ED1512884 N151.23004E
ED1512884 N151.23004E
Sandvik SV N151.23004E T-Max Q-Cut Cutting and Grooving Insert 525 N15123004E 609-8827
- Company：イーデンキ
- Price：10,000 yen-100,000 yen
Tips Product List and Ranking from 33 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
Tips Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
- ムネカタインダストリアルマシナリー Osaka//Industrial Machinery
- null/null
- オーエスジーダイヤモンドツール Shiga//Other manufacturing
- 4 null/null
- 5 null/null
Tips Product ranking
Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.
Tips Product List
151～165 item / All 413 items
Displayed results
Special cutting tools for metal processing - diamond throwaway chips.
Special cutting tools for metal processing - diamond throwaway chips
Precision mold components, various surface treatments, special cutting tools, and chemical products sales general trading company. This is an introduction to the "Special Cutting Tools for Metal Processing - Diamond Throwaway Tips" handled by Tool Tech Tohoku. Range of diamond tips: standard stock items to custom-made products and regrinding. *For standard stock items, we will send you a catalog, so please feel free to inquire. Due to popular demand, we are offering them at a special price. (We also provide them to machine tool trading companies.) We also handle CBN tips.
- Company：ツール・テック東北
- Price：Other
Implementation of TEG (Test) Chip
Advanced implementation evaluation TEG (test) chip
Providing mounting solutions from bump-equipped chips compatible with all types of bonding methods to advanced mounting assembly and reliability evaluation.
- Company：ウェル
- Price：Other
![Test chip [Multi-type]](https://image.mono.ipros.com/public/product/image/086/135151018/IPROS_13072303327799126000.gif?w=280&h=280)
Test chip [Multi-type]
Test Chip 【Multi-Type】
Test chip used for wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose applications. ■Wafer size: 6-inch wafer ■Base chip size: 2.13×2.1mm ■Pad pitch: 130μm ■Number of pads: 108 bumps (48 bumps on the inner circumference, 60 bumps on the outer circumference) ■Compatible bump processes: Gold-plated bumps / Gold stud bumps ■Compatible substrate: JKIT Type2 (SIDE A) ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) / Can be changed to gallium arsenide wafer (only for gold-plated bump products) ■Main applications: Material development, equipment development, substrate development, package development, process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Test chip with solder bumps
Test chip with solder bumps
Test chip equipped with solder bumps □Product name ... JTEG Phase1E50/JTEG Phase1E28/JTEG Phase1E15 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Test chip with solder bumps
Test chip with solder bumps
Test chip equipped with solder bumps (narrow pitch area type) □Product name ... JTEG Phase2E200/JTEG Phase2E175/JTEG Phase2E150 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Test chip for thermal resistance and stress measurement.
Test chip for thermal resistance and stress measurement.
Thermal resistance and stress measurement test chip □Product name... JTEG Phase5/JTEG Phase5GB2 ■Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Test chip for evaluating Cu bonding with Cu bumps.
Test chip for evaluating Cu bonding with Cu bumps.
Cu bump mounted Cu bonding evaluation test chip ■Wafer size ... 8-inch wafer ■Base chip size ... 5.09mm × 5.09mm ■Pad pitch ... 150μm (staggered pads) ■Number of pads ... 841 bumps ■Compatible bump process ... Cu bump ■Compatible substrate ... None ■Options ... Bump mounting / Dicing processing / Back grinding processing ■Main applications Package development, process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Test chip with next-generation solder bumps
Test chip with next-generation solder bumps.
Next-generation test chip with Low-K film used in the interlayer dielectric layer for solder bumps ■Wafer size: 8-inch wafer ■Base chip size: 5.02mm × 5.02mm ■Pad pitch: 200μm (staggered pads) ■Number of pads: 484 bumps ■Compatible bump processes: Eutectic solder / Lead-free solder ■Compatible substrate: JKIT Type 5 ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation ■Main applications: Package development, process ramp-up / Development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
![Test chip [for ultra fine pitch WB/FC mounting evaluation]](https://image.mono.ipros.com/public/product/image/54b/135151029/IPROS_15090265310453498000.gif?w=280&h=280)
Test chip [for ultra fine pitch WB/FC mounting evaluation]
Test chip for ultra-fine pitch WB/FC mounting evaluation.
Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip □Product Name... JTEG Phase11_80/JTEG Phase11_70/JTEG Phase11_60/JTEG Phase11_50/JTEG Phase11_40 ■Main Applications Package development, process startup/development, promotional data acquisition, etc.
- Company：ウェル
- Price：Other
Glass chip for observing underfill entrapment voids.
Glass chip for observing underfill entrapment voids.
Underfill Encapsulation Void Observation Glass Chip ■Wafer Size: 5-inch Wafer ■Base Chip Size: 5.02mm × 5.02mm ■Pad Pitch: 200μm ■Number of Pads: 484 Bumps ■Compatible Bump Processes: Eutectic Solder / Lead-Free Solder ■Compatible Substrates: JKIT Type1 (SIDE A) / JKIT Type5 ■Base Material: Natural Quartz Glass ■Options: Bump Mounting / Dicing Processing ■Main Applications: Material Development, Process Startup/Verification, Promotional Data Acquisition, etc.
- Company：ウェル
- Price：Other
Microfluidic chip (resin molded product)
We can manufacture inspection chips made to order for our customers. *Resin products: mass-produced items.
The coronavirus, which is causing a stir in the world, allows for various tests to be conducted using samples such as blood. Mass production of testing chips is possible. As a recent trend, many chips aimed at disposability are being developed. Additionally, companies are developing devices for testing, and progress is being made in the development of devices and chips that enable easy testing.
- Company：精工技研
- Price：Other
