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paste Product List and Ranking from 68 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 石川金属 Osaka//Ferrous/Non-ferrous metals
  3. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  4. 4 セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市） Tokyo//Trading company/Wholesale
  5. 5 荒川化学工業 ファイン・エレクトロニクス事業部 Osaka//Chemical
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paste Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Functional resin materials: heat-dissipating urethane, biomass-modified imide, shielded conductive. 大日精化工業
  2. Solder Paste "TM-HP" 中部アルミット工業
  3. Halogen-free solder paste "EVASOL 7100 Series" 石川金属
  4. 4 McDermid Alpha Solder Paste Innolot セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市）
  5. 5 Toyota Motor recommended solder paste 'GSP'

paste Product List

121～135 item / All 256 items

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Conductive Ag paste "LS-453 series/LS-455-1"

Conductive Ag paste "LS-453 series/LS-455-1"

This is a paste with three viscosity variations tailored to the target circuit width.

The conductive Ag paste "LS-453 series/LS-455-1" is designed for screen printing and can accommodate small quantities and a variety of products. There are three viscosity variations tailored to the desired circuit width. The polymer-type conductive paste can be used on ITO/PET films and has a wide range of applications, including touch panel switches, membrane circuit formation, and EL elements. 【Features】 ○ Suitable for screen printing with small quantities and a variety of products ○ Three viscosity variations tailored to the desired circuit width ○ Low resistance value For more details, please contact us or download the catalog.

  • paint

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High insulation and high concealment black paste "CR-18CSL-CK and others"

High insulation and high concealment black paste "CR-18CSL-CK and others"

We have a lineup of both high insulation types and high concealment types.

Asahi Chemical Research Institute Co., Ltd. provides electronic materials such as resist inks for printed circuit boards and silver and carbon pastes for touch panels and membrane substrates. The high insulation and high opacity black paste "CR-18CSL-CK/CCR-232C-S1" is available in both high insulation and high opacity types. 【Features】 ○ Available in both high insulation and high opacity types ○ CR-18CSL-CK ○ CCR-232C-S1 For more details, please contact us or download the catalog.

  • paint

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Carbon paste

Carbon paste

We have over 20 years of experience in carbon paste for contact points of rigid substrates and FPC, as well as for automotive sensor resistors.

Asahi Chemical Research Institute Co., Ltd. provides various carbon paste materials for rigid substrates and FPCs. The TU series meets various required characteristics according to applications and resistance values, such as contact resistors and internal resistors. The FTU series achieves low resistance and high adhesion for low-temperature and flexible substrates. The BTU series has numerous achievements as sliding sensor materials for automobiles that require high reliability.

  • Resistors

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Wasabi paste SPME-GCxGC-TOFM

Wasabi paste SPME-GCxGC-TOFM

This is a special report on "Wasabi Paste SPME-GCxGC-TOFM."

At LECO Japan, we will pick up samples that are expected to enhance the precision, efficiency, and safety of your analysis operations using LECO's analytical instruments and present them as a special report. Please take a look. If you would like to know whether similar samples can be applied, please feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Analytical Equipment and Devices

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Conductive paste "Dotaite" stretch and molding series

Conductive paste "Dotaite" stretch and molding series

Silicone-based binder with stretchable functionality! Introducing the low elasticity stretch and molding series.

This document introduces the conductive paste "Dotaite" stretchable and moldable series. It includes "silicone-based stretchable paste" and "Ag/AgCl silicone-based stretchable paste" for medical devices, presented with charts and diagrams. Please feel free to download and take a look. [Contents] ■ Silicone-based stretchable paste ■ Ag/AgCl silicone-based stretchable paste ■ Polyurethane-based stretchable paste ■ Stretching characteristics ■ Paste for in-mold forming *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Rust prevention coating "ZAP Paste" application example [Main body of transmission towers]

Rust prevention coating "ZAP Paste" application example [Main body of transmission towers]

Coating-type anti-corrosion paste "ZAP Paste" Application example [Main body of transmission towers]

Coating-type anti-corrosion paste "ZAP Paste" that achieves a thick film and also has sacrificial corrosion protection properties. Application example: [Main body of transmission towers].

  • paint

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Rust preventive coating "ZAP Paste" usage example [Piping in underground facilities]

Rust preventive coating "ZAP Paste" usage example [Piping in underground facilities]

Coating-type anti-corrosion paste "ZAP Paste" application example [Piping in underground facilities]

A coating-type anti-corrosion paste that achieves a thick film and also possesses sacrificial corrosion protection properties.

  • paint

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Solder Paste "winDot-F005-NP303"

Solder Paste "winDot-F005-NP303"

Jet dispense paste compatible with high-speed ejection at a dot diameter of Φ150μm.

"winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components that cannot be printed, such as three-dimensional structures, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are difficult to print (such as those that warp or shrink). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.

  • Other consumables

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High-strength solder paste 'SAB433-LHS-GQ-1'

High-strength solder paste 'SAB433-LHS-GQ-1'

Improved joint reliability compared to SAC305!

"SAB433-LHS-GQ-1" is a high-strength solder paste that suppresses crack propagation due to the addition of Bi and Sb, while maintaining melting characteristics and improving joint reliability compared to SAC305, thanks to the effects of the added elements. Please feel free to contact us if you have any inquiries. 【Basic Properties】 ■ Solder Composition: Sn-4Ag-3.3Sb-3Bi-1Cu-Ni-Ge ■ Melting Point (°C): 209–233 ■ Halide Content (wt%): ≦0.01 ■ Powder Type: Type 4 *For more details, please download the PDF or contact us.

  • Other consumables

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Low void solder paste 'NP303-CQV-1K'

Low void solder paste 'NP303-CQV-1K'

Achieving an ultra-low void of 5% or less!

The "NP303-CQV-1K" is a solder paste that achieves ultra-low voiding compared to conventional pastes by significantly enhancing the fluidity of the flux. It is compatible with a variety of components and atmospheric reflow. Please feel free to contact us if you have any requests. 【Basic Characteristics】 ■Solder Composition: Sn-3.0Ag-0.5Cu ■Melting Point (°C): 217–219 ■Halide Content (wt%): 0.06±0.02 ■Powder Type: Type 4 *For more details, please download the PDF or contact us.

  • Other consumables

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McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications

McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications

It enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.

The lack of suitable solder materials has previously excluded high melting point lead-free solder from serious consideration, but this is finally changing. At the same time, there is a demand for bonding materials that can maximize the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. We are also focusing on the development of high thermal conductivity epoxy paste. The demand for improved reliability and cost-effective high-volume manufacturing (HVM) of die attach has never been higher. With environmentally friendly Argomax technology, it is possible to create low-pressure sintered die attachments based on highly engineered particles. Argomax creates silver bonds with very high thermal and electrical conductivity, providing high reliability and flexible bonding lines. It enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and reduced total costs. It can also accommodate the lead-free transition for high-reliability bonds. We offer a variety of pastes, films, and preforms tailored to specific applications.

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  • Solder

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Aluminum powder products, aluminum paste

Aluminum powder products, aluminum paste

In paint, in printing, in gunpowder.

Aluminum paste is an aluminum pigment made by crushing and grinding high-purity aluminum powder or foil into very thin, flake-like particles. Toyo Aluminum's aluminum paste has a flake shape and particle size that are well controlled, allowing for uniform distribution within the coating, which provides excellent protection against rust and other damages while also achieving a beautiful appearance, making it ideal as a pigment for paints and printing inks. In high-end metallic automotive coatings, a deep luster is achieved.

  • aluminum

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For ceramics too! Aluminum paste for electrode formation.

For ceramics too! Aluminum paste for electrode formation.

Can form an aluminum layer without selecting a substrate! For electrode formation! For heat dissipation!

This is a conductive paste (aluminum paste, aluminum ink) using aluminum powder. It can be printed or coated on various substrates where aluminum adhesion has been difficult until now! By firing, an aluminum layer can be formed, exhibiting excellent conductivity and heat dissipation. Recommended firing temperature: 550°C to 610°C [Features] ◆ Adheres to ceramics, glass, metals, MMD/CMC, and everything else. (Examples: alumina, aluminum nitride, barium titanate, etc.) ◆ Easily applicable by screen printing, dip coating, etc. ◆ Can be fired in the atmosphere. ◆ Lead-free and silver-free. It is friendly to both the human body and cost. [Search Keywords] #ExternalElectrode #AtmosphericEnvironment #ScreenPrinting #DipCoating #ConductiveAluminumPaste #FormationOfAluminumLayerOnCeramics #FormationOfAluminumLayerOnCeramics #Firing #Sintering #WithCeramics #WithMetals #WithMMC #WithCMC #WithGlass #AluminumInk

  • Non-ferrous metals

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[In Progress] Column: Brazing "The Science and Aesthetics of Joining"

[In Progress] Column: Brazing "The Science and Aesthetics of Joining"

[Currently Serializing!] A Casual Column on Brazing

"About brazing" - Brazing is one of the methods for joining metals. - It uses a filler material with a lower melting point than the base metal, allowing the filler to be melted and joined without melting the base metal. - In the case of aluminum, due to its lightweight and high thermal conductivity, it is widely used in many components in fields such as aerospace and automotive, including heat exchangers and heat sinks. As professionals in aluminum, we provide materials suitable for aluminum brazing. We are currently publishing a series of columns on brazing that you can read casually! Enjoy it as a companion during your coffee break♪

  • aluminum

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