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paste Product List and Ranking from 69 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市） Tokyo//Trading company/Wholesale
  3. 石川金属 Osaka//Ferrous/Non-ferrous metals
  4. 4 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  5. 5 Celanese Electronic Material K. K. Kanagawa//Chemical
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paste Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Concentrated paste "Jupe" ナリヅカコーポレーション 本社
  2. Gold-tin (AuSn) alloy paste - Explained in a video! Usage examples, features, and methods.
  3. McDermid Alpha Solder Paste Innolot セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市）
  4. 4 Toyota Motor recommended solder paste 'GSP'
  5. 5 Aluminum powder products, aluminum paste 東洋アルミニウム

paste Product List

1～30 item / All 258 items

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High-temperature anti-seizing and galling paste - Nickel High Temp

High-temperature anti-seizing and galling paste - Nickel High Temp

High-temperature anti-seizing and galling paste Nickel High Temp

Nickel high-temp is a compound paste that does not contain lead, copper, graphite, chlorine, or other halides, phosphorus, or silicone, making it suitable for sealing gaskets in ammonia, acetylene, vinyl monomers, and atmospheres. Since it does not contain graphite, it is ideal for protecting stainless steel parts used at temperatures above 288°C. Operating temperature range: -54°C to 1427°C.

  • Heating device
  • Other process controls
  • Fats and oils
  • paste

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Low melting point lead-free solder paste for SMT "PF142-LT7TO"

Low melting point lead-free solder paste for SMT "PF142-LT7TO"

A halogen-free solder paste with good wettability, despite being a Sn/Bi alloy!

The solder paste "PF142-LT7TO" is developed for Sn/Bi-based alloys. It meets halogen-free standards while ensuring good wettability. 【Features】 ○ Good wettability despite being halogen-free ○ Excellent soldering characteristics even at low-temperature reflow For more details, please contact us through our website.

  • Other consumables
  • paste

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Lead-free solder paste for automotive use

Lead-free solder paste for automotive use

Three unit manufacturers collaborate with a solder manufacturer for joint development! Compared to our conventional products, each performance has significantly improved.

GPS, while designed for automotive use, demonstrates excellent printability. It also shows superior printability in narrow gaps, with no changes observed after rolling. Even under stringent reflow conditions (low-temperature profile), it exhibits significantly better characteristics in wetting properties, void characteristics, and solder ball performance compared to our conventional products.

  • Solder
  • paste

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Lead-free solder paste for automotive use "GSP"

Lead-free solder paste for automotive use "GSP"

Jointly developed products with three unit manufacturers and a solder manufacturer!

"GSP" is a jointly developed product by three unit manufacturers (Toyota Motor Corporation, Denso Corporation, and Fujitsu Ten Corporation) and a solder manufacturer (Arakawa Chemical, among others). It features high insulation resistance (initial value: ≧10^9Ω), resistance to cracking, good wetting properties, suppression of solder balls, and excellent soldering characteristics with low voids. Furthermore, it is capable of maintaining its initial characteristics even after continuous rolling for 4 hours. 【Features】 ■ For automotive use ■ Lead-free ■ Excellent reliability ■ Superior soldering characteristics ■ Maintains initial characteristics even after continuous rolling for 4 hours *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others
  • paste

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Lead-free solder paste "PSP-V"

Lead-free solder paste "PSP-V"

Reliability, excellent soldering characteristics, good continuous usability! Lead-free solder paste for automotive use.

The "PSP-V" is a lead-free solder paste for automotive use that excels in residue cracking resistance. It has excellent soldering characteristics, with almost no viscosity change even after continuous printing for 12 hours. 【Features】 ■ For automotive use ■ Lead-free ■ Excellent residue cracking resistance ■ Good wetting, printability, and solder ball suppression ■ Good continuous usability *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others
  • paste

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Lead-free solder paste "XFP LF138"

Lead-free solder paste "XFP LF138"

Significant cost reduction by switching from glass-based to paper phenol! Completely halogen-free.

The "XFP LF138" is a low-melting point, halogen-free, lead-free solder paste that achieves significant cost reduction by switching from glass-based to paper phenol. It eliminates hand insertion and dipping, allowing for bulk reflow. This greatly streamlines the process, contributing to energy savings and CO2 reduction. 【Features】 ■ Completely halogen-free ■ Lead-free ■ Significant cost reduction ■ Eliminates dipping for bulk reflow ■ Major process streamlining *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others
  • paste

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Carbon paste

Carbon paste

Electronic material "carbon paste"

Our carbon paste is primarily used for sliding applications such as volume controls. Through years of research and development, we offer a wide range of products including long-life, low-cost general-purpose, low-noise, contact, and built-in multilayer board types, and we also provide specialized carbon pastes tailored to specific applications.

  • Resistors
  • plastic
  • Printed Circuit Board
  • paste

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Conductive paste/thick film paste/insulating paste for ceramic electronic components

Conductive paste/thick film paste/insulating paste for ceramic electronic components

We offer a variety of RoHS-compliant products, including thermistor paste, conductor paste, dielectric paste, and more.

We offer a variety of thick film pastes for ceramic substrates (RoHS compliant). Conductive pastes (gold, silver, silver-palladium, and others), thermistor pastes, resistor pastes, dielectric pastes, and various types of glass pastes are available. We can accommodate small quantities as well. Please feel free to contact us.

  • Printed Circuit Board
  • others
  • paste

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High thermal conductivity adhesive / die attach paste ATROX series

High thermal conductivity adhesive / die attach paste ATROX series

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.

  • Dedicated IC
  • paste

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Silver paste

Silver paste

This is a silver paste manufactured with a unique formulation that is optimal for circuit printing. We have received orders for this product specified by overseas customers as well.

Our printed resistive substrate manufacturer produces and uses the printed resistive material 'silver paste.' This silver paste is uniquely formulated for optimal circuit printing. Our silver paste has received high trust and evaluation both domestically and internationally. We have also received orders for this product specifically from overseas customers.

  • Resistors
  • paste

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Senju Metal Industry Inner Bump Paste

Senju Metal Industry Inner Bump Paste

Semiconductor Paste BPS Series

M705-BPS is a lead-free solder paste developed for fine bump formation. It demonstrates good printability and stencil release at fine pitch, ensuring a stable amount of solder. Additionally, there are no occurrences of voids within the bumps.

  • Other metal materials
  • paste

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Lead-free solder paste

Lead-free solder paste

Improved overall balance, including printability and smudging.

Solder paste that suppresses the generation of solder balls (side balls and capillary balls) during reflow.

  • Other electronic parts
  • others
  • paste

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All-round type lead-free solder paste

All-round type lead-free solder paste

Adoption of newly developed flux.

The addition of a new surfactant significantly improved the wettability of the lead-free solder paste.

  • others
  • paste

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Lead solder paste

Lead solder paste

Using conventional leaded solder.

A long-selling product with excellent reliability and high performance, backed by years of know-how.

  • others
  • paste

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Lead-free low silver solder paste "FLF30-AZ"

Lead-free low silver solder paste "FLF30-AZ"

Intentionally added Ni and Ge to the low-silver type that emphasizes low cost! Connection reliability has significantly improved.

The "FLF30-AZ" suppresses the growth of intermetallic compound layers due to the intentional addition of Ni, resulting in improved connection reliability. Additionally, it has transitioned from a conventional Ag3% alloy to an Ag1% alloy, and the reduction in the amount of expensive Ag has been mitigated by the new development of flux, which has improved wetting performance. 【Features】 ○ Suppresses the growth of intermetallic compound layers through intentional addition of Ni ○ Improved connection reliability ○ Significant cost reduction by reducing the amount of expensive Ag ○ Improved wetting performance due to the new development of flux ● For more details, please download the catalog or contact us.

  • Solder
  • paste

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Polymer-type conductive paste

Polymer-type conductive paste

Achieving printing with the same performance as silver paste at a lower cost!

As an alternative to silver paste, this is a polymer-based conductive paste that can be printed and manufactured at low cost while maintaining the same performance. It can be used for PTF paste specifically designed for flexible substrates such as PET film membrane switches, touch panel switches, EL elements, FPCs, as well as various pastes for keyboard switches, jumper circuits, and through-hole connections. 【ACP Series】 ◆ Features: Achieves low cost and high quality by uniquely mixing silver and copper. ◆ Conductive Powder: Silver and Copper ◆ Shelf Life: 3 months 【SW Series】 ◆ Features: Achieves superior conductivity compared to conventional products. ◆ Conductive Powder: Silver ◆ Shelf Life: 6 months (refrigerated below 10°C) *For more details, please inquire through a request for materials or download.

  • paint
  • paste

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High flexibility silver paste "SW1600C"

High flexibility silver paste "SW1600C"

Achieves both high adhesion and bending resistance! Ideal for electromagnetic wave shielding applications.

The high-flexibility silver paste "SW1600C" achieves excellent EMI shielding hardening by ensuring the specified film thickness. It balances high adhesion and bend resistance. Even in bending tests under low-temperature conditions, the maintenance of characteristics such as bend resistance can be measured. It is ideal for electromagnetic wave shielding applications. 【Features】 ○ Ensures the specified film thickness for high EMI shielding hardening ○ Balances high adhesion and bend resistance ○ Ideal for electromagnetic wave shielding applications For more details, please contact us or download the catalog.

  • paint
  • paste

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High heat-resistant decorative paste "CCR-432 Series"

High heat-resistant decorative paste "CCR-432 Series"

It is a decorative paste with high adhesion, high heat resistance, and high chemical resistance.

Asahi Chemical Research Institute Co., Ltd. provides electronic materials such as resist inks for printed circuit boards and silver and carbon pastes for touch panel and membrane substrates. The high heat-resistant decorative paste "CCR-432 Series" is a decorative paste with high adhesion, high heat resistance, and high chemical resistance. 【Features】 ○ High adhesion (glass substrate) ○ High heat resistance (low yellowing) ○ High chemical resistance (acid resistance, alkali resistance) For more details, please contact us or download the catalog.

  • paint
  • paste

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Ultra-fine line printing paste "LS-460H-2"

Ultra-fine line printing paste "LS-460H-2"

We aim to achieve L/S=30/30μm through screen printing.

Asahi Chemical Research Institute Co., Ltd. provides electronic materials such as resist inks for printed circuit boards and silver and carbon pastes for touch panels and membrane substrates. The ultra-fine line printing paste "LS-460H-2" uses ultra-fine silver particles and a special binder, optimizing viscosity for fine line printing applications. We aim to achieve L/S=30/30μm through screen printing. 【Features】 - Uses ultra-fine silver particles and a special binder - Optimizes viscosity for fine line printing applications - Aims to achieve L/S=30/30μm through screen printing For more details, please contact us or download the catalog.

  • paint
  • paste

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Laser processing Ag paste

Laser processing Ag paste

It is possible to beautifully process ultra-fine electrodes with a low-output laser! Ag paste for laser processing.

The "Ag paste for laser processing" is effective in forming frame electrodes for touch panels using laser methods. It excels in cutability with lasers, allowing for clean processing at low power. It improves the dispersion of silver powder and reduces the number of coarse silver particles remaining on the space after cutting. 【Features】 ■ Formation of ultra-fine line electrode circuits with L/S=20/20μm ■ Excellent cutability with lasers ■ Clean processing possible at low power ■ Improved dispersion of silver powder ■ Reduction of coarse silver particles remaining on the space *For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials
  • paste

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Conductive paste "Dotalite" Printed Electronics Series

Conductive paste "Dotalite" Printed Electronics Series

Fine line printing is possible with screen printing! Optimization of the formulation achieves low resistance in polymer types.

This document introduces the conductive paste "Dotaite" Printed Electronics series. It includes detailed information on the "PE printing method and line width overview," as well as the product's "fine line printing capability," "low resistance," and "high flexibility." Explanations are provided clearly using diagrams. Please feel free to download and take a look. 【Contents】 ■ PE printing method and line width overview ■ Fine line printing capability (1) – (3) ■ Low resistance (1) – (2) ■ High flexibility ■ Water-soluble ■ Stretchability and moldability ■ Other variations (1) *For more details, please refer to the PDF document or feel free to contact us.

  • Printing Machinery
  • Other electronic parts
  • paste

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Conductive paste "Dotaite" conductive adhesive series

Conductive paste "Dotaite" conductive adhesive series

We offer a lineup of high-adhesion types and tin electrode compatible types! We also include a "quick reference chart" that clearly shows the curing temperature at a glance!

This document introduces the conductive paste "Dotaite" conductive adhesive series. It includes a "Quick Reference Guide for Selecting Conductive Adhesives," as well as "Property Tables" and "Examples of Applications," presented with charts and diagrams. Please make use of this information for product selection. [Contents] ■ Quick Reference Guide for Selecting Conductive Adhesives ■ Lineup of Conductive Adhesives ■ Conductive Adhesive Property Tables ■ Examples of Conductive Adhesive Applications ■ Status of Overseas Inventory Registration *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • glue
  • paste

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Conductive paste "DOTITE" - Materials with specification sheet provided.

Conductive paste "DOTITE" - Materials with specification sheet provided.

Various series such as conductive adhesives, wiring and contact materials for printed circuit boards, and EMI shielding materials are available.

"DOTITE" is a conductive paste that our company has been developing, manufacturing, and selling for over half a century. With advanced polymerization, synthesis, and dispersion technologies, we offer a wide range of product series suitable for various applications, including adhesives, EMI shielding, and printed circuits. Customization is also possible to meet your specific needs regarding conductivity, application methods, application targets, and additional functions. 【Series Lineup】 ■ Conductive Adhesive Series… Featuring 9 types with various characteristics, including low-temperature curing ■ EMI Shielding Material Series… Includes types compatible with high-frequency absorption for 5G and millimeter waves ■ Printed Electronics Series… Suitable for applications requiring ultra-fine line printing and bending ■ Stretchable and Molding Series… Types designed for wearable devices and thermal molding *We are currently offering materials that introduce the characteristics and application examples of each series! You can view them via "PDF Download." Please feel free to contact us with any inquiries.

  • Other polymer materials
  • paste

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Introduction of the high conductivity, low-cost silver paste "Dotaite XA-9565".

Introduction of the high conductivity, low-cost silver paste "Dotaite XA-9565".

Introducing a silver paste that achieves high conductivity through low-temperature curing.

Introducing a silver paste that achieves high conductivity through low-temperature curing! This document presents the 'Dotaite XA-9565', which has achieved a low price comparable to polymer-type silver pastes within the high conductivity series of the conductive paste 'Dotaite'. It includes sections such as "Product Overview and Key Characteristics," "Comparison with Competing Materials," and "Examples of Applicable and Expected Applications," all illustrated with charts and graphs. Please feel free to download and take a look. [Contents] ■ Product Overview, Key Characteristics, and Usage Instructions ■ Comparison with Competing Materials and Advantages ■ Examples of Applicable and Expected Applications ■ Lineup of High Conductivity Pastes, including this product *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • paste

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Development of conductive pastes and inks, surface treatment, synthesis, and evaluation of metal nanoparticles.

Development of conductive pastes and inks, surface treatment, synthesis, and evaluation of metal nanoparticles.

- Low-temperature and room-temperature sintering of Ag-based materials - Cu-based antioxidant - Surface oxidation control - Dispersion stabilization - Conductivity improvement - Optimal adjustment methods according to various printing techniques

This book focuses on "conductive pastes, particularly copper and silver," and is an unparalleled resource that covers surface treatment, manufacturing, synthesis, evaluation as firing thin films, application development, and future markets specifically for paste materials specialized in copper (Cu) and silver (Ag). It highlights challenges with a particular emphasis on ink and paste technology, covering key points comprehensively. Additionally, it includes significant applications such as printed electronics and touch panel wiring materials, particularly focusing on antioxidant properties in copper paste and low-temperature sintering and low resistance in silver paste. This book encompasses specific surface treatment methods that are not found in other similar publications. It can be considered a cutting-edge technical book written by leading researchers in this field. I hope it serves as a guide for readers considering the development of conductive pastes and inks to create new products.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical and Reference Books
  • Composite Materials
  • Rare metals
  • paste

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Rust preventive coating "ZAP Paste" application example [at the base of steel posts]

Rust preventive coating "ZAP Paste" application example [at the base of steel posts]

Coating-type anti-corrosion paste "ZAP Paste" application example [Ground level of steel columns]

Coating-type anti-corrosion paste "ZAP Paste" that realizes a thick film and also possesses sacrificial corrosion protection properties. Application example: [Ground level of steel columns].

  • paint
  • paste

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Rust prevention coating "ZAP Paste" application example [at the base of a steel tower]

Rust prevention coating "ZAP Paste" application example [at the base of a steel tower]

Coating-type anti-corrosion paste "ZAP Paste" Application example [Base of steel towers]

Coating-type anti-corrosion paste "ZAP Paste" that realizes a thick film and also has sacrificial corrosion protection properties. Application example: [Base of iron towers].

  • paint
  • paste

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