Si・SiC・GaN Power Device Technology Roadmap and Industry Outlook
Since the global spread of the coronavirus began in 2020, countries around the world have suffered significant human and economic damage, and by the end of 2021, a recovery outlook is finally beginning to emerge. In this context, the realization of a decarbonized society, including the electrification of vehicles (xEV) for addressing global warming and air pollution, remains an urgent challenge for humanity. The power devices, which are core components determining the performance of power electronics products such as EVs, are expected to see widespread adoption of new materials like SiC/GaN devices. However, at present, it cannot be said that they sufficiently meet market demands in terms of performance, reliability, and price. This course aims to clearly explain the key points for widely promoting SiC/GaN power devices in the market, while keeping an eye on the latest trends of their strong competitor, silicon devices.
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Date and Time: January 26, 2022 (Wednesday) 10:30 AM - 4:30 PM [WEB Exclusive Seminar] *You can attend the seminar from home or while at work. [Program] 1. What is Power Electronics? 2. Advances in Latest Silicon IGBTs 3. Current Status and Challenges of SiC Power Devices 4. Current Status and Challenges of GaN Power Devices 5. Current Status of Gallium Oxide and Diamond Power Devices 6. High-Temperature Compatible Packaging Technologies 7. Summary
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51,000 yen (including tax) *Includes materials *For those who do not wish to receive email notifications, the tuition fee is "51,000 yen × number of participants" *For those who wish to receive email notifications (free of charge): ★If applying as one person, 44,000 yen ★If applying for two people at the same time, the fee is 51,000 yen for two people (second person free) ★If applying for three people at the same time, the fee is 73,000 yen for three people ★If applying for four or more people at the same time, the fee is the tuition for three people plus 20,000 yen for each additional person beyond three *Applications for two or more people at the same time are limited to the same corporation. *For two or more participants, a separate application is required for each participant.
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P2
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【Target Audience】 This content is not only for those involved in power electronics development and power device development, but also for those responsible for selling power electronics equipment and power devices, making it easily understandable. It will be explained in a way that can be fully comprehended with a basic level of engineering knowledge. 【What You Will Learn】 The trends in power device development over the past 30 years. The latest technological trends in power devices, characteristics and challenges of SiC/GaN power devices. SiC device packaging technology, as well as design and process technologies specific to SiC devices.
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Download All Catalogs![[Web Seminar] Technology Roadmap and Industry Outlook for Si, SiC, and GaN Power Devices Towards EV Shift and Carbon Neutrality](https://image.mono.ipros.com/public/catalog/image/01/c93/615630/IPROS35612869951232279150.jpeg?w=120&h=170)
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S&T Publishing publishes technical books aimed at researchers and engineers.
