Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 18 items
Particles in photoresist solution and SOG can be measured from 0.1 μm.
High counting efficiency 0 Measurement of particle count in 0.1μm photoresist solution and SOG Robust support system with domestic manufacturing and maintenance!
Particles of 0.15μm can be measured from photoresist solutions and SOG, etc.
Liquid Particle Counter KS-41A Measures particles from 0.15μm in photoresist solutions and SOG Robust support system with domestic manufacturing and maintenance
![[Proposal for the Semiconductor Field] Surface Inspection Equipment and Resist](https://image.mono.ipros.com/public/product/image/3e2/2001051139/IPROS77522177597453788506.png?w=280&h=280)
We will propose solutions in the semiconductor field, which we specialize in, tailored to our customers' needs!
In addition to our expertise in nano-order surface analysis equipment, we also propose resist solutions and maskless exposure devices for semiconductor processes.
Formation of resist by electrophoretic method
It is a negative-type photoresist solution. The resist is formed using an electrophoretic method.
Introducing the design and implementation perspective on "applying solder adhesion prevention to unnecessary areas"!
"Solder resist" is an insulating film approximately 30μm thick that is applied to the surface of printed circuit boards, and it is often simply referred to as "resist." The colors known are green, blue, red, yellow, black, and white. The prevalence of green is commonly attributed to the fact that patterns are more visible and easier on the eyes of inspectors. One of the purposes of applying this resist is to "prevent solder adhesion to unnecessary areas (to prevent solder from adhering to unintended places)," but this perspective is from the viewpoint of the applicator. In this blog, we introduce "solder resist" from the design and implementation perspective. *For more detailed content of the blog, you can view it through the related links. Please feel free to contact us for more information.
A detailed explanation of the old yet new "Novolak resin," which is still widely used.
Semiconductors and liquid crystal devices are manufactured by repeating the lithography process multiple times. During these dozens of repetitions, the need for cutting-edge fine patterns is limited to a few processes, such as the gate process, while the majority uses thicker line width patterns. Novolak resist is used for these thick patterns. Of course, depending on the device, chemical amplification resist for KrF (248 nm) may also be used here. Therefore, in semiconductor devices, while not all processes use thick line widths, novolak resist is still used, and in considerable amounts. Additionally, in emerging countries like China, semiconductor device manufacturing involves producing older generation devices, where novolak resist is naturally used. Furthermore, in liquid crystal manufacturing, novolak resist is used in all processes (5 processes). There seem to be device manufacturers that use 4 processes due to the use of halftone masks. The introduction of chemical amplification resist, which is high sensitivity and high resolution, is also being considered, but practical application has not been achieved due to the significantly larger substrate sizes compared to semiconductors and the difficulty in controlling the usage environment.
Electrodeposition process of negative-type photoresist to achieve high-precision plating areas.
The Erecote EU-XC process is a photoresist electrophoretic process that achieves high-precision partial plating on uneven surfaces and three-dimensional shapes. This electrophoretic resist has excellent chemical resistance and can be used as a resist for silver cyanide plating, as well as for gold plating and copper sulfate plating. It features excellent edge coverage and achieves high-precision developability. It is a negative-type electrophoretic photoresist that enables precise partial plating and can also be used as an etching resist.
Electron beam lithography equipment, EUV exposure equipment, nanoimprint lithography applications. Two types available: powder and solution!
AQM's H-SiOx is a negative-type resist available in both powder and solution forms. It offers performance comparable to Dow XR-154 and FOX. Each form has its own characteristics. 【Powder】 Long-term storage possible: Can be stored for up to one year, allowing for gradual use over an extended period. Immediate availability: Can be obtained quickly when needed. Consistent viscosity: Does not thicken as it is mixed before use. Adjustable concentration: Capable of creating a wide range of film thicknesses tailored to applications. Highest level of line width: Achieves a line width of 7nm. 【Liquid】 Available for purchase in small quantities: Can be tailored to the required amount. Short delivery time: Delivery can be made within one month after order. Made to order: Can be delivered with a longer shelf life. Highest level of line width: Achieves a line width of 7nm. For inquiries, please contact our representative, Kitano.
Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.
3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies such as MENS devices, techniques for processing complex and delicate patterns in three-dimensional structures are required. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.
High aspect ratio resist
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To achieve high-precision metal patterns, high-resolution photoresists with excellent adhesion and meltability are being researched and developed. For more details, please download the catalog or contact us.
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to greater design freedom, and eliminates the need for coverlay, enabling significant thinning and weight reduction of the entire substrate. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High flexibility that does not produce cracks even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly applied ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Flame-retardant flexible substrate thermosetting solder resist
This is a thermosetting printing ink used for FPC substrates. It excels in flame resistance, chemical resistance, and electrical insulation, maintaining high reliability. 【Features】 ◆ Single-component, halogen-free, and formaldehyde-free compliant ◆ Curing conditions: 130°C for 10 minutes ◆ 100/100 ◆ Surface hardness: HB ◆ Shelf life: 6 months (refrigerated at 10°C or below) *For more details, please inquire via request for materials or download.
Ideal for various optical lens processing such as aspheric and Fresnel lenses, as well as fine, precise, and high-quality processing like roll processing.
This is an introduction to "Accubite Resist" handled by Micro Diamond Corporation.
If you want to learn about photoresists, which are essential for semiconductor manufacturing, please take a look!
Our company manufactures and sells electrodeposited resist, but many of our customers are not familiar with photoresist itself. Therefore, we believed there was a need for a basic knowledge page and have created one on photoresist. Some of you may have thought about the following: What exactly is photoresist? I don't really understand the difference between negative and positive types... I can't form a concrete image... If you have such questions, please feel free to download our catalog!! Additionally, we also accept technical inquiries regarding electrodeposited resist, so please contact us through the inquiry form.
In the developing room, surface leveling, dust removal with a roller, followed by coating and preliminary drying will be carried out!
Our company performs "resist" processing using equipment in the production line. Using a horizontal continuous double-sided spray coater, liquid resist ink is coated by scanning along an axis perpendicular to the transport direction with an air atomization spray. After applying to the surface, the substrate is automatically flipped to coat the reverse side as well. Additionally, during the pre-drying process, solvents in the resist ink are removed. 【Process】 ■ Surface leveling ■ Debris removal roller ■ Coating ■ Pre-drying *For more details, please refer to the PDF document or feel free to contact us.
