Improved overall balance, including printability and smudging.
Solder paste that suppresses the generation of solder balls (side balls and capillary balls) during reflow.
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basic information
FLF01-BZ is a new product that suppresses the occurrence of solder balls (side balls and capillary balls) during reflow. Improvements in solder powder and the development of flux have resulted in enhancements aimed at eliminating solder balls altogether. As a result, the overall balance, including printability and wetting properties, has also improved, and we have received positive feedback from many customers regarding its ease of use. The product is available in 250g and 500g cans, and orders can be placed for just one can.
Price information
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Delivery Time
P3
Applications/Examples of results
The rework of ball removal for reflow soldering of various electronic components will be significantly improved. We encourage you to try it on your production line at least once.
Company information
Under the brand Fine Solder, Matsuo Solder has a history of over 50 years. If you have any questions about solder, please feel free to consult us. We produce various alloys in forms such as rods, wires, and powders, and we develop appropriate fluxes to solve our customers' work-related issues. Since everything is produced in-house, we can customize to meet our customers' needs. We are also confident in our pricing.
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