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paste Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市） Tokyo//Trading company/Wholesale
  3. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  4. 4 中部アルミット工業 Aichi//Building materials, supplies and fixtures
  5. 5 石川金属 Osaka//Ferrous/Non-ferrous metals
Go to Company Ranking

paste Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum powder products, aluminum paste 東洋アルミニウム
  2. McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市）
  3. Solder Paste "TM-HP" 中部アルミット工業
  4. Concentrated paste "Jupe" ナリヅカコーポレーション 本社
  5. Gold-tin (AuSn) alloy paste - Explained in a video! Usage examples, features, and methods.

paste Product List

226～240 item / All 249 items

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Soldering of fine details! Solder paste for fine jet dispensing.

Soldering of fine details! Solder paste for fine jet dispensing.

It supports high-speed discharge with a dot diameter of Φ150μm. It enables soldering in fine areas that are difficult to handle manually!

The "winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components with three-dimensional structures that are difficult to print, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are challenging to print (such as warping and expansion). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.

  • Other consumables

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Rapid Hardening Emergency Repair Paste "MeCaFix100Express"

Rapid Hardening Emergency Repair Paste "MeCaFix100Express"

The working time is 3 minutes and it cures within 1 hour! For repairing leaks in tanks and pipes.

"MeCaFix 100 Express" is a fast-setting emergency repair paste composed of two components used in a 1:1 volume ratio. The working time is 3 minutes, and it hardens within 1 hour. It is suitable for repairing leaks in tanks and pipes, sealing, and regenerating screws, keyways, and shafts. 【Coverage Area】 ■ Theoretical Coverage Area - For 1m²: applying 100g at a thickness of 0.066mm ■ Actual Coverage Area - Theoretical Coverage Area × (100% - Loss %) *For more details, please refer to the PDF document or feel free to contact us.

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  • Repair Agent
  • Other consumables

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OKS Lubricating Oil Paste

OKS Lubricating Oil Paste

OKS products provide the best performance with guaranteed maximum processing capacity.

OKS Corporation is one of the world's oldest manufacturers of specialty lubricants and is adopted by global companies in various fields. Oil Key, as the only authorized dealer in Japan, delivers OKS products. Even products that are out of stock can be ordered from OKS in Germany. Please contact us once.

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  • Lubricants

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Halogen-free solder paste "EVASOL 3700 Series"

Halogen-free solder paste "EVASOL 3700 Series"

All halogens are additive-free! Compatible with laser heating methods.

The "EVASOL 3700 Series" does not contain any halogens, including chlorine (Cl) and bromine (Br). It is a solder paste that complies with all current halogen-free standards. It uses a special activator that enables rapid heating implementation with light. This reduces slumping during heating and resolves issues with solder balls. Additionally, it prevents the reaction between the flux and the powder. Even with minimal discharge, it achieves high coating stability. 【Features】 ■ Complies with halogen-free standards ■ Prevents solder balls ■ Stable discharge *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Laser printing solder paste "EVASOL 8239 Series"

Laser printing solder paste "EVASOL 8239 Series"

Good finish even with rapid heating from lasers; compatible with printing methods.

Compatible with laser methods The 'EVASOL 8239 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for solder pastes for lasers to accommodate printing methods. It is now possible to transfer using existing equipment. Compliant with halogen-free standards It does not contain Cl and Br, which are causes of dioxin generation. It complies with most halogen-free standards. 【Features】 ■ Prevents solder balls ■ Stable viscosity characteristics ■ Compliant with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Anti-spatter solder paste "EVASOL 8850 Series"

Anti-spatter solder paste "EVASOL 8850 Series"

Compliant with the J-STD-709 halogen-free standard, good wettability and high assembly quality.

Reduce flux scattering The 'EVASOL 8850 series' does not contain surfactants that cause flux scattering during reflow heating, achieving a reduction in scattering. Good wettability, compatible with low Ag The use of special surfactants allows for the use of low Ag alloys. It achieves both halogen-free and cost reduction. Reduction of chip side balls Due to improved heat resistance of the flux, it easily accommodates low Ag. This reduces the impact of metal market fluctuations and enables cost reduction. 【Features】 ■ Reduces flux scattering ■ Good wettability, compatible with low Ag ■ Reduction of chip side balls *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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LED mounting solder paste "EVASOL 8860 Series"

LED mounting solder paste "EVASOL 8860 Series"

Colorless residue suitable for LEDs with high insulation properties even in high-temperature environments.

Colorless Residue The "EVASOL 8860 Series" selects a colorless base material to suppress the coloring of residues. There is no discoloration over time, and a beautiful appearance of the assembly is maintained. Electrical Insulation at High Temperatures By optimizing the type and amount of surfactants, insulation is maintained even at high temperatures. This prevents malfunctions in LED lighting equipment used in harsh environments. Compatible with Low Ag It is compatible with low Ag alloys and has already been adopted in practice. This reduces the impact of fluctuations in metal prices and enables cost reduction. 【Features】 ■ Residue is colorless, providing a beautiful appearance ■ Compatible with low Ag alloys ■ High insulation even at high temperatures *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Laser printing solder paste "EVASOL 8229 Series"

Laser printing solder paste "EVASOL 8229 Series"

Good finish even with rapid laser heating, compatible with printing methods.

Compatible with laser processing The 'EVASOL 8229 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for laser solder pastes to accommodate printing methods. This product is now compatible, allowing transfer with existing equipment. A new operational method By combining light heating and printing, a new operational method has become possible. SMT components such as QFPs can be mounted in a short time without using a reflow oven. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of SMT packages ■ Stable viscosity characteristics *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Low Residue Solder Paste "EVASOL 6001 Series"

Low Residue Solder Paste "EVASOL 6001 Series"

Reduce residue volume, compatible with ICT testing, good wettability and high assembly quality.

Compatible with ICT testing The 'EVASOL 6001 series' uses a special base material in the flux to reduce residue levels. It demonstrates a high vertical rate in ICT testing. Good wettability It uses a special surfactant and shows wettability equivalent to products with normal residue levels. High printing stability It prevents reactions between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ High vertical rate in continuity testing ■ High stability in continuous printing ■ Good wettability *For more details, please refer to the PDF materials or feel free to contact us.

  • Solder

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Low melting point solder paste "EVASOL 7610 Series"

Low melting point solder paste "EVASOL 7610 Series"

Compliant with the J-STD-709 halogen-free standard, enabling low-temperature mounting with low-melting-point solder alloys.

Adoption of low melting point solder alloy The "EVASOL 7610 series" has been specially designed to accommodate the mounting of heat-sensitive components. It addresses the unique challenges associated with non-heat-resistant parts. Compatible with low-temperature reflow It demonstrates good wettability even at low temperatures of 160°C. This prevents soldering defects and enhances reliability. Compliant with halogen-free standards It does not contain Cl or Br, which are the causes of dioxin generation. It complies with most halogen-free standards. 【Features】 ■ Good wettability ■ Compatible with low-temperature reflow ■ Compliant with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Cleaning-compatible solder paste "EVASOL 8820 Series"

Cleaning-compatible solder paste "EVASOL 8820 Series"

Achieving excellent cleaning performance, good wettability, and high mounting quality.

Corresponding to the cleaning process The 'EVASOL 8820 series' uses materials with high compatibility with solvents based on flux. It improves the cleanability of flux residues. Good wettability It uses special surfactants and demonstrates wettability equivalent to that of standard no-clean solder paste. High printing stability It prevents the reaction between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ Good cleanability ■ High printing stability ■ Good wettability *For more details, please refer to the PDF document or feel free to contact us.

  • Solder

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Laser solder paste "EVASOL 3232 Series"

Laser solder paste "EVASOL 3232 Series"

Supports rapid heating by laser, specialized for the implementation of micro components.

Halogen-free standard compliant Does not contain Cl and Br, which are the causes of dioxin generation. Complies with most halogen-free standards. Prevention of solder balls Uses a special activator that enables rapid heating implementation by laser. Reduces slumping during heating and resolves solder ball issues. Specialized for micro components Designed specifically to accommodate the implementation of micro components. Addresses challenges unique to micro components. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of narrow pitch terminals ■ Complies with halogen-free standards *For more details, please refer to the PDF materials or feel free to contact us.

  • Solder

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Sn-Pb syringe solder paste "SOLDIM Series"

Sn-Pb syringe solder paste "SOLDIM Series"

High-intensity solder for laser applications type BH63G3228G-HR

This is a solder paste that uses high-strength solder alloy. It is suitable for mounting in areas where reliability is required, such as automotive electronic components. It uses a special activator that enables rapid heating implementation with light. This reduces slumping during heating and resolves issues with solder balls.

  • Solder

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Sn-Pb syringe solder paste "SOLDIM Series"

Sn-Pb syringe solder paste "SOLDIM Series"

Residue Flow Prevention Type BH63E3021F

Using a flux with high melting viscosity, it is compatible with rapid heating implementation by light. It suppresses the flow out of the flux during heating, resulting in a good appearance after implementation.

  • Solder

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Sn-Pb syringe solder paste "SOLDIM Series"

Sn-Pb syringe solder paste "SOLDIM Series"

Laser Dispense Type BH63J3229G

Using a special activator that enables rapid heating implementation with light. It reduces sagging during heating and solves issues with solder balls.

  • Solder

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