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paste Product List and Ranking from 67 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

paste Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 石川金属 Osaka//Ferrous/Non-ferrous metals
  3. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  4. 4 セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市） Tokyo//Trading company/Wholesale
  5. 5 荒川化学工業 ファイン・エレクトロニクス事業部 Osaka//Chemical
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paste Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Functional resin materials: heat-dissipating urethane, biomass-modified imide, shielded conductive. 大日精化工業
  2. Solder Paste "TM-HP" 中部アルミット工業
  3. Halogen-free solder paste "EVASOL 7100 Series" 石川金属
  4. 4 McDermid Alpha Solder Paste Innolot セイワ 東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市）
  5. 5 Toyota Motor recommended solder paste 'GSP'

paste Product List

106～120 item / All 255 items

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Lead-free solder paste "VAPY-F LF219"

Lead-free solder paste "VAPY-F LF219"

Ideal for fine pitch printing! Suppresses slumping and solder balls during rapid heating.

"VAPY-F LF219" is a highly versatile lead-free solder paste that supports fine pitch applications with high insulation reliability. It excels in printing fine pitch patterns, such as 350μm pitch QFPs and chip components smaller than 0603. Additionally, it suppresses slumping and solder balls that are likely to occur during rapid heating, which is common with fine powder type pastes. Despite being a fine powder and containing halogens, it boasts high insulation reliability. 【Features】 ■ Highly versatile ■ Lead-free ■ Excellent for fine pitch pattern printing ■ Suppresses slumping and solder balls during rapid heating ■ High insulation reliability despite being a fine powder and containing halogens *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others

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Lead-free solder paste "XFP-1"

Lead-free solder paste "XFP-1"

Implementation is possible under atmospheric conditions! Continuous printing with additions shows almost no viscosity change for a week.

"XFP-1" is a completely halogen-free, lead-free solder paste that can be used for mounting in an atmospheric environment. It has high insulation properties and shows almost no change in viscosity even after a week of continuous use. 【Features】 ■ Completely halogen-free ■ Lead-free ■ Usable for mounting in an atmospheric environment ■ High insulation properties ■ Good continuous usability *For more details, please refer to the PDF document or feel free to contact us.

  • Solder
  • others

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Diamond paste

Diamond paste

Diamond paste

Grish Company’s diamond paste is a precision polishing compound formulated with carefully selected high-quality polycrystalline and monocrystalline diamond abrasives. It has high uniformity and excellent dispersion effects, and is primarily used for surface finishing polishing of hard alloys, metal materials, and sample analysis. We offer two types to suit our customers' applications: water-soluble and oil-based.

  • Other abrasives
  • Other consumables

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Functional resin materials: heat-dissipating urethane, biomass-modified imide, shielded conductive.

Functional resin materials: heat-dissipating urethane, biomass-modified imide, shielded conductive.

Functional Material Solutions

Exhibited Products at the 40th NePCON Japan Electronics Development and Implementation Exhibition 【Siloxane-Free Thermal Conductive Urethane Paste】Designed for a maximum of 13 W/m·K, it addresses issues related to heat dissipation performance degradation due to poor adhesion between sheet materials and heat dissipation components, as well as contact failures caused by low molecular weight siloxane gases, thereby solving thermal management challenges for electronic components. 【Epoxy Curing Modified Imide Resin】Features such as biomass compatibility and low-temperature curing help reduce environmental impact and production costs. 【Urethane-Based Flexible Conductive Coating】A surface heating paint with shielding functionality made from carbon-based fillers and urethane. ● For more details on each product, please visit our booth.

  • Other electronic parts

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WEICON High-Tech Paste Anti-Seize Agent

WEICON High-Tech Paste Anti-Seize Agent

Burn-in, wear-resistant high-lubricity ceramic microparticle blended lubricant. Operating temperature -40°C to +1400°C. Food machinery lubricant oil NSF H1 certified product.

Products with a temperature range of -40°C to +1400°C and heat resistance. Food machinery lubricating oil (NSF H1 grade) certified product.

  • Lubricants
  • Other machine elements
  • bolt

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Conductive ink (carbon paste, silver paste)

Conductive ink (carbon paste, silver paste)

The carbon paste, which has received high trust and evaluation both domestically and internationally, offers a variety of resistance values ranging from 40Ω to 2MΩ.

Our company produces and sells two types of paste for printed resistors: carbon paste and silver paste. Our printed resistor paste products have gained trust both domestically and internationally and have received high evaluations. Additionally, we accept custom manufacturing tailored to customer specifications and requests.

  • Printed Circuit Board

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High-temperature solder alternative lead-free solder paste RAM series

High-temperature solder alternative lead-free solder paste RAM series

Lead-free material with added Cu powder that ensures bonding strength at temperatures above 250℃.

This is an announcement about the "RAM Series" from Senju Metal Industry Co., Ltd.

  • Solder

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Lead-free solder paste with reduced solder ball type

Lead-free solder paste with reduced solder ball type

Set the solder ball to zero!!

Lead-free solder paste that significantly reduces the cleaning and removal processes for solder ball removal.

  • Solder

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[RMA Type] Lead-Free Solder Paste

[RMA Type] Lead-Free Solder Paste

The use of a newly developed surfactant allows for sufficient wetting even in N2 reflow atmosphere.

Lead-free solder paste with reduced occurrence of solder balls.

  • others

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Lead-free solder paste, solder ball reduction, FLF01-BZ

Lead-free solder paste, solder ball reduction, FLF01-BZ

We have reduced the solder balls to the absolute minimum!!

Lead-free solder paste FLF01-BZ is developed based on the concept of achieving an excellent total balance, particularly aiming to bring the occurrence of solder balls as close to zero as possible. It demonstrates good wetting properties even on difficult substrates such as nickel, and provides a smooth texture similar to whipped cream, allowing for easy release from the squeegee and achieving good printability. For more details, please contact us or refer to the catalog.

  • Solder
  • Other consumables

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