Subsidies available for the introduction of dicing equipment | Labor-saving investment subsidies
You can use a subsidy with a maximum limit of 100 million yen and a subsidy rate of 1/2 to 2/3 for the introduction of dicing equipment.
The introduction of dicing equipment can utilize the Small and Medium Enterprise Labor-Saving Investment Subsidy (General Type). Equipment that combines peripheral devices and automation tailored to the site is eligible. 【Examples of configurations targeting dicing machines】 ■ Delegate the cutting of wafers to fully automated equipment Reduce the time spent by personnel setting wafers one by one into the machine ■ Integrate cleaning and drying after cutting Reduce the time spent waiting for cleaning and the transportation before and after cutting ■ Automatically monitor blade wear and chipping Reduce the effort required for blade inspection and replacement decisions 【Support from Taigen】 Over 158 adoptions and a total subsidy amount of over 2.8 billion yen. Consultations are free. We will assist you from creating a business plan to application, and from adoption to grant application and performance reporting. *You can easily reserve a 60-minute free consultation by selecting a date from the QR code in the catalog.
- Company:Taigen
- Price:Other