Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
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Soldering dedicated orthogonal robot
It is a best-selling soldering robot developed specifically for soldering, boasting a delivery record of over 500 units worldwide in the 10 years since its release.
Reliable, high processing capability, unique processing technology. We continue to challenge new manufacturing technologies.
We handle various prototypes, manufacturing, and mass production of printed circuit boards. With reliable and high-capacity processing, and unique processing technologies, we specialize in flexible circuit boards, acrylic and copper plates, router processing, laser processing, press processing, V-cut processing, and various other services. We strive for reliable and fast processing, so please feel free to contact us for inquiries and quotes, especially if you are in a hurry. 【Business Contents】 ■ Prototyping and manufacturing of flexible circuit boards ■ Processing of special materials such as acrylic and copper plates ■ Creation of molds specifically for aluminum substrates ■ Support for various plating on printed circuit boards ■ Production of dip jigs for soldering, etc. *For more details, please download the PDF or feel free to contact us.
![Long-length multi-layer flexible substrate [Substrate manufacturing achievements]](https://image.mono.ipros.com/public/product/image/857/2000674579/IPROS01080264647980196626.png?w=280&h=280)
4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.
We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.
![[Information] Understand in just 5 minutes! Basic knowledge of printed circuit boards.](https://image.mono.ipros.com/public/product/image/db4/2000808531/IPROS5887203321104298361.jpg?w=280&h=280)
There are four main categories! We will explain printed circuit boards in an easy-to-understand manner!
"Printed circuit boards" are used in very familiar items in our daily lives. This document provides an easy-to-understand explanation of the basic knowledge of "printed circuit boards." Their main role is to attach electronic components such as resistors, ICs, and capacitors to non-conductive materials through soldering, connecting the electronic components with conductive paths. By transmitting electricity through the electronic circuits of these products, we can conveniently use the electrical devices around us. It includes information on their roles, types, and where they are utilized. We encourage you to read it. [Contents] ■ What is a printed circuit board? ■ The role of printed circuit boards ■ Types of printed circuit boards ■ Places where they are utilized ■ Introduction to Shinko Seisakusho *For more details, please refer to the PDF document or feel free to contact us.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
Turnkey connector implemented! A thin polymer resin film is used as insulation.
"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.
Used in very familiar items in everyday life! Its main role is to connect electronic components with a path for electricity to flow!
A "printed circuit board" is an electronic component used in everyday items around us. Its main role is to attach electronic components such as resistors, ICs, and capacitors onto a non-conductive material through methods like soldering, connecting the components with conductive paths. By transmitting electricity through the electronic circuits of this product, it enables the convenient use of electrical devices in our surroundings. 【Types of Printed Circuit Boards】 ■ Rigid Board (PWB) = Hard, flat board ■ Flexible Board (FPC) = Bendable ■ Rigid-Flex Board = Rigid board + Flexible board ■ Metal Base Board = Board that enhances heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
We aim to be a trading company focused on realizing customer solutions as our top priority, through development and proposals.
Foresight Co., Ltd. is not just a traditional trading company that sells mere "products" in the flat panel display industry, but aims to be a development and proposal-oriented trading company that prioritizes realizing customer solutions. In the industrial sector, we are forced to undergo structural reforms, and waves of technological innovation are continuously emerging, demanding rapid changes and developments. In this environment, we will leverage the information network we have cultivated over many years to pursue speedy and dynamic business development. 【Sales Items】 ■ Touch panel related components ■ LCD related components ■ OLED related components ■ Equipment related ■ Lamination process related ■ New development *For more details, please refer to the PDF materials or feel free to contact us.
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.
Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.
From design and development to manufacturing, evaluation, and certification, we support our customers' challenges with OKI-EMS's "Comprehensive Manufacturing Services."
We provide design and production contract services in high-end fields such as medical devices, aerospace, information and communication, industry, and measurement under the name 'Advanced M&EMS'. We will be exhibiting at the "22nd Printed Circuit Board EXPO" held from January 20 (Wednesday) to 22 (Friday), 2021! 【Overview of the "22nd Printed Circuit Board EXPO"】 Date: January 20 (Wednesday) to 22 (Friday), 2021 Venue: Tokyo Big Sight, West Hall 3 (4th floor of the West Exhibition Building), Booth No. W22-38 * A virtual (online) booth will also be prepared. We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth.
Presentation of Case Studies for Problem Solving: One-stop support from design to maintenance! We respond to various needs such as entering new markets and multilayering of circuit boards.
Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."
A porous chuck that can softly hold large workpieces of 500×500mm! Compatible with transparent light AOI (Automatic Optical Inspection)!
The "Embedded Type Transparent Light Illumination PE Porous Chuck" uses soft polyethylene porous material to gently chuck FPCs, wafers, LF, glass substrates, etc., and performs AOI with embedded transparent light illumination. 【Features】 ■ Uses translucent ultra-high molecular weight polyethylene for the porous material ■ Reduces introduction costs and equipment weight compared to ceramic and metal materials ■ When clogging occurs in the porous material, it can be replaced at a low cost ■ When using porous material with an average air pore diameter of less than 5μm, partial adsorption is possible *For more details, please download the PDF materials from <Download Catalog>.
![Substrates, etc. Brain Power [Authorized Dealer]](https://image.mono.ipros.com/public/product/image/4b3/2001525336/IPROS2031350881699948693.png?w=280&h=280)
From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.
Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.
