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Substrate×OKIサーキットテクノロジー - List of Manufacturers, Suppliers, Companies and Products

Substrate Product List

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Support for flex-rigid structures

Support for flex-rigid structures

Creating many benefits with flex-rigid integration! Possible multilayer structure of the flex layer.

We would like to introduce our support for flex-rigid structures. We can accommodate orders starting from just one piece, with a minimum turnaround time of 5 days from data receipt to shipment. This also helps reduce mold costs through router processing. Our connector-less design allows for compact and high-density solutions, making it ideal for reducing cable connection errors and wiring labor. 【Features】 ■ Miniaturization ■ High density ■ High reliability ■ Possible multilayer structure for flexible layers ■ Use of liquid crystal polymer materials for flexible layers *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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OKI Circuit Technology Simulation Case Studies

OKI Circuit Technology Simulation Case Studies

Introducing two examples! Measures from troubleshooting for stable operation of various high-speed transmission circuit boards.

We would like to introduce our simulation case studies. In the case study titled "Provision of PCBs with Stable Operation for Various High-Speed Transmissions," we provide designs that operate from the perspective of design and manufacturing. This includes optimization of transmission line characteristics and verification of margins against standards. In the case study titled "Proposals for Countermeasures from Troubleshooting," we reproduced actual device malfunctions and clarified the mechanisms, demonstrating that DDR4 did not operate at the expected data rate through simulations that considered actual power and ground. [Case Overview: Provision of PCBs with Stable Operation for Various High-Speed Transmissions] ■ We provide designs that operate from the perspective of design and manufacturing. ■ Implementation details: - Optimization of transmission line characteristics: Impedance matching including vias and pads. - Verification of margins against standards: Selection and proposal of substrate and via structures. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-frequency compatible printed circuit board

High-frequency compatible printed circuit board

A printed circuit board that balances performance and cost! Correlated high-precision transmission line modeling.

We support the development of high-frequency substrates from materials, processes, and design. High-precision transmission line modeling correlated with in-house manufactured substrates. We can provide materials, treatments, and processes tailored to your applications. We offer printed circuit boards that balance performance and cost in a one-stop solution, so please feel free to contact us with your requests. 【Features】 ■ Manufacturing process compatible with high frequency - We propose suitable materials from the perspective of performance and cost - Improvement of characteristics through high-precision back drilling - 20% reduction in loss at 14GHz with changes to solder resist only ■ Support for chemically bonded surface treatments *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Custom and special-purpose printed circuit boards

Custom and special-purpose printed circuit boards

Based on high-speed, high-multilayer substrate manufacturing technology! Capable of meeting various requests.

We would like to introduce our "Custom and Special Purpose Printed Circuit Boards." Based on high-speed, high-multilayer board manufacturing technology, we can meet various demands for rigid boards. We possess high-precision simulation technology, plating technology, lamination and drilling technology, and patterning technology. 【Features】 ■ High Speed ■ High Multilayer ■ High Density *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Inner layer resistance printed circuit board

Inner layer resistance printed circuit board

Expose and form a resistive film on part of the inner layer circuit! The set resistance value can be calculated using a formula.

We would like to introduce our "Inner Layer Resistance Printed Circuit Board." The copper foil with resistance has the function of resistance by exposing and forming a resistance film in part of the inner layer circuit. The base resistance film can be 25Ω, 50Ω, or 100Ω, and the set resistance value is determined by the conductor width and length formed from the required area (which can be calculated using a formula). 【Compatible Copper-Clad Laminates (Panasonic)】 ■R5775(R): Megtron6 R5775(K) + TCR foil ■R5775(S): Megtron6N R5775(N) + TCR foil ■R5785(R): Megtron7N R5785(N) + TCR foil *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Composite board thick printed circuit board

Composite board thick printed circuit board

High multi-layer & high board thickness, terminal board thickness of 1.57mm, etc.! We can propose specifications according to your application.

We would like to introduce our "Multilayer Printed Circuit Board." It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). We can propose specifications tailored to your applications, so please feel free to contact us with your requests. 【Features】 ■ It is possible to increase the number of layers according to the pin count of the mounted components (up to a maximum of 46 layers). ■ The freedom of characteristic impedance wiring width has improved (interlayer thickness of 0.1mm or more is acceptable). ■ The thickness of the inner layer copper foil can be increased for heat dissipation purposes. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Support for high-speed and large-capacity transmission.

Support for high-speed and large-capacity transmission.

For 5G/6G! We will realize products that support advanced high-speed transmission technology.

We would like to introduce our support for high-speed and large-capacity transmission. We have developed products that are compatible with advanced high-speed transmission technologies for 5G/6G. We provide support for solving challenges related to the development of advanced high-frequency application substrates. Additionally, our "high-frequency printed circuit boards" can be tailored to meet your needs through the adoption of new high-frequency materials, joint evaluations, and the use of LP foils and low-dielectric glass materials. 【Features of High-Frequency Printed Circuit Boards】 ■ Proposals tailored to your needs ■ Surface treatment transmission LOSS evaluation ■ Analysis, evaluation, and deployment of finished products *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Information] Introduction to Printed Circuit Boards for Space Use

[Information] Introduction to Printed Circuit Boards for Space Use

Acquisition of certification for all types of space-use printed circuit boards for the Japan Aerospace Exploration Agency! Various types are listed.

This document introduces the certification specifications for Annexes A, B, D, E, F, G, and H of the Japan Aerospace Exploration Agency (JAXA). It includes glass cloth substrate wiring boards, fine-pitch wiring boards, and flexible wiring boards. We provide detailed information on maximum layer counts, board thickness, conductor pressure, minimum drill diameters, and more, so please take a moment to read through it. 【Contents (partial)】 ■ Annex A: Glass cloth substrate wiring boards ■ Annex B: Fine-pitch wiring boards ■ Annex D: Flexible wiring boards ■ Annex E: Flex-rigid wiring boards ■ Annex F: Low thermal expansion wiring boards with CIC *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Support for high current, high voltage, and high heat dissipation specifications.

Support for high current, high voltage, and high heat dissipation specifications.

Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.

Our company solves issues related to high current, high voltage, and heat dissipation through a special structure. We are capable of conducting high current (up to 400A) tests and manufacturing metal (with AL2.5mm) products. Additionally, we propose multi-layer structures with conductor thicknesses of up to 500μm and suitable heat dissipation designs. We address concerns such as the labor-intensive assembly of busbars and issues caused by warping of printed circuit boards due to heat. [For such concerns] ■ I want to carry high current ■ The assembly of busbars is labor-intensive ■ Issues caused by warping of printed circuit boards due to heat ■ High heat density, making heat dissipation difficult *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Support for high-density build-up structures

Support for high-density build-up structures

High-density wiring is now possible, enhancing design flexibility! Compatible with various specifications.

We would like to introduce our support for high-density build-up structures. High-density wiring has become possible, enhancing design flexibility. With LVH connections, high-speed wiring without via stubs is achievable. We support specifications such as narrow pitch compatibility and high-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching, and improved characteristics for high-frequency applications). 【Supported Specifications】 ■ Narrow pitch compatibility ■ High-frequency compatibility (application of low dielectric materials, application of VLP copper foil, characteristic impedance matching & improved characteristics) ■ Thick copper foil specifications ■ Mixed IVH & LVH *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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