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Tips(lsi) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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Tips Product List

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Test chip [Multi-type]

Test chip [Multi-type]

Test Chip 【Multi-Type】

Test chip used for wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose applications. ■Wafer size: 6-inch wafer ■Base chip size: 2.13×2.1mm ■Pad pitch: 130μm ■Number of pads: 108 bumps (48 bumps on the inner circumference, 60 bumps on the outer circumference) ■Compatible bump processes: Gold-plated bumps / Gold stud bumps ■Compatible substrate: JKIT Type2 (SIDE A) ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) / Can be changed to gallium arsenide wafer (only for gold-plated bump products) ■Main applications: Material development, equipment development, substrate development, package development, process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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TEG chip

TEG chip

TEG chip

We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.

  • Bonding Equipment
  • Other semiconductors
  • Processing Contract

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TEG chip

TEG chip

Creation of TEG chips for implementation evaluation using techniques such as film formation, photo-etching, and plating.

At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.

  • Other electronic parts
  • Contract manufacturing

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Semiconductor dummy chip

Semiconductor dummy chip

We will manufacture according to the client's specifications.

The wafer size is a maximum of 4 inches, with a thickness of 200 to 500 μm. The electrode materials include Al, Al-Si-Cu, and Al-Cu, among others. The formation of SiN and photolithography is possible, and the formation of Au bumps and dicing can be done for supplied wafers up to a maximum of 8 inches. Dicing and tray packing will also be performed.

  • Other semiconductors

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VIC292 Consumer Device Security Chip, MATTER Compatible

VIC292 Consumer Device Security Chip, MATTER Compatible

VIC292 securely connects low-power devices such as sensors to the network using TLS.

Securely connect edge devices to servers using the TLS protocol. The cryptographic keys and digital certificates used in PKI are stored securely within the chip. It handles interactions with the certification authority on behalf of the host microcontroller. From the host microcontroller, it only requires an I2C call, eliminating the need for developing cryptographic processing firmware. It is compatible with the smart home network MATTER. The digital certificates for MATTER can be pre-loaded into the VIC292 chip and provided.

  • Dedicated IC
  • Encryption and authentication

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