Laser printing solder paste "EVASOL 8229 Series"
Good finish even with rapid laser heating, compatible with printing methods.
Compatible with laser processing The 'EVASOL 8229 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for laser solder pastes to accommodate printing methods. This product is now compatible, allowing transfer with existing equipment. A new operational method By combining light heating and printing, a new operational method has become possible. SMT components such as QFPs can be mounted in a short time without using a reflow oven. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of SMT packages ■ Stable viscosity characteristics *For more details, please refer to the PDF document or feel free to contact us.
- Company:石川金属
- Price:Other