Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!
At Pureon, we propose a rapid thinning process that combines IRINO-PROSiC and diamond slurry PURE-DS-RT for high-speed grinding of SiC wafers, achieving significant cost reductions compared to conventional processing methods. This innovative combination not only ensures excellent surface quality but also guarantees a high processing rate, making it suitable for applications that require a smooth transition to the CMP process. The back side features a self-adhesive tape, allowing IRINO-PROSiC to be easily attached to existing metal plates, enhancing the usability and efficiency of SiC grinding tools. Whether you seek superior surface quality or high processing rates, IRINO-PROSiC is the ideal product for advanced SiC processing. 【Features】 ■ Innovative grinding pad suitable for the Rapid Thinning process ■ Optimal for grinding SiC ■ Surface finish at Ra 1 nm level ■ Highly competitive compared to conventional grinding processes ■ Flat finish that does not cause edge surface degradation ■ Usable on single-sided/double-sided polishing machines with flat plates (dressing required)
- Company：ピュアオンジャパン
- Price：Other
