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Substrate×サトーセン - List of Manufacturers, Suppliers, Companies and Products

Substrate Product List

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COB for optical communication

COB for optical communication

We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. 【Features】 ○ Excellent high-frequency characteristics Optimal material selection, layer composition, and L/S can be determined through simulation, allowing for high consistency in control. ○ High-precision contour processing High-precision CCD processing can be performed to match the position of the patterns. ○ Highly reliable surface treatment Reliable plating processes for electrolytic and electroless wire bonding with gold and Ni/Pd/Au are available. *Detailed information such as "specifications" is available in the catalog. *For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Technical Introduction: "High-Frequency Technology"

Technical Introduction: "High-Frequency Technology"

Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.

At Sato-Sen Co., Ltd., we can achieve the desired impedance matching and noise reduction through circuit design for high frequency, material selection, layer configuration, and impedance simulation based on patterns. Furthermore, we provide quality assurance with impedance measurement substrates. We also have design simulation capabilities for high frequency and a long history of mass production in the gigahertz range. 【Features】 - We offer substrates that match the impedance of mounted components and the board, which is required due to the increasing speed of transmission signals. - Using our in-house simulation software, we provide high-frequency printed circuit boards that meet your satisfaction through optimal material selection, layer configuration, and circuit design. → High-precision impedance control is possible due to our extensive database. - Impedance measurement can be conducted using our measurement equipment (TDR) with test coupons. → Compatible with Z0±7%, and prototypes can be made with ±5%. Please contact us for more details.

  • Printed Circuit Board

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Printed Circuit Boards for LEDs Achieving High Brightness and High Heat Dissipation

Printed Circuit Boards for LEDs Achieving High Brightness and High Heat Dissipation

High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. We offer a lineup that includes "high heat dissipation metal printed circuit boards," "high brightness and high heat dissipation reflector printed circuit boards," "high heat dissipation multilayer printed circuit boards," and "high heat dissipation thick copper printed circuit boards." [Required Technical Elements] - We propose high-reflective solder resist and reflector processing techniques to achieve high brightness. - We offer high reflection rate Au and Ag plating techniques unique to companies that have emerged from plating. - For heat dissipation technology, we propose heat dissipation CEM3 and heat dissipation FR4 starting from metal printed circuit boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Package printed circuit board (PCB) / Chip-on-Board (COB)

Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

  • Printed Circuit Board

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Package printed circuit board

Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

  • Printed Circuit Board

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High thermal conductivity printed circuit board

High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Frequently Asked Questions about Printed Circuit Boards

Frequently Asked Questions about Printed Circuit Boards

Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.

At Sato-sen Co., Ltd., we provide high-quality printed circuit boards that meet the increasing demands for high functionality and high precision. We offer solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Here are some frequently asked questions regarding printed circuit boards: 【Production Related】 - Design: Supports DXF, DWG, and COB++, compatible with OrCAD Capture and BSchl. - Delivery Time: Can accommodate short delivery courses and can also shorten delivery times after ordering. - Quantity: Capable of producing even a single board. - Cost: Can reduce initial costs as we can handle everything from prototypes to mass production. - UL: UL compliant as we are a UL certified factory. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Introducing circuit formation technology! A method to improve the positional accuracy of patterns on both sides.

Sato-sen Co., Ltd. offers multilayer printed circuit boards with high density, IVH, BVH, and buildup, providing design flexibility. We ensure improved hole position accuracy with ultra-high-speed micro-diameter drill machines, high-density circuit formation (L/S = 30/30) using LDI (Laser Direct Imaging), and stable quality multilayer printed circuit boards through X-ray reference hole drilling and X-ray length measurement. 【Features】 - Flat plugs (pad on via) allow for mounting on through holes. - Landless through holes enable support for narrow pitch patterns. - CCD technology enhances the precision of pressing, routing, and V-cut to match the pattern position (±75). - Ultra-fine printing is possible (1 character measuring 0.28mm vertically x 0.15mm horizontally). Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Introducing bonding silver plating technology! Electroless silver plating is possible.

Sato-sen Co., Ltd. is capable of performing silver plating that can be deposited without electrolysis. We offer optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, which can reduce discoloration due to thermal degradation during assembly and use. We provide reflector processing for high brightness and optimal surface treatment for LED wavelengths. We also propose various heat dissipation measures to lower the junction temperature of the chips. 【Features】 - Outline processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation is possible with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.

At Sato-Sen Co., Ltd., we offer integrated rigid-flex printed circuit boards that utilize flexible substrates for multilayer boards, enabling miniaturization and cost reduction, including assembly. By adopting rigid-flex technology, we can reduce the number of printed circuit boards, leading to smaller finished products, and eliminate the soldering process for flexible printed circuit boards, thereby reducing assembly space. This also helps to minimize noise caused by antenna effects in flexible sections and reflections at connection points, as seen in traditional designs. **Features of Miniaturization with Rigid-Flex Printed Circuit Boards:** - Pins are inserted into through-holes and soldered, enhancing strength. - The flexible connection between rigid boards is embedded in the inner layers, providing noise prevention benefits. - Flexible materials are incorporated into the inner layers, eliminating the need for soldering and streamlining the process. For more details, please contact us.

  • Printed Circuit Board

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Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Introducing dust prevention technology for printed circuit boards! There are mass production results for optical systems thanks to dust collection technology.

At Sato-Sen Co., Ltd., we generally recommend dust-free router processing for the outer shape processing of optical devices that are sensitive to dust. Sato-Sen Co., Ltd. has a proven track record in mass production for optical systems through the optimization of router programs and dust collection technology during and after processing. 【Dust Prevention Technology】 - High-precision punching equipment and mold processing - Special mold heat treatment and surface treatment - High-precision assembly technology ⇒ Achieving finishes that closely rival traditional press molds with router processing. For more details, please contact us.

  • Printed Circuit Board

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Paper substrate *Circuit formed with silver paste

Paper substrate *Circuit formed with silver paste

Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!

We would like to introduce the "Paper Substrate" handled by Sato-Sen Co., Ltd. It uses a special paper with high heat resistance and can be bent/folded. The line spacing is 200/200, and circuits are formed using silver paste. It offers good cost performance and is suitable for disposable applications. Please feel free to contact us when you need it. 【Features】 - Uses a special paper with high heat resistance - Can be bent/folded - Line spacing is 200/200 - Circuits are formed using silver paste - Good cost performance *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Paper and pulp products

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Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

  • Printed Circuit Board

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board

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