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paste Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  3. 中部アルミット工業 Aichi//Building materials, supplies and fixtures
  4. 4 石川金属 Osaka//Ferrous/Non-ferrous metals
  5. 4 null/null
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paste Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum powder products, aluminum paste 東洋アルミニウム
  2. Solder Paste "TM-HP" 中部アルミット工業
  3. Concentrated paste "Jupe" ナリヅカコーポレーション 本社
  4. Gold-tin (AuSn) alloy paste - Explained in a video! Usage examples, features, and methods.
  5. 5 Toyota Motor recommended solder paste 'GSP'

paste Product List

1～15 item / All 244 items

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High-temperature anti-seizing and galling paste - Nickel High Temp

High-temperature anti-seizing and galling paste - Nickel High Temp

High-temperature anti-seizing and galling paste Nickel High Temp

Nickel high-temp is a compound paste that does not contain lead, copper, graphite, chlorine, or other halides, phosphorus, or silicone, making it suitable for sealing gaskets in ammonia, acetylene, vinyl monomers, and atmospheres. Since it does not contain graphite, it is ideal for protecting stainless steel parts used at temperatures above 288°C. Operating temperature range: -54°C to 1427°C.

  • Heating device
  • Other process controls
  • Fats and oils

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Low melting point lead-free solder paste for SMT "PF142-LT7TO"

Low melting point lead-free solder paste for SMT "PF142-LT7TO"

A halogen-free solder paste with good wettability, despite being a Sn/Bi alloy!

The solder paste "PF142-LT7TO" is developed for Sn/Bi-based alloys. It meets halogen-free standards while ensuring good wettability. 【Features】 ○ Good wettability despite being halogen-free ○ Excellent soldering characteristics even at low-temperature reflow For more details, please contact us through our website.

  • Other consumables

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Lead-free solder paste for automotive use

Lead-free solder paste for automotive use

Three unit manufacturers collaborate with a solder manufacturer for joint development! Compared to our conventional products, each performance has significantly improved.

GPS, while designed for automotive use, demonstrates excellent printability. It also shows superior printability in narrow gaps, with no changes observed after rolling. Even under stringent reflow conditions (low-temperature profile), it exhibits significantly better characteristics in wetting properties, void characteristics, and solder ball performance compared to our conventional products.

  • Solder

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Lead-free solder paste for automotive use "GSP"

Lead-free solder paste for automotive use "GSP"

Jointly developed products with three unit manufacturers and a solder manufacturer!

"GSP" is a jointly developed product by three unit manufacturers (Toyota Motor Corporation, Denso Corporation, and Fujitsu Ten Corporation) and a solder manufacturer (Arakawa Chemical, among others). It features high insulation resistance (initial value: ≧10^9Ω), resistance to cracking, good wetting properties, suppression of solder balls, and excellent soldering characteristics with low voids. Furthermore, it is capable of maintaining its initial characteristics even after continuous rolling for 4 hours. 【Features】 ■ For automotive use ■ Lead-free ■ Excellent reliability ■ Superior soldering characteristics ■ Maintains initial characteristics even after continuous rolling for 4 hours *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others

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Lead-free solder paste "PSP-V"

Lead-free solder paste "PSP-V"

Reliability, excellent soldering characteristics, good continuous usability! Lead-free solder paste for automotive use.

The "PSP-V" is a lead-free solder paste for automotive use that excels in residue cracking resistance. It has excellent soldering characteristics, with almost no viscosity change even after continuous printing for 12 hours. 【Features】 ■ For automotive use ■ Lead-free ■ Excellent residue cracking resistance ■ Good wetting, printability, and solder ball suppression ■ Good continuous usability *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others

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Lead-free solder paste "XFP LF138"

Lead-free solder paste "XFP LF138"

Significant cost reduction by switching from glass-based to paper phenol! Completely halogen-free.

The "XFP LF138" is a low-melting point, halogen-free, lead-free solder paste that achieves significant cost reduction by switching from glass-based to paper phenol. It eliminates hand insertion and dipping, allowing for bulk reflow. This greatly streamlines the process, contributing to energy savings and CO2 reduction. 【Features】 ■ Completely halogen-free ■ Lead-free ■ Significant cost reduction ■ Eliminates dipping for bulk reflow ■ Major process streamlining *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others

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Carbon paste

Carbon paste

Electronic material "carbon paste"

Our carbon paste is primarily used for sliding applications such as volume controls. Through years of research and development, we offer a wide range of products including long-life, low-cost general-purpose, low-noise, contact, and built-in multilayer board types, and we also provide specialized carbon pastes tailored to specific applications.

  • Resistors
  • plastic
  • Printed Circuit Board

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Conductive paste/thick film paste/insulating paste for ceramic electronic components

Conductive paste/thick film paste/insulating paste for ceramic electronic components

We offer a variety of RoHS-compliant products, including thermistor paste, conductor paste, dielectric paste, and more.

We offer a variety of thick film pastes for ceramic substrates (RoHS compliant). Conductive pastes (gold, silver, silver-palladium, and others), thermistor pastes, resistor pastes, dielectric pastes, and various types of glass pastes are available. We can accommodate small quantities as well. Please feel free to contact us.

  • Printed Circuit Board
  • others

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High thermal conductivity adhesive / die attach paste ATROX series

High thermal conductivity adhesive / die attach paste ATROX series

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.

  • Dedicated IC

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Silver paste

Silver paste

This is a silver paste manufactured with a unique formulation that is optimal for circuit printing. We have received orders for this product specified by overseas customers as well.

Our printed resistive substrate manufacturer produces and uses the printed resistive material 'silver paste.' This silver paste is uniquely formulated for optimal circuit printing. Our silver paste has received high trust and evaluation both domestically and internationally. We have also received orders for this product specifically from overseas customers.

  • Resistors

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Senju Metal Industry Inner Bump Paste

Senju Metal Industry Inner Bump Paste

Semiconductor Paste BPS Series

M705-BPS is a lead-free solder paste developed for fine bump formation. It demonstrates good printability and stencil release at fine pitch, ensuring a stable amount of solder. Additionally, there are no occurrences of voids within the bumps.

  • Other metal materials

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Lead-free solder paste

Lead-free solder paste

Improved overall balance, including printability and smudging.

Solder paste that suppresses the generation of solder balls (side balls and capillary balls) during reflow.

  • Other electronic parts
  • others

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Lead-free low silver solder paste "FLF30-AZ"

Lead-free low silver solder paste "FLF30-AZ"

Intentionally added Ni and Ge to the low-silver type that emphasizes low cost! Connection reliability has significantly improved.

The "FLF30-AZ" suppresses the growth of intermetallic compound layers due to the intentional addition of Ni, resulting in improved connection reliability. Additionally, it has transitioned from a conventional Ag3% alloy to an Ag1% alloy, and the reduction in the amount of expensive Ag has been mitigated by the new development of flux, which has improved wetting performance. 【Features】 ○ Suppresses the growth of intermetallic compound layers through intentional addition of Ni ○ Improved connection reliability ○ Significant cost reduction by reducing the amount of expensive Ag ○ Improved wetting performance due to the new development of flux ● For more details, please download the catalog or contact us.

  • Solder

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