Laser solder paste "EVASOL 3232 Series"
Supports rapid heating by laser, specialized for the implementation of micro components.
Halogen-free standard compliant Does not contain Cl and Br, which are the causes of dioxin generation. Complies with most halogen-free standards. Prevention of solder balls Uses a special activator that enables rapid heating implementation by laser. Reduces slumping during heating and resolves solder ball issues. Specialized for micro components Designed specifically to accommodate the implementation of micro components. Addresses challenges unique to micro components. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of narrow pitch terminals ■ Complies with halogen-free standards *For more details, please refer to the PDF materials or feel free to contact us.
- Company:石川金属
- Price:Other