Lead-free solder paste and lead-free resin-containing solder fine solder.

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last updated：Aug 29, 2012

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Reduce solder balls to the limit!! Achieve both high-temperature wettability and initial wetting properties!!

With innovations in implementation technologies such as SMT and high density, our solder paste continues to evolve. We offer a variety of lead-free and lead-containing solders, as well as fluxes that meet JIS standards, including A-grade, B-grade, low-spatter types, high-workability types, and high-reliability types. For more details, please contact us or refer to our catalog.

Related Link - http://www.matsuo21.com/

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【Paste Lineup】 ○FLF01-BZ: Zero Solder Balls ○FLF01-LH: Halogen-Free ○FLF01-AZ: Room Temperature Storage Type ○FLF01-HR: High Reliability (RMA) ○FLF01-CW: Cleaning Type ○FLF01-SD: Low Flux Scatter ○F01-VZ: Void Reduction 【Yani-Included Lineup】 ○FLF01-2006A: High Workability (Combining Initial Wetting and Cleanliness) ○FLF01-RMA-Z: High Reliability and High Workability ○FLF01-STG: Low Flux Scatter and Prevention of Flux Residue Cracking ○FLF01-LH500: Halogen-Free ○FLF01-STB: Type Compatible with Difficult Base Materials ○FLF07-2006A: High Workability (Combining Initial Wetting and Cleanliness) ○FLF07-RMA-Z: High Reliability and High Workability ○FLF03-2006A: High Workability (Combining Initial Wetting and Cleanliness) ○F03-RMA-Z: High Reliability and High Workability ○FLF23-ACR: Copper Erosion Countermeasure Product ○FLF25-ACR: Copper Erosion Countermeasure Product ● For more details, please contact us or refer to the catalog.