Dual Boost Solder Paste "LFM-48 NH-GE(H)"
Not only improved wettability but also enhanced reliability! It is possible to efficiently discharge voids.
The "LFM-48 NH-GE(H)" is a dual boost solder paste that achieves the wettability equivalent to ROL1 while maintaining high reliability of non-halogen paste. It adopts the new technology "Dual Boost," which solves various issues associated with non-halogen paste. This is a unique technology from Almit that combines both fast and slow activation. Even under stringent reflow conditions such as atmospheric reflow and long preheating, it demonstrates melting properties that non-halogen pastes typically lack. 【Features】 ■ High reliability under high temperature and sealed environments ■ Reduction of BGA pillow defects ■ Good melting properties for micro solder joints ■ Reduction of voids *For more details, please refer to the PDF document or feel free to contact us.
- Company:日本アルミット 本社
- Price:Other