We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Substrate×サトーセン - List of Manufacturers, Suppliers, Companies and Products

Substrate Product List

16～20 item / All 20 items

Displayed results
Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical Introduction: "Implementation Technology"

Technical Introduction: "Implementation Technology"

Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.

At Sato-Sen Co., Ltd., we are implementing pattern designs that are easy to assemble at the design stage as a measure to improve yield in general printed circuit board assembly. Additionally, to enhance yield in flip chip assembly, we are forming dams using film solder resist, which is effective in preventing solder shorts at C4 and ensuring package parallelism. [Factors Contributing to Poor Solder Wetting] - The increase in alloy layers with lead-free solder, and the presence of black pads due to the nickel layer in flash gold plating are considered potential causes. ⇒ In lead-free solder, managing the composition and temperature of the solder bath is crucial. ⇒ For flash gold plating, proper management of the pre-treatment and nickel bath solution is essential. For more details, please contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical Introduction: "Magnetic Reduction Technology"

Technical Introduction: "Magnetic Reduction Technology"

Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.

At Sato-Sen Co., Ltd., we can propose methods to reduce magnetism with flash gold plating. It is possible to reduce magnetism by selecting the appropriate nickel plating solution. Additionally, we also offer special gold plating to completely eliminate magnetism. 【Advantages of Sato-Sen Co., Ltd.】 ○ Development and production system ○ Experience and know-how ○ Advanced equipment ○ Collaborative capabilities Please contact us for more details.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Substrate

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.