We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for heat sink.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

heat sink(CPU) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 09, 2025～Aug 05, 2025
This ranking is based on the number of page views on our site.

heat sink Product List

16～27 item / All 27 items

Displayed results
LattePanda with cooling fan aluminum heat sink

LattePanda with cooling fan aluminum heat sink

By using a 2-pin jumper connector, you can easily connect to the CN2 header on the board.

The product features a thermal pad with adhesive on the back, which can be attached to the metal shield on the board. By using an aluminum case, the CPU's heat is quickly absorbed, demonstrating high performance. 【Specifications】 ■ Operating Voltage: 5V ■ Operating Current: 0.14A ■ Rated Speed: 7500RPM ■ Cable Length: 18cm ■ Interface Type: 2.54mm 2-pin DuPont female connector ■ Dimensions: 35 x 35 x 10 mm / 1.38 x 1.38 x 0.39" ■ Fan Dimensions: 30 x 30 x 7 mm / 1.18 x 1.18 x 0.28" ■ Weight: 14g *For more details, please refer to the external link or PDF materials, or feel free to contact us.

  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Microchannel Heat Sink 'M4040/M2020'

Microchannel Heat Sink 'M4040/M2020'

Uniform temperature across the entire surface with matrix flow channels! We also accommodate custom orders and mass production.

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Low thermal expansion, high thermal conductivity, heat sink.

Low thermal expansion, high thermal conductivity, heat sink.

The optimal heat sink requires a balance between thermal expansion rate and conductivity.

Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.

  • Non-ferrous metals
  • Other semiconductors
  • diode

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Water-cooled heat sink

Water-cooled heat sink

Outstanding cooling effect!

Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.

  • Other semiconductor manufacturing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to heat sink

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.