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Substrate(cad) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated: Aggregation Period:Sep 23, 2026~Oct 20, 2026
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Substrate Product List

61~75 item / All 75 items

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Mountaineer "Z:LEX YSM20WR"

Support for W356 width dual lane implementation in high-speed machines! Introduction of the mounter handled by Masu Shoji.

We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20WR' handled by Masu Shoji. We have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components with skill-less operation. In single lane mode, it standardly supports super-large substrates up to L810×W742, and it can also standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg. 【Features】 ■ Supports dual lane mounting with a width of W356 for high-speed machines ■ Standardly supports super-large substrates up to L810×W742 in single lane mode ■ Can standardly accommodate super-large substrates with a maximum thickness of 8.0mm and a maximum weight of 10kg ■ Options to improve line operating rates without stopping the machine ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Mounter "Z:LEX YSM20R"

Non-stop feeder bulk exchange system! A mounter that achieves one of the fastest loading capabilities in the world.

We would like to introduce the YAMAHA manufactured mount 'Z:LEX YSM20R' handled by Masu Shoji. It adopts a new wide-scan camera with improved component compatibility, achieving a 5% speed increase compared to conventional devices, making it one of the fastest in the world. In addition, we have newly developed the ALF (Auto Loading Feeder) that innovates the replenishment of tape components without requiring skills, as well as optional features that improve line operating rates without stopping the machine. 【Features】 ■ Adoption of a new wide-scan camera with improved component compatibility ■ Optional features that enhance line operating rates without stopping the machine ■ Newly developed ALF that innovates the replenishment of tape components with skill-less operation ■ Non-stop pallet exchange ATS (Auto Tray Sequencer) "sATS30NS" ■ Non-stop feeder bulk exchange system *For more details, please refer to the related links or feel free to contact us.

  • Mounter
  • Substrate

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

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Business Introduction: Printed Circuit Board Design

25 qualified national certification holders in printed circuit board manufacturing skills! Introducing available circuit board designs!

We would like to introduce the types of circuit board designs that our company can handle in "Printed Circuit Board Design." We can accommodate circuit board designs such as "high-speed digital" and "performance boards for semiconductor testing equipment." Based on small-lot production of various types, we handle the design and manufacturing of high-density, multi-layer printed wiring boards, as well as component mounting, assembly, and performance testing. 【Supported Circuit Board Designs】 ■ High-speed digital ■ Mixed digital & analog ■ High voltage, high current boards ■ Performance boards for semiconductor testing equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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USB-AMP Development Case Studies

Disaster prevention command system! Achieving interface conversion between USB audio signals and analog audio.

We would like to introduce a case study of the development of "USB-AMP" at our company. This is a board unit that performs interface conversion between the audio signal (USB) of the control device (PC) and analog audio in a disaster prevention command system. Development was carried out utilizing technologies for analog audio signal processing and USB-to-analog conversion. 【Case Overview】 ■ Design Area: Circuit Design Yes, Mechanical Design No, Software Design No ■ Notable Technologies: Analog Audio Signal Processing, USB-to-Analog Conversion ■ Tools Used: D2 CAD *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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[Space Station] FPC for the Space Industry - Lightweight and Highly Reliable Flexible Circuit Board

High-reliability FPC contributing to the life support system of the space station.

In the life support systems of space stations, high reliability capable of withstanding long-term operation in extreme environments and efficient wiring in limited spaces are required. Equipment related to life support is difficult to repair or replace once installed, making reliable performance and durability at the initial stage essential. Our FPC for the space industry has been developed to meet these stringent demands. 【Application Scenarios】 - Wiring within life support devices - Environmental control systems - Connections for sensors - Emergency response equipment 【Benefits of Implementation】 - Space-saving through miniaturization and lightweight design of equipment - Flexible wiring solutions for complex structures - Assurance of long-term reliability

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  • 宇宙向けFPC パネル.png
  • Printed Circuit Board
  • connector
  • Substrate

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[Space Antenna] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of space antennas.

In the field of space antennas, it is essential to maintain high signal reception performance within limited space and weight. Particularly in the harsh environment of outer space, the reliability of equipment becomes extremely important. Since repair or replacement in the event of a malfunction is difficult, ensuring high reliability at the initial stage is crucial. Our FPC for the space industry addresses these challenges and supports the miniaturization, lightweight design, and high reliability of antenna equipment. 【Usage Scenarios】 - Antennas mounted on satellites and probes - Space equipment requiring miniaturization and lightweight design - Wiring for complex shapes or confined spaces 【Benefits of Implementation】 - Overall weight reduction and miniaturization of antenna equipment - Reduction of wiring space - Performance improvement through high-density wiring - Assurance of high reliability in outer space

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  • Printed Circuit Board
  • connector
  • Substrate

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Lightweight and Highly Reliable Flexible Circuit Board for Space Probes

High-reliability FPC contributing to sensor connections of space exploration vehicles.

In space probes and related equipment, lightweight design, high-density wiring, and extremely high reliability are required to achieve advanced functionality in limited space. Particularly in sensor connections, it is essential to accurately transmit weak signals and maintain stable operation even in harsh space environments. Improper wiring design or unreliable components can directly impact the success of a mission. Our FPCs for the space industry address these challenges and support the performance enhancement of probes and the success of missions. 【Usage Scenarios】 - Connection with sensors of the probe body - Internal wiring of observation equipment - Wiring for devices requiring miniaturization and lightweight design 【Benefits of Implementation】 - Contribution to increased payload capacity through miniaturization and lightweight design of equipment - Improved design flexibility through flexible wiring for complex structures - Maintenance of mission execution capability due to high reliability

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  • Printed Circuit Board
  • connector
  • Substrate

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[Space Robot] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

High-reliability FPC contributing to joint drive of space robots.

In the joint drive components of space robots, flexibility to accommodate a wide range of motion and complex wiring, as well as high reliability under harsh space environments, are required. In particular, wiring disconnections or deterioration associated with joint movements pose a significant risk that can directly lead to the complete failure of the robot's functions. Our FPC for the space industry provides lightweight and highly reliable wiring solutions to address these challenges. 【Usage Scenarios】 - Wiring for joint drive components - Wiring in confined spaces - Wiring for complex three-dimensional structures 【Benefits of Implementation】 - Miniaturization and weight reduction of robots - Expansion of the range of motion and improvement of degrees of freedom - Reduction of wiring trouble risks

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  • Printed Circuit Board
  • connector
  • Substrate

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FPC for Satellite Communication: Lightweight and Highly Reliable Flexible Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of satellites and space equipment.

In the satellite communication industry, the reliability of equipment in space and miniaturization and lightweight design are essential. In particular, maintaining stable communication performance over long periods is crucial for signal transmission. Equipment failures or performance degradation directly impact the success of missions, necessitating high reliability. Our FPC for the space industry addresses these challenges and supports further miniaturization, lightweight design, and high reliability of space equipment. 【Usage Scenarios】 - Internal wiring of satellites - Signal transmission for probes - Areas requiring miniaturization and lightweight design of space equipment 【Benefits of Implementation】 - Reduction in launch costs due to lightweight equipment - Increased number of onboard devices due to space-saving design - Flexible wiring solutions for complex structures

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  • Printed Circuit Board
  • connector
  • Substrate

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FPC Lightweight and High Reliability Flexible Circuit Board for Rockets

High-reliability FPC contributing to the miniaturization and weight reduction of rocket control systems.

In rocket control systems, high reliability under extreme conditions and the ability to be mounted in limited space are required. Particularly in harsh environments exposed to vibrations and temperature changes, issues such as wire disconnections and shorts pose significant risks that directly affect the success of missions. Therefore, the introduction of flexible printed circuit boards (FPC) that achieve lightweight and high-density wiring while ensuring high reliability is essential. 【Usage Scenarios】 - Rocket attitude control systems - Propulsion system control - Communication and data processing systems - Wiring for various sensors 【Benefits of Implementation】 - Reduction in launch costs due to overall equipment lightweighting - Space-saving through flexible wiring for complex structures - Increased mission success rates due to high reliability - Improved maintainability through a reduction in the number of components

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  • Printed Circuit Board
  • connector
  • Substrate

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[For Space Medicine] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of space medical devices.

In the field of space medicine, there is a demand for miniaturization, lightweight design, and high reliability in devices such as biometric measurement instruments. Particularly for devices that are worn on the human body or intended for use in limited spaces, these factors are directly linked to the performance and safety of the products. Inappropriate design or materials can lead to device failures, malfunctions, and even impact on patients. Our FPC for the space industry provides solutions that leverage thinness, lightness, and flexibility to address these challenges, supporting the further development of biometric measurement devices. 【Usage Scenarios】 - Compact and lightweight biometric sensors - Wearable medical devices - Medical devices for use in space - Medical devices with complex shapes 【Benefits of Implementation】 - Improved wearability through miniaturization and lightweight design - Flexible wiring solutions for complex structures - Ensured safety through high reliability - Increased design freedom due to space-saving features

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  • Printed Circuit Board
  • connector
  • Substrate

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[Space Solar Power] Lightweight and Highly Reliable Flexible Circuit Board for the Space Industry

High-reliability FPC supporting the power supply system of space solar power generation.

In the power supply system for space solar power generation, high reliability capable of withstanding long-term operation in outer space and efficient wiring in limited space are required. In particular, stable signal transmission and durability under harsh space conditions are essential for power transmission from solar panels to the ground. Inappropriate wiring materials can lead to communication errors and equipment failures, potentially resulting in decreased power generation efficiency and mission failure. Our FPC for the space industry addresses these challenges and enables a safe and efficient power supply system. 【Usage Scenarios】 - Power transmission between solar panels and ground facilities - Signal transmission between various devices in outer space - Wiring for space equipment that requires miniaturization and lightweight design 【Benefits of Implementation】 - High reliability capable of withstanding long-term operation in outer space - Reduction in launch costs due to miniaturization and lightweight design of equipment - Increased design flexibility for systems through flexible wiring for complex structures

  • 宇宙用FPC.jpg
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  • Printed Circuit Board
  • connector
  • Substrate

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[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • Substrate

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[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • Substrate

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