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glue - メーカー・企業282社の業務用製品ランキング | イプロスものづくり

更新日： 集計期間:Jul 29, 2026～Aug 25, 2026
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glueのメーカー・企業ランキング

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  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. エア・ブラウン 本社 Tokyo//Electronic Components and Semiconductors
  3. 理経 Tokyo//IT/Telecommunications
  4. 4 太平化成 Tokyo//Chemical
  5. 5 ペルノックス Kanagawa//Other manufacturing
企業ランキングへ

glueの製品ランキング

更新日： 集計期間:Jul 29, 2026～Aug 25, 2026
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  1. Pre-coated screw locking! Eight Lock Series 太平化成
  2. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 Adhesive Araldite AW106J CI/HV953U J CI 寺田
  5. 5 Reflow Dispensing Adhesive "JU-R4S"

glueの製品一覧

541～570 件を表示 ／ 全 1138 件

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Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

  • plastic
  • Coating Agent
  • Other electronic parts
  • glue

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Waterproof sealing of substrates, sensors, etc. Hot melt molding.

Waterproof sealing of substrates, sensors, etc. Hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

  • EMS
  • Coating Agent
  • glue

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Hot Melt Molding Case Study: "LED Module Waterproof Sealing"

Hot Melt Molding Case Study: "LED Module Waterproof Sealing"

LED module waterproof sealing! A case of process improvement through switching from potting.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

  • Other molds
  • Coating Agent
  • Other electronic parts
  • glue

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Hot Melt Molding Case Study: "Sealing of IC Tags"

Hot Melt Molding Case Study: "Sealing of IC Tags"

Introducing a case where low melting viscosity hot melt was used for sealing IC tags.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent
  • glue

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For waterproofing and dustproofing of electrical components. Hot melt molding.

For waterproofing and dustproofing of electrical components. Hot melt molding.

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

  • Processing Contract
  • Coating Agent
  • Other electronic parts
  • glue

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Custom-made partition board

Custom-made partition board

We will design according to your requests, dimensions, and the shape for storage.

Used for transportation within the project, - Oil-resistant - Washable - Capable of supporting metal parts A sturdy partition... In response to these requirements, a partition as shown on the left was created using foam resin board.

  • Processing Contract
  • glue

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Waterproof sealing of electrical components: Hot melt molding

Waterproof sealing of electrical components: Hot melt molding

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

  • Coating Agent
  • Circuit board design and manufacturing
  • Other electronic parts
  • glue

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Suitable for sealing LED lighting, optical sensors, etc.! Colorless transparent hot melt.

Suitable for sealing LED lighting, optical sensors, etc.! Colorless transparent hot melt.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

A waterproof insert molding method that directly injects thermoplastic adhesives into electronic components! We have received many inquiries and requests in the past for applications such as LED lighting fixtures, decorative lighting, and optical sensors, but conventional materials had a strong yellow tint and issues with light transmittance. This time, we are introducing a material that not only supports low-pressure molding sealing of electronic components like traditional hot melts but also excels in light transmittance. <Expected products for use> - LED lighting equipment - Display devices using LEDs, etc. - Light-based sensors such as photo sensors and fiber sensors

  • Other polymer materials
  • Other electronic parts
  • Coating Agent
  • glue

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Introduction video for waterproof sealing of electrical components using hot melt molding.

Introduction video for waterproof sealing of electrical components using hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

  • Other polymer materials
  • Coating Agent
  • Other electronic parts
  • glue

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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Other electronic parts
  • Other semiconductors
  • Other optical parts
  • glue

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"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Circular Connectors
  • Rectangular Connector
  • Automotive Connectors
  • glue

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"Conductive Grade" Silver Epoxy

"Conductive Grade" Silver Epoxy

Ideal for semiconductor die attach and interconnection between modules and substrates.

The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.

  • Other electronic parts
  • Other semiconductors
  • IC tag
  • glue

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Heat Resistance Grade

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Pack-4.JPG
  • Other electronic parts
  • Other Auto Parts
  • Other motors
  • glue

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

While maintaining the high reliability characteristic of epoxy resin, it achieves rubber-like elasticity and stretch.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Rectangular Connector
  • Rectangular Connector
  • Automotive Connectors
  • glue

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Free sample of ultra-flexible epoxy adhesive.

Free sample of ultra-flexible epoxy adhesive.

Growing rapidly!? Growth rate over 200%! We are giving away samples of our super flexible epoxy adhesive to 30 lucky winners! A collection of case studies you want to read before selection.

Growing rapidly!? Over 200% growth rate!? We are currently giving away samples of our super flexible epoxy adhesive to 30 lucky winners through a lottery! The NICBOND sample in this giveaway is our self-developed adhesive, a culmination of years of experience and accumulated knowledge in applied chemistry. In addition to our standard lineup products that cater to a wide range of applications, we also offer bespoke solutions tailored to meet the specific needs of our customers. We have samples available for various adhesives including conductive, insulating, halogen-free, heat-dissipating, heat-resistant, and super flexible types. These can be applied to devices requiring a wide range of functionalities such as conductive applications, heat dissipation, device assembly, motor assembly, and connector assembly. *If you would like a sample, please feel free to contact us through the inquiry form. Additionally, for those who want to read before selection! Download our free case study collection on adhesives! We highly recommend it. [Contents Included] - Optical adhesives/UV-curable adhesives - Insulating heat-dissipating adhesives - Conductive adhesives

  • E-Parts All 1.jpg
  • Other machine elements
  • Other motors
  • Other Connectors
  • glue

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Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Meets ASTM standards! Ideal low outgassing adhesive for the manufacturing and assembly of aircraft and space equipment. *Other products are also in the process of evaluation applications!

The space adhesive provided by our company has been evaluated using the world-renowned standardization organization ASTM E 595 for gases emitted from space-grade organic materials, confirming compliance with the standards. It can be used in the manufacturing and assembly of aircraft and space equipment. Please refer to the catalog for specifications. 【Features】 ■ Evaluated for gases emitted from space-grade organic materials using the world-renowned standardization organization ASTM E 595 ■ Usable in the manufacturing and assembly of railway-related, aircraft, and space components and equipment ------------------------------------------------------------ Feel free to contact us for test results. * We are also applying for other product lines! ------------------------------------------------------------ * For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • glue

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USP Class VI compliant! Pharmacopoeia compliant adhesive

USP Class VI compliant! Pharmacopoeia compliant adhesive

Adhesive compliant with the pharmacopoeia for medical devices! A safe USP Class VI compliant product that can be widely used in medical devices such as gastroscopes and ultrasound examination equipment.

This is an adhesive that complies with the pharmacopoeia for medical devices. It meets the USP Class VI standards through third-party certification testing, including acute toxicity tests (intravenous or intraperitoneal administration tests in mice), intradermal reaction tests (administering specified extract solutions under rabbit skin), and implantation tests (implanting specified test pieces under rabbit skin). It can be useful for the assembly of medical devices such as endoscopes, ultrasound machines, and MRIs. 【Features】 ■ Complies with the pharmacopoeia for medical devices ■ Safe and widely usable for medical devices such as endoscopes and ultrasound machines, meeting USP Class VI standards *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • glue

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Solvent-free low linear expansion adhesive NICBOND NB3004

Solvent-free low linear expansion adhesive NICBOND NB3004

Solvent-free low expansion adhesive

This product is an adhesive that suppresses the coefficient of linear expansion to a level comparable to that of metals. The resulting cured material exhibits high adhesion and heat resistance. Despite being solvent-free, it achieves both a low coefficient of linear expansion and low viscosity. Since its coefficient of linear expansion is similar to that of metals, the risk of delamination issues is significantly reduced.

  • glue
  • Chemicals
  • glue

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High-performance adhesive "Anaerobic Adhesive"

High-performance adhesive "Anaerobic Adhesive"

It is a one-component type that begins to cure at room temperature when air is blocked during the adhesion of metal parts.

Alteco aims for further innovation in adhesives and adhesive technology through daily research and development, responding to the needs of the cutting-edge industrial sector. We provide custom-made products tailored to specific applications and purposes. 【Features】 ◆ Strong Adhesive Power This is a one-component type that begins to cure at room temperature when air is blocked during the adhesion of metal parts. It exhibits strong adhesive power for preventing loosening of screws in precision instruments, fitting, and structural bonding. ◆ Excellent Durability It excels in durability against heat, water, weather, and chemicals. ◆ Environmentally Friendly It is solvent-free and complies with RoHS directives. The product compatibility table (applications/properties/corresponding products, etc.) can be viewed by downloading the catalog.

  • glue
  • glue

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High-performance adhesive "Hybrid Adhesive"

High-performance adhesive "Hybrid Adhesive"

It is a one-component type that combines the quick curing properties of light-curing types with the durability of epoxy resin.

Alteco aims for further innovation in adhesives and adhesive technology through daily research and development, responding to the needs of the cutting-edge industrial sector. We provide custom-made products tailored to specific applications and purposes. 【Features】 ◆ Balances speed and strength This is a one-component type that combines the fast curing of light-curing types with the durability of epoxy resin. ◆ Temporary bonding is possible Temporary bonding can be achieved through ultraviolet irradiation, and further curing occurs with heating. ◆ Excellent durability It boasts outstanding durability against heat, water, weather, and chemicals. ◆ Environmentally conscious It is solvent-free and complies with RoHS directives. ◆ Others It is compatible with many materials and is widely used for bonding and mounting electronic and electrical components. The product compatibility table (characteristics/compatible products, etc.) can be viewed by downloading the catalog. ―――――――――――――――――――――――――――――――――――――――― ↓ ↓ ↓ ↓ ↓ ↓

  • glue
  • glue

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Instant adhesive [Ready to use right after opening (no needle needed) for improved work efficiency!]

Instant adhesive [Ready to use right after opening (no needle needed) for improved work efficiency!]

Increased work efficiency with a nozzle with holes and the industry's first screw cap! Additionally, its conical shape makes it less likely to tip over and allows for flexible holding positions!

Instant adhesive reacts instantly with trace amounts of moisture on the surface of the materials being bonded, demonstrating quick and strong adhesion. By using dedicated curing accelerators and primers for difficult-to-bond materials, you can further expand the scope and possibilities of your work. 【Needle-free container】 - Perforated nozzle! (Ready to use right after opening) - Screw cap! (Allows for opening verification. Industry first! Features a pilfer-proof mechanism!) - Cone shape (Stable and does not require a specific holding position) 【Features】 - Exhibits adhesive strength in seconds, enhancing work efficiency. - Compatible with most materials, boasting strong adhesion. - Apply the adhesive and bond the materials, and it will adhere firmly at room temperature, requiring no special equipment or tools. - Contains no organic solvents, making it safe for both people and the environment. - Excellent insulation properties, does not conduct electricity, and functions as a superior insulating material. - Colorless and transparent, providing a clean finish. Using a curing accelerator further enhances the whitening prevention effect. - Depending on usage conditions and environment, you can choose the optimal product from low viscosity to gel-like consistency, giving a custom-made feel. *For more details, please contact us or refer to the catalog.

  • glue
  • glue

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Epoxy resin-based adhesive

Epoxy resin-based adhesive

Adhesion is possible with many materials! We offer suitable grades to meet various needs.

Our "epoxy resin-based adhesive" exhibits excellent performance, including strong adhesion, heat resistance, and chemical resistance. It can bond a wide variety of materials, particularly excelling in bonding metals, concrete, and porous materials. Additionally, it does not contain volatile solvents, resulting in minimal shrinkage during curing. We offer suitable grades to meet various needs, from electrical and electronic applications to equipment uses. 【Features】 ■ Strong adhesion ■ Excellent durability ■ Low curing shrinkage ■ Electrical insulation ■ Environmentally friendly *For more details, please refer to the PDF document or feel free to contact us.

  • glue
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Light-curing adhesive type instant adhesive "HK Series"

Light-curing adhesive type instant adhesive "HK Series"

Immediate final strength reached upon exposure to light! Adhesion possible even with a clearance of about 10mm thickness.

The "HK Series" can be used as an instant adhesive and is a product that hardens due to moisture in areas not exposed to light. By exposing it to light, the curing process is accelerated, allowing for adhesion even with a clearance of about 10mm. After light exposure, it reaches its final strength immediately, which shortens the curing process. Additionally, by using a primer for difficult-to-bond materials, adhesion to PP, PE, silicone rubber, and others can also be achieved. 【Features】 ■ Shortens the curing process ■ Accelerates curing by exposure to light ■ Hardens due to moisture in areas not exposed to light ■ Achieves adhesion to PP, PE, silicone rubber, etc., by using a primer ■ Reduces whitening by quickly curing with light, preserving aesthetics *For more details, please refer to the PDF document or feel free to contact us.

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High-performance adhesive for motors

High-performance adhesive for motors

We offer products suitable for the assembly of motor parts for automobiles and more! Development of customized products is also possible.

At Arteco Co., Ltd., we provide "high-performance adhesives" suitable for the assembly of motor components in applications such as automobiles, industrial machinery, and electronics. We offer a range of products including "adhesives for motor bearings and fits," "adhesives for laminated (electromagnetic) steel sheets," "adhesives for motor magnets," and "curing agents (for anaerobic use)." We can also develop customized products tailored to your specific requirements and desired characteristics. 【Products Offered】 ■ Adhesives for motor bearings and fits ■ Adhesives for laminated (electromagnetic) steel sheets ■ Adhesives for motor magnets ■ Curing agents (for anaerobic use) *For more details, please refer to the PDF document or feel free to contact us.

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Easy to cut hardened materials with excellent workability! Industrial instant adhesive 'High Cutting Gel'

Easy to cut hardened materials with excellent workability! Industrial instant adhesive 'High Cutting Gel'

[Detailed video available] This is Arteco's industrial instant adhesive, effective for repairing scratches on wood and plastic, as well as filling small holes and bubbles!

Alteco's industrial instant adhesive "High Cutting Gel" has achieved ease of sanding and processing that conventional instant adhesives do not offer. It can be used for filling and repairing holes in floors and walls, as well as for repairing scratches on plastic products. The cured material is easy to sand and polish, and paint adheres well to it. When using, combining it with the separately sold curing accelerator "Spray Primer" will enhance the efficiency of bulk adhesive applications. Please use them together. 【Specifications】 ■ Capacity: 20g in an aluminum tube ■ Shipping unit: 20g x 25 tubes *For more details, please refer to the PDF document or feel free to contact us.

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Heat-resistant instant adhesive! Exhibits heat resistance up to 120 degrees, as well as water resistance and impact resistance.

Heat-resistant instant adhesive! Exhibits heat resistance up to 120 degrees, as well as water resistance and impact resistance.

This is our best heat-resistant instant adhesive, 'Alteco GH300', which exhibits about 10 times the impact resistance of general-purpose instant adhesives.

The heat-resistant performance (instant adhesive) "Alteco GH300" maintains high strength even in a 120°C environment. It is a high-performance instant adhesive that also possesses impact resistance and peel resistance. 【Specifications】 Model number: GH300 Appearance: Colorless transparent liquid Viscosity: 300 mPa·s *For more details, please download the PDF or contact us.

  • Interior parts
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Chip component fixing adhesive Seal-glo

Chip component fixing adhesive Seal-glo

Numerous application results with 1005CR! 'Seal-glo Chip Adhesive'. Compatible with high-speed dispensers and fine coating regardless of printing!

The Seal-glo NE series adhesive for temporarily fixing chip components can cure in a short time of 90 seconds at 90°C, minimizing the burden on the components. We offer various grades that excel in high-speed dispensing and fine printing to meet your needs. ■ Features - No issues with applying 1005CR bond (dispensing/printing) - Proven application of 0603CR bond (dispensing) - Confirmed ability to dispense with a nozzle inner diameter of Φ0.075mm - Achieves low-temperature curing at 90°C/90 seconds - Stable application shape with moderate peak height due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible ■ Curing Conditions ○ Recommended curing conditions vary by series. Since curing temperatures differ depending on dispensing or printing, please contact us for details. ○ Depending on the size and arrangement of the components mounted on the substrate, the actual temperature applied to the adhesive may vary, so please seek the optimal curing conditions. For more details, please download the PDF or contact us.

  • Circuit board processing machine
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Heat-resistant ceramic adhesive

Heat-resistant ceramic adhesive

Heat-resistant ceramic adhesive

【Features】 ● It is a smooth one-component paste, making it easy to apply to various metals, ceramics, graphite, and more. ● It exhibits excellent resistance to oxidative and reductive atmospheres, various solvents, molten metals, X-rays, and radiation. ● It is used in industries such as electronics, semiconductor manufacturing, aerospace, and automotive manufacturing for applications including adhesion, coating, thermocouple bonding, and heat-resistant surface formation.

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Hot Melt Adhesive Adhesion Compatibility Quick Reference Chart

Hot Melt Adhesive Adhesion Compatibility Quick Reference Chart

This is a quick reference chart for adhesive compatibility of hot melt adhesives with substrates.

This is a product handled by Sanyo Life Material Co., Ltd. For inquiries, please call 03-3518-2193. Hot melt adhesives are solid or semi-solid at room temperature and are applied in a liquid state when heated. They exhibit adhesive strength by solidifying again upon cooling. Our company offers a wide variety of hot melt adhesives as well as hot melt guns and applicators, allowing us to suggest the optimal combination based on your application. 【Substrates】 ■ Paper / Cardboard ■ Acrylic ■ Nylon ■ Rubber, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Easy binding of manuals and instruction manuals: Desktop binding machine

Easy binding of manuals and instruction manuals: Desktop binding machine

Easy binding of manuals and instruction manuals: Desktop binding machine

→→→ National Delivery Record No. 1! ←←← The binding machine "Toji-kun" has been active in over 30,000 companies in Japan since its release in 1984. Just turn on the switch, insert the document into the dedicated cover, and set it in Toji-kun! It’s ready when the buzzer sounds. With Toji-kun, you can easily bind various materials such as manuals, instruction guides, catalogs, and reports. 【Key Points】 ● It can bind up to a maximum spine width of 30mm (approximately 300 sheets of standard copy paper) with a surprisingly affordable price for such high-quality results. ● The cover of Toji-kun contains cotton mesh in the spine area, which significantly enhances the strength after binding. ● A wide variety of dedicated covers are available, suitable for official document storage to presentations, with sizes ranging from A5 to A3 and B5 to B4. ● It features an energy-saving design with a rated power consumption of 100W, yet it is well-known for its binding quality!

  • Paper Converting Machinery
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