knowledge page and have created one on photoresist. Some of you may have thought about the following: What exactly is photoresist? I don't really understand the difference between negative and positive types... I can't form a concrete image... If you have such questions, please feel free to download our catalog!! Additionally, we also accept technical inquiries regarding electrodeposited resist, so please contact us through the inquiry form.
![[Developed Product] Negative Type Anionic Electrophoretic Photoresist](https://image.mono.ipros.com/public/product/image/7c6/2001425387/IPROS60122774361252602580.png?w=280&h=280)
It is a negative-type anion electrostatic photoresist!
Since it is an anionic electrophoretic negative-type photoresist, the developer and stripping solution will be alkaline. The developer and stripping solution are not specialized products.
![[Column] What is the Role of Solder Resist? Introducing Its Importance, Types, and Characteristics](https://image.mono.ipros.com/public/product/image/2a8/2001535271/IPROS17545468171226721677.jpg?w=280&h=280)
What is the role of solder resist? Introducing its importance, types, and characteristics! / Leave the design, development, and manufacturing of printed circuit boards to Nippo! /
Solder resist is an ink or film-like protective material applied to the surface of printed circuit boards (PCBs) that serves to protect the circuits on the substrate. During the soldering process, there is a risk of short circuits due to solder bridges, but the presence of solder resist prevents shorts between circuits, thereby enhancing the reliability of the product. It also effectively protects the substrate from moisture and chemicals, contributing to corrosion prevention. There are two types of solder resist: "liquid type" and "film type." < Liquid Type > This type involves applying ink-like material using screen printing or spraying, making it suitable for complex-shaped substrates. Many products contain components with high heat resistance and chemical resistance tailored to specific applications, characterized by flexibility during the assembly process. < Film Type > The film type involves adhering sheet-like resist to the substrate and curing it with UV light. It allows for uniform and high-precision application, making it suitable for fine patterns and high-density substrates. A benefit is that there are fewer processes using release agents, resulting in a clean finish. Nippo conducts the design, development, and manufacturing of printed circuit boards. Please feel free to contact us.
Excellent adhesion to various metals and glass! Natural rubber-based etching resist photosensitive liquid.
The "Photoresist for Etching Nameplates and Similar Applications" is a resist that can be etched with acid or alkali, primarily composed of cyclized rubber. It has good adhesion to various metals and is suitable as an etching resist for various nameplates and plaques. Additionally, we offer developers, diluents, and thin film solutions as auxiliary agents. We have both oil-based and water-based types primarily composed of PVA. 【Features】 ■ Transparent ■ Low tackiness ■ Short exposure time ■ Excellent as an electroplating resist ■ Strong resistance to acids and alkalis *For more details, please refer to the PDF document or feel free to contact us.
In the developing room, surface leveling, dust removal with a roller, followed by coating and preliminary drying will be carried out!
Our company performs "resist" processing using equipment in the production line. Using a horizontal continuous double-sided spray coater, liquid resist ink is coated by scanning along an axis perpendicular to the transport direction with an air atomization spray. After applying to the surface, the substrate is automatically flipped to coat the reverse side as well. Additionally, during the pre-drying process, solvents in the resist ink are removed. 【Process】 ■ Surface leveling ■ Debris removal roller ■ Coating ■ Pre-drying *For more details, please refer to the PDF document or feel free to contact us.
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
In the semiconductor manufacturing industry, a precise understanding and application of photoresist is essential for the formation of fine circuits. Particularly, the accuracy of circuit patterns is directly linked to the performance of semiconductor devices, making it important to grasp the characteristics and types of photoresist, as well as their roles in the process. Improper selection or use of photoresist can lead to reduced yield and quality issues with products. This page covers everything from the basic concepts of photoresist to the differences between negative and positive types, process images, coating methods, and the features of our electrodeposition resist, addressing any questions related to photoresist. 【Usage Scenarios】 - Circuit patterning in semiconductor manufacturing processes - Acquisition of basic knowledge about photoresist - Consideration of introducing electrodeposition resist 【Benefits of Introduction】 - Deepening understanding of photoresist - Support for appropriate photoresist selection - Streamlining manufacturing processes and improving quality
Basic knowledge of photoresists useful for manufacturing small actuators.
In the field of robotics, particularly in the manufacturing of small actuators, precise circuit formation is required. The technology for accurately transferring fine patterns directly impacts the performance and reliability of actuators. Inappropriate selection or use of photoresist can lead to circuit defects and a decrease in product lifespan. Our collection of basic knowledge on photoresist supports optimal material selection and process design by deepening understanding from the fundamentals of photoresist in response to these challenges. 【Application Scenarios】 - Precise circuit pattern formation for small actuators - Micromachining in semiconductor manufacturing processes - Material evaluation during the research and development phase 【Benefits of Implementation】 - Improved accuracy in circuit formation - Maintenance of product reliability and performance - Increased efficiency in the development process
An explanation of the basic knowledge of photoresist, which is essential for the manufacturing of liquid crystal displays.
In the liquid crystal display industry, a proper understanding and utilization of photoresist is essential for accurately forming fine pixel patterns. Particularly in displays where high definition is advancing, the precision of pattern formation directly impacts product quality. Using photoresist without understanding its characteristics can lead to unintended patterns, potentially resulting in display malfunctions. Our company supports the resolution of your technical challenges through the manufacturing and sales of electrodeposited resist. We provide detailed explanations about the basic knowledge of photoresist in our catalog, so please feel free to download it. 【Usage Scenarios】 - Formation of pixel patterns for liquid crystal displays - Formation of fine circuits 【Benefits of Implementation】 - Achievement of high-precision pattern formation - Improvement in the quality of display products
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
In the LED industry and the formation of light-emitting elements, the creation of fine circuit patterns significantly affects product performance. In particular, the element formation process related to light efficiency and response speed requires precise patterning technology. Inappropriate selection or use of photoresists can lead to reduced yield and failure to achieve the expected performance. This page covers the basics of photoresists, their types, process images, coating methods, and the features of our electrocoated resists, providing information that can help solve technical challenges in LED manufacturing. 【Usage Scenarios】 - Circuit patterning in LED chip manufacturing - Formation of fine light-emitting areas - Processes requiring high-precision pattern transfer 【Benefits of Implementation】 - Acquisition of basic knowledge about photoresists - Promotion of understanding of the LED manufacturing process - Provision of decision-making materials for appropriate photoresist selection
Explaining the basic knowledge of photoresist essential for microstructure processing.
In the micro-machining industry and fine structure processing, high-precision pattern formation is required. In particular, understanding the characteristics of photoresists and their appropriate selection is crucial for precisely creating fine circuits and structures. The use of inappropriate photoresists or errors in the process can lead to a decrease in the accuracy of fine structures and a deterioration in yield. This page covers everything from the basic knowledge of photoresists, their types, process images, coating methods, to the features of our electrodeposition resist, providing information that will help solve technical challenges in micro-machining manufacturing. 【Application Scenarios】 - Design of fine structures for micro-machines - Precision circuit patterning - Semiconductor manufacturing processes - MEMS device manufacturing 【Benefits of Implementation】 - Improvement in the accuracy of fine structure processing - Enhancement of yield - Promotion of understanding of manufacturing processes - Support for appropriate photoresist selection
Basic knowledge of photoresist useful for surface processing of optical lenses.
In the surface processing of optical lenses, precise pattern formation is required. In particular, surface processing that directly affects the functionality and appearance quality of the lens necessitates fine processing accuracy. Inappropriate processing can lead to a decline in lens performance or defects in appearance. This page explains the basic knowledge of photoresists, their types, process images, coating methods, and the features of our electrodeposited resist, contributing to solving challenges in the surface processing of optical lenses. 【Application Scenarios】 - Precise pattern formation for optical lenses - Imparting functionality to lens surfaces - Examination of fine processing technologies 【Effects of Implementation】 - Improvement in processing accuracy - Stabilization of lens quality - Application to new lens designs
Negative-type anionic electrodeposition photoresist contributing to fine structure formation.
In the micro-machining manufacturing industry and fine structure formation, precise patterning is required. In particular, accurately reproducing complex shapes and fine irregularities is essential, as it directly affects the performance and functionality of the products, making advanced technology indispensable. Insufficient patterning can lead to reduced yield and performance issues in products. This product addresses these challenges as a negative-type photoresist for anionic electrodeposition. 【Application Scenarios】 - Precise pattern formation in micro-machining processes - Manufacturing of components with fine structures - Fields requiring high-precision surface processing 【Benefits of Implementation】 - Supports accurate formation of fine structures - Potentially contributes to improved product performance - May enhance the efficiency of development and manufacturing processes
Negative-type anionic electrophoretic photoresist contributing to pixel electrode formation.
In the display manufacturing industry, particularly in pixel electrode formation, fine and uniform patterning is required. High resolution and reproducibility are directly linked to the quality of the display, making the performance of photoresists extremely important. Improper development or stripping can lead to defects and potentially affect product yield. This product addresses these challenges as an anionic electrophoretic negative-type photoresist. 【Application Scenarios】 - Formation of pixel electrodes for display panels - Manufacturing of electronic components requiring fine patterning 【Effects of Implementation】 - Improved patterning accuracy through uniform development and stripping - Applicability to uses that leverage the characteristics of the developed product
For the formation of wiring patterns in printed circuit board manufacturing. Negative-type anionic electrodeposition photoresist.
In the formation of wiring patterns for printed circuit board manufacturing, the creation of fine and precise circuit patterns is required. Particularly, to consistently produce reliable products, the uniform application of photoresist and the certainty of the development and stripping processes are crucial. Inadequate pattern formation can lead to circuit disconnections or shorts, potentially causing a decline in product quality and defects. This product contributes to solving the challenges of wiring pattern formation in printed circuit board manufacturing as a negative-type photoresist for anionic electrodeposition. 【Usage Scenarios】 - Formation of wiring patterns for printed circuit boards - Patterning of fine circuits 【Effects of Implementation】 - Formation of accurate circuit patterns - Improvement in product reliability
Negative-type anion electrodeposition photoresist contributing to the formation of solar cell electrodes.
In the energy sector, particularly in the formation of solar cell electrodes, precise patterning and high reliability are required. High-precision photoresist technology is essential for achieving miniaturization of electrodes and complex structures. Inappropriate resist materials or processes can lead to a decline in electrode performance and an increase in manufacturing costs. Our negative-type anionic electrodeposition photoresist has been developed to address these challenges. 【Application Scenarios】 - Patterning in the formation of solar cell electrodes - Other fields of electronic components requiring precise pattern formation 【Benefits of Implementation】 - High-precision pattern formation in solar cell electrode formation - A product in the development stage, with the potential for adjustments to meet customer needs
It is a printing anti-staining agent that binds to the reactive group of vinyl sulfon (VS) type reactive dyes and inactivates their reactivity.
It is a printing anti-dyeing agent that binds to the reactive group of vinyl sulfon (VS) type reactive dyes and inactivates their reactivity, demonstrating excellent effects in anti-dyeing processing where VS type dyes are used as base dyes and other reactive dyes (MCT, MCP, MFC type dyes) are used as contrast dyes.
Specifications such as terminal size, clearance, and solder mask thickness are included!
In the automotive industry, the reliability of electronic substrates is extremely important. Products that can withstand harsh environments are required, and the proper selection and formation of solder resist are essential for maintaining the long-term performance of the products. Improper design or formation of solder resist can lead to failures caused by vibration and temperature changes. Our materials on solder resist formation technology contribute to improving the reliability of electronic substrates for automotive applications. 【Usage Scenarios】 - In-vehicle electronic devices - ECU (Electronic Control Unit) - Various sensors 【Effects of Implementation】 - Improved substrate quality - Increased product lifespan - Reduced risk of failure
