We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 273 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 理経 Tokyo//IT/Telecommunications
  4. 4 東亞合成 新製品開発事業部　機能性接着剤部 Tokyo//Chemical
  5. 5 積水フーラー Tokyo//Chemical
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glue Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. One-component ultra-low temperature curing epoxy adhesive 'f·Stick 4410 series'
  2. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 Comprehensive Catalog "Industrial Adhesives" ノガワケミカル
  5. 5 Epoxy adhesive Araldite AV138M-1/HV998-1 寺田

glue Product List

991～1005 item / All 1143 items

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Waterproof sealing of electrical components: Hot melt molding

Waterproof sealing of electrical components: Hot melt molding

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

Significant reduction in processing time and number of parts! Insert molding waterproof method that directly injects thermoplastic adhesive into electronic components! In recent years, adoption in automotive parts has been expanding. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in number of parts 2. Reduction in amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog.

  • Coating Agent
  • Circuit board design and manufacturing
  • Other electronic parts

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High-performance adhesive "1-component epoxy resin adhesive"

High-performance adhesive "1-component epoxy resin adhesive"

It is compatible with many materials and exhibits strong adhesion. It is a one-component type that eliminates the hassle of mixing.

Alteco aims for further innovation in adhesives and adhesive technology through daily research and development, responding to the needs of the cutting-edge industrial sector. We provide custom-made products tailored to specific applications and purposes. 【Features】 ◆ Convenient one-component type The one-component type eliminates the hassle of mixing, enhancing work efficiency. ◆ Strong adhesion Compatible with many materials, it exhibits robust adhesive properties. ◆ Excellent durability It excels in heat resistance, water resistance, weather resistance, and chemical resistance, and is used in applications such as IC chip reinforcement agents and underfill materials. ◆ Environmentally friendly It is low in chlorine and bromine and complies with RoHS directives. A product compatibility chart (applications/properties/compatible products, etc.) can be viewed by downloading the catalog. ——————————————————————————————————————— ↓ ↓ ↓ ↓ ↓ ↓

  • glue

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Hot melt adhesive (PA: polyamide-based)

Hot melt adhesive (PA: polyamide-based)

Instant bonding and insulation sealing of electronic components!

It is possible to instantly complete the potting and fixing work of electronic components and wire harnesses.

  • glue

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Hot melt gun glue gun (desktop foot switch type)

Hot melt gun glue gun (desktop foot switch type)

Achieve precise coating and two-handed operation with foot switch control!

The tabletop foot switch type applicator allows for precise application of hot melt using a foot switch, making it ideal for gluing small boxes and items that require both hands, as well as for filling tasks with melt or resin.

  • glue
  • Other processing machines
  • Other packaging machines

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[Limited to 5 companies] Hot melt sealing material fine coating system

[Limited to 5 companies] Hot melt sealing material fine coating system

Automatic fine coating of 0.5 to 1.0 mm can improve work efficiency! Would you like to bring your substrate and try a free coating test?

The hot melt sealing material "Asahi Tack SG Series" is a 100% solid hot melt sealing material primarily composed of thermoplastic rubber. It enables automatic application in combination with robots, reducing labor and manual work on the production line. It has a proven track record in products requiring waterproofing, such as smartphones and tablets, and can accommodate fine coating of 0.5 to 1.0 mm, making it suitable for a wide range of products. We are currently offering free coating trials limited to five companies, so please feel free to inquire! (The substrates to be coated are plastic (heat-resistant) or metal) 【Features】 ■ Fine coating (0.5 to 1.0 mm) is possible ■ High waterproof performance (IP67/X8) ■ No need for gasket mold creation due to hot melt coating ■ Can accommodate changes in substrate shape ■ Easy to peel off *For more details, please contact us or download the PDF to view.

  • glue

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Hot melt adhesive for packaging "Asahi Melt Series"

Hot melt adhesive for packaging "Asahi Melt Series"

Asahi Melt will deliver benefits to your company.

This is a packaging hot melt adhesive used for sealing cardboard boxes and bonding small cartons. It is used as an alternative to tape sealing, and when sealed with hot melt adhesive, it requires no manual labor, improves productivity, and reduces running costs. Our "Asahi Melt" is used in everyday items such as sealing tissue boxes, ice cream boxes, direct mail envelopes, attaching handles (strings) to shopping bags, and bonding straw packs on beverage containers. We offer a lineup of series tailored to various applications. *For more details, please contact us.*

  • glue

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Low-temperature coating and packaging hot melt adhesive "Asahi Melt LR Series" 2

Low-temperature coating and packaging hot melt adhesive "Asahi Melt LR Series" 2

【Hot Melt for Packaging】Reduces costs and carbide issues with low-temperature application: Asahi Melt LR Series

To the production management and maintenance personnel of food, beverage, and daily necessities manufacturers, Are you currently facing issues with your EVA-based hot melt adhesive, such as "rising electricity costs," "nozzle clogging (carbonization)," and "line contamination due to stringing"? The "Asahi Melt LR Series" is a low-temperature application type of EVA-based hot melt adhesive that allows for use at 140-150°C. It achieves significant energy savings and reduces maintenance labor while maintaining adhesion strength superior to that of olefin-based adhesives. This product is ideal for sites facing such challenges: Beverage manufacturers: Want stable application on high-speed lines and to reduce carbonization troubles. Food manufacturers: Looking to improve the packaging room environment and reduce CO2 emissions. Daily necessities manufacturers: Aiming to lower inspection and disposal costs due to adhesion failures and contamination. [Contact Us / Sample Request] Please let us know your current challenges (cost, maintenance, adhesion failures, etc.) through the related link URL. Our representative will propose the optimal conditions for your production line. *Our representative will contact you promptly.

  • glue

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Introduction to Adhesives and Adhesive Technology - Basics, Functionality, Evaluation, Troubleshooting

Introduction to Adhesives and Adhesive Technology - Basics, Functionality, Evaluation, Troubleshooting

A must-attend course packed with essential knowledge about adhesives and bonding techniques that are currently in demand, covering everything from the basics to troubleshooting!

【Date and Time】January 27, 2011 (Thursday) 10:30-16:30 　【Lecture ends at 16:00. 16:00-16:30: Free time Q&A (reservation required, first-come, first-served)】 【Capacity】30 people *Once full, we will close applications. Please apply early. 【Participation Fee】48,300 yen per person (including tax, lunch, and text costs)

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Development Trends of Imidazole-based Curing Agents and Curing Accelerators for Epoxy Resin Formulations

Development Trends of Imidazole-based Curing Agents and Curing Accelerators for Epoxy Resin Formulations

★ What are the curing mechanisms of amine-based, anhydride, and catalytic hardeners? ★ What measures can be taken to improve heat resistance, weather resistance, impact resistance, and flexibility?

Speaker Part 1: Technical Consultant, Ph.D. Kazuo Kamagata Part 2: Shikoku Chemical Industrial Co., Ltd., Functional Materials Team, Mitsuichi Yoshinari Target Audience: Researchers and personnel interested in organic EL and organic EL materials Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: September 29, 2011 (Thursday) 13:00-16:15 Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people from one company *Limited to Tech-Zone members who apply by September 15. Membership registration is free. *After September 15, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people from one company. ◆When applying for the early bird discount, please select “1 person (early discount)” or “2 people (early discount)” in the number registration. ◆If 3 people from the same organization apply, the fee will be 69,300 yen.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!

Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Fundamentals and improvement of durability and weather resistance of construction adhesives and sealants, evaluation, and regulations.

Fundamentals and improvement of durability and weather resistance of construction adhesives and sealants, evaluation, and regulations.

It is essential to adapt to various quality requirements such as waterproofing, earthquake resistance, weather resistance, high durability, design, and environmental compatibility, and to maintain these for a long period!

☆You won't hear this anywhere else! An explanation of the waterproofing functions related to adhesive properties, dynamic followability, and long-term durability of difficult-to-bond materials being studied by the Architectural Institute of Japan and ISO committees, as well as the current situation regarding various contamination phenomena and future trends! ☆Preliminary content request service is currently available! We welcome your technical challenges!

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Laminating Adhesive "LAM"

Laminating Adhesive "LAM"

The curing method is UV! It is suitable for applications such as OLED low refractive index grids.

"LAM" is a laminate adhesive characterized by its unique combination of high adhesion strength and low refractive index. It offers a lineup including "LAM-134" with an adhesion strength of 200g/cm, "LAM-135" with 700g/cm, and "LAM-136" with 400g/cm. It has been introduced in various AR and VR displays and has received high praise. 【Specifications (partial)】 ■LAM-134 ・Refractive index (589nm): 1.346 ・Refractive index (950nm): 1.341 ・Elastic modulus (MPa): na ・Viscosity (CPS): 17000 ・Tensile strength (MPa): na *For more details, please refer to the related links or feel free to contact us.

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Evergrip

Evergrip

It is a rubber-based adhesive. There are two types: solvent-based and hot melt.

The industrial adhesive "Evergrip" has been developed for a wide range of applications including building materials, woodworking, automotive parts, packaging, industrial use, and shoemaking. Beyond the products listed in the catalog, we respond to our customers' diverse needs with advanced consulting techniques.

  • furniture

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