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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Sep 24, 2025~Oct 21, 2025
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Substrate Product List

166~180 item / All 198 items

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Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board

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3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS

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Micro Module Technology Corporation - Business Overview

Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!

We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.

  • Circuit board design and manufacturing

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We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

If the standard product doesn't fit, if you would like a different shape, or if there are some processes that cannot be done, please feel free to consult with us! *Q&A materials will be provided.

If you have requests for custom or special products tailored to your company's challenges, please feel free to consult with us. Even in the conceptual stage, you can specify items that resemble hand-drawn sketches or sample products featured on our website. We will ask for necessary information, such as the intended use and the environment in which you want to use the product, and gradually determine the specifications while consulting with you. Even if you are unsure about technical aspects, we will support you in the product manufacturing process. 【Are you facing any of these issues?】 "I just can't make it work with standard products." "I want the shape to be more like this." "There are some processes that can't be done." "I want to reduce costs during the design phase with an eye on mass production," etc. 【Examples of production】 ■ Increased thickness of polyimide material ■ Delivery of 6mm PCB material ■ Large hole drilling processing of 750×500 ■ Thermal press processing of test materials Additionally, if you have requests for materials, we can source them, and we can also look for manufacturer-specified material specifications, inks, or materials that meet your needs, so please consult with us once. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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FPC

With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector

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[Research Material] Global Market for FPC (Flexible Printed Circuit Boards)

World Market for FPC (Flexible Printed Circuit Boards): Single-sided Circuits, Double-sided Circuits, Multi-layer Circuits, Rigid-flex Circuits, Medical, Aerospace & ...

This research report (Global FPC Market) investigates and analyzes the current state of the global market for FPC (Flexible Printed Circuit Boards) and its outlook for the next five years. It includes information on the overview of the global FPC market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the FPC market by type include single-sided circuits, double-sided circuits, multilayer circuits, and rigid-flex circuits, while the segments by application cover medical, aerospace & defense/military, consumer electronics, automotive, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of FPC (Flexible Printed Circuit Boards). It also includes the market share of major companies in the FPC (Flexible Printed Circuit Boards) sector, product and business overviews, and sales performance.

  • Other services

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others

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[Hardware Development Achievements] 64ch FPIX Board

The created histogram is transferred to the PC via SiTCP! It has a structure with a heat-dissipating aluminum block placed at the bottom.

We assisted with KEK's FPIX project. This is a substrate developed in the measurement instrument development room to collect signals from a Si-APD chip, where the signals are sampled at 0.5 ns by an FPGA and histogrammed within the FPGA. The created histogram is transferred to a PC via SiTCP. To efficiently dissipate heat from components like the FPGA, most of the components are placed on the underside, and a heat-dissipating aluminum block is structured on the bottom. 【Overview of Achievements】 ■ Service: Hardware Development ■ Client: High Energy Accelerator Research Organization ■ Location: KEK PF *For more details, please refer to the related link page or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Embedded system design service

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Printed circuit board manufacturing service, short delivery time.

IVH, resin filling, build-up, impedance, flexible substrate compatible! Unmatched ultra-short delivery time faster than anywhere else!

Our company manufactures all processes of printed circuit board production in-house. Therefore, we can ship a variety of printed circuit boards with reliable and assured short delivery times. We also handle gold flash, lead-free leveling, and terminal gold plating in-house, which is a characteristic of our company that ensures stable delivery times. Additionally, even for repeat orders, we can accommodate the delivery times listed in the schedule without any changes from the initial order. *Examples of short delivery times: - Through-hole boards (2 to 10 layers): Minimum shipping in 1.05 days* (Data submission and orders by 20:00 on business days will ship the next business day) - Build-up boards: Minimum shipping in 3.1 days* (Data submission and orders by 16:00 on business days will ship on the 3rd business day from the next business day) - Flexible (FPC) boards: Minimum shipping available on the 2nd day - Rigid FPC boards: Minimum shipping available on the 5th day ☆ The above is also applicable even if the surface treatment is gold flash finish. [Products Handled] ■ Through-hole resin-filled boards ■ Build-up boards ■ IVH boards ■ Impedance control boards ■ Copper bump boards ■ Various resist colors ■ Flexible (FPC) boards ■ Rigid FPC boards ■ Copper inlay boards ■ Metal boards *For more details, please feel free to contact us.

  • Printed Circuit Board

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Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing

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Artwork design for high-frequency substrates

We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.

  • Image Processing Software

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