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device Product List and Ranking from 297 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

device Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. パナソニック アドバンストテクノロジー Osaka//IT/Telecommunications
  2. 音羽電機工業 Hyogo//Industrial Electrical Equipment
  3. null/null
  4. 4 日本制禦機器 Osaka//Industrial Electrical Equipment
  5. 5 Cytiva Tokyo//others
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device Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Functional safety compliant wireless emergency stop device '@seguro wes' パナソニック アドバンストテクノロジー
  2. [Prototype Available for Loan] Easy Point Cloud Acquisition Device '@mapper' パナソニック アドバンストテクノロジー
  3. 高速回線避雷器 森長電子
  4. 4 Dual Master Device 'DMD-101-3 DC' 日本制禦機器
  5. 5 Nanosep centrifugal filtration device for ultrafiltration. Cytiva

device Product List

481～495 item / All 604 items

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ULL Voice Communication Module "WAM10X"

ULL Voice Communication Module "WAM10X"

Audio communication module (under development) for ultra-low latency audio transmitter products.

"WAM10X" is a ULL audio communication module for ultra-low latency audio transmitter products. Thanks to USE's proprietary communication protocol, it achieves an industry-leading ultra-low latency of 3.14ms in 1-to-1 mono downlink mode. It adopts high-quality 48K/24bit communication, providing an uncompromised audio experience despite the low latency. The module is expected to obtain wireless certification in various countries (2025), reducing the hassle of obtaining certification for the final product. 【Features】 ■ Industry-leading low latency ■ High sound quality ■ Wireless certification obtained *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • Other semiconductors
  • Embedded system design service

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2011 Printed Electronics Devices

2011 Printed Electronics Devices

This clarifies the development trends, adoption status, and application deployment of printed technology, providing an outlook on its future potential.

Printed technology is gaining attention. Conventional electronic devices, represented by semiconductors and LCDs, are primarily manufactured using deposition and lithography techniques. These devices have evolved to become more high-performance and larger in size, and particularly in cutting-edge fields, semiconductors have miniaturized while LCDs have approached the limits of large-scale manufacturing lines. As a result, constructing new production lines has required enormous funding. This has limited the number of manufacturers entering the market and has become a significant barrier to new entrants. The situation has become stagnant, resembling a dead end in some respects. Amidst this, the development of printed technology is progressing, and its application in mass production lines is advancing in some areas. Printed technology features low-temperature processes, low-power manufacturing equipment, cleanroom-less environments, and non-vacuum processes, making it a manufacturing technology with low initial costs. Additionally, the introduction of roll-to-roll methods has the potential to significantly enhance productivity and reduce running costs. This technology also allows for the flexibility and cost reduction of products, leading to lower prices. It has the potential to create new applications and markets.

  • Organic EL
  • Other polymer materials
  • Secondary Cells/Batteries

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Dual Power Expansion Device 'DPE-111 AC/DC'

Dual Power Expansion Device 'DPE-111 AC/DC'

Safety Relay Unit - Dual Master Series: Supports safety assurance, reduces maintenance work, and lowers costs.

The dual power expansion device 'DPE-111 AC/DC', which is a safety relay unit, is a contact expansion unit specifically for the 'DPD-101 DC' and 'DPD-101-3 DC'. The safety output contacts are duplicated. 【Features】 ■ Safety output contacts are duplicated ■ Exclusive to 'DPD-101 DC' and 'DPD-101-3 DC' ■ Applicable standard GS-ET-20: BG certification No. ET01011 *For more details, please refer to the PDF document or feel free to contact us.

  • Safety Relay

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Comparison of technologies for optical transmission devices and challenges and solutions in connection materials and sealing materials.

Comparison of technologies for optical transmission devices and challenges and solutions in connection materials and sealing materials.

★A detailed explanation of the current state of essential sealing materials and transmission materials for optical transmission technology. What is the economic impact of Intel's introduction of Light Peak?

Speaker Mr. Shigeru Koshibe, President of Aipack Co., Ltd. Target Audience: Company representatives and engineers with challenges or interests in optical transmission materials and optical devices. Venue: Kawasaki City Industrial Promotion Hall, 9th Floor, Room 2 [Kanagawa, Kawasaki] 7-10 minutes walk from JR and Keikyu Line Kawasaki Station Date and Time: April 18, 2011 (Monday) 13:00-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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High-performance and improved moldability of high heat-resistant, high thermal conductivity resin - For HEVs and electrical components.

High-performance and improved moldability of high heat-resistant, high thermal conductivity resin - For HEVs and electrical components.

What are the required levels of thermal conductivity and heat resistance for resins used in power devices? The densest packing method for resin fillers and the improvement of fluidity through filler treatment.

Lecturers Part 1: Professor Akio Takahashi, Graduate School of Engineering, Yokohama National University Part 2: Shigeru Koshibe, Representative Director, Aipack Co., Ltd. Part 3: Naokatsu Hisanaga, Senior Manager, Semiconductor Division, Sunyurek Co., Ltd. Target Audience: Researchers and personnel interested in the high functionality of heat-resistant resins, high thermal conductivity resins, and application examples in automotive uses. Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: June 28, 2011 (Wednesday) 10:30 AM - 4:00 PM Capacity: 30 people Participation Fee: 54,600 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 14 will receive an early bird discount price of 49,350 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts from the early bird price do not apply. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same corporation, an additional 12,600 yen will be charged per person.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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[Case Study] Automotive-related Factory (Protection of Firefighting Equipment)

[Case Study] Automotive-related Factory (Protection of Firefighting Equipment)

Are you fully prepared for lightning protection? Here are some case studies of implementation in actual automotive-related factories!

We would like to introduce a case study for the protection of fire-fighting equipment requested by an automotive-related factory. After the implementation, the person in charge commented, "We were experiencing disruptions in our operations due to repeated lightning strikes. We were concerned about how much we could prevent, so we decided to install a lightning rod on the equipment that had suffered the most damage and attached a counter. We were then able to monitor the lightning situation with the counter, and we are currently considering the next lightning protection measures." 【Case Study】 ■ Client: Automotive-related factory ■ Purpose: Protection of fire-fighting equipment ■ Feedback from the person in charge: - Operations were disrupted due to repeated lightning strikes - Installed a lightning rod on the equipment that had suffered the most damage as a trial - Monitoring the lightning situation has allowed us to consider the next lightning protection measures *For more details, please refer to the PDF document or feel free to contact us.

  • Other safety equipment

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[Case Study] Security Company (Protection of Security Equipment and Surveillance Cameras)

[Case Study] Security Company (Protection of Security Equipment and Surveillance Cameras)

Have you already taken measures against lightning strikes for important facilities? We will introduce case studies from security companies.

We would like to introduce a case study for the protection of security equipment and surveillance cameras, requested by a security company. After implementation, the person in charge mentioned, "The day after the thunderstorm, it was very difficult due to repairs. I believe such measures are necessary for important facilities." 【Case Study】 ■ Client: Security Company ■ Purpose: Protection of security equipment and surveillance cameras ■ Feedback from the person in charge: - It was very difficult due to repairs the day after the thunderstorm. - I believe such measures are necessary for important facilities. *For more details, please refer to the PDF document or feel free to contact us.

  • Other safety equipment

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If you're struggling with IoT, you must see this! We will solve everything!

If you're struggling with IoT, you must see this! We will solve everything!

Transform your devices into IoT and develop IoT products at 【low cost】【in a short time】! The IoT platform "iot-mos" can solve everything!

Common Issues with IoT Implementation 〇 Many experts are needed, but... 　→ In reality, it is difficult to secure abundant resources. 〇 There is a gap in awareness within the organization... 　→ There are numerous criticisms and requests from superiors and colleagues, making it hard to succeed. 〇 The gap in cost demands is significant... 　→ It is not realistic to ensure reliability while balancing flexibility and low costs. Many of you may be struggling with issues like the above, right? With 【iot-mos】, we can solve everything! First, why not consult with us and quickly realize your IoT implementation? ● μC3 equipped with iot-mos has over 800 successful implementations! High reliability. ● Instead of scratch development, we utilize existing assets for low-cost and short-term development. ● For areas that cannot be covered with in-house resources, e-Force provides development support! If you want to implement IoT right away, please feel free to "Contact Us"! *Please also take a look at the materials on "iot-mos"! #IoT #EnOcean #Wi-Fi #LTE #Cloud

  • Other embedded systems (software and hardware)

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【English Market Research Report】Global Market for Wearable AI

【English Market Research Report】Global Market for Wearable AI

"Free samples" are currently available! Please check the application method from the [PDF download] button, or apply directly through the related links.

The global wearable AI market is projected to grow from 24.6 billion USD in 2022 to 32.12 billion USD in 2023, with a CAGR of 30.6%. The war between Russia and Ukraine has interrupted the potential for global economic recovery from the COVID-19 pandemic. This conflict has led to economic sanctions against multiple countries, soaring commodity prices, and supply chain disruptions, causing inflation across goods and services and resulting in rising interest rates that affect many markets worldwide. The wearable AI market is expected to reach 91.8 billion USD by 2027, with a CAGR of 30%.

  • Other services

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[English Market Research Report] Super Soldier Wearable Technology Market

[English Market Research Report] Super Soldier Wearable Technology Market

"Free samples" are currently being offered! Please check the application method from the [PDF download] button, or apply directly from the related links.

The global super soldier wearable technology market size reached 7.8 billion USD in 2023. Moving forward, the IMARC Group forecasts that the market will reach 19.2 billion USD by 2032, showing a growth rate (CAGR) of 10.21% between 2024 and 2032. Increasing geopolitical tensions, a rise in the use of drones, and increased investments by governing bodies in numerous countries represent some of the key factors driving the market.

  • Other services

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【English Market Research Report】Global Market for Smart Home Devices

【English Market Research Report】Global Market for Smart Home Devices

"Free samples" are currently being offered! Please check the application method from the [PDF download] button, or apply directly through the related links.

The market size of smart home devices has been rapidly expanding in recent years. It is expected to grow from 108.85 billion USD in 2023 to 128.19 billion USD in 2024, with a compound annual growth rate (CAGR) of 17.8%. This expansion has been driven by factors such as consumer demand for convenience and automation, security and monitoring needs, energy efficiency, cost reduction, aging populations, and the necessity for accessibility, as well as integration with mobile devices.

  • Other services

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[Web Seminar] EV Shift - Carbon Neutrality

[Web Seminar] EV Shift - Carbon Neutrality

Si・SiC・GaN Power Device Technology Roadmap and Industry Outlook

Since the global spread of the coronavirus began in 2020, countries around the world have suffered significant human and economic damage, and by the end of 2021, a recovery outlook is finally beginning to emerge. In this context, the realization of a decarbonized society, including the electrification of vehicles (xEV) for addressing global warming and air pollution, remains an urgent challenge for humanity. The power devices, which are core components determining the performance of power electronics products such as EVs, are expected to see widespread adoption of new materials like SiC/GaN devices. However, at present, it cannot be said that they sufficiently meet market demands in terms of performance, reliability, and price. This course aims to clearly explain the key points for widely promoting SiC/GaN power devices in the market, while keeping an eye on the latest trends of their strong competitor, silicon devices.

  • Company：S&T出版
  • Price：10,000 yen-100,000 yen
  • Management Skills Seminar
  • Technical Seminar

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Compact and easy to install! Support devices for preventing post sinking of protective fences and safety barriers.

Compact and easy to install! Support devices for preventing post sinking of protective fences and safety barriers.

For weak ground and heavy snowfall areas! A small component but highly effective! A groundbreaking device that prevents the sinking of underground protective fences and safety fence posts.

Cedimento means "subsidence" in Italian. It is a new component developed to prevent the sinking of posts due to geological factors and weather influences such as snowfall. In particular, when used together with highly elastic fiberglass poles, it prevents the posts from "breaking" or "sinking" under external pressure. *It can also be used with steel pipe posts. It is recommended for sites in heavy snowfall areas where pressure from snow accumulation is a concern, as well as for sites with weak ground where sinking of posts is a worry. 【Other Features】 ■ Does not fix to the post itself Cedimento is not designed to fix to the post itself like a typical "nekase" to prevent sinking. Instead, it is placed on the ground connected to a wire that runs through the post, and it prevents sinking by bracing against the entire surface area of the ground contact. ■ Small and compact, yet effective The mechanism is very simple and consists of small components. When used with flexible fiberglass poles, it not only prevents sinking but also prevents the posts from "breaking."

  • Other safety and hygiene products

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