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process Product List and Ranking from 78 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

process Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  2. Daiwa Fine Chemicals Co., Ltd. Hyogo//Other manufacturing
  3. ネツレン　高周波熱錬株式会社 Tokyo//Machine elements and parts
  4. 4 null/null
  5. 4 昭栄産業 Ishikawa//Service Industry
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process Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Mild carburizing process ネツレン　高周波熱錬株式会社
  2. Non-cyan silver plating process Dain Silver GPE process Daiwa Fine Chemicals Co., Ltd.
  3. Electroless copper plating process for glass substrates for TGV surface treatment 奥野製薬工業 大阪・放出、東京、名古屋など
  4. 4 Aluminum casting and aluminum die casting dyeing: Top ADD process 奥野製薬工業 大阪・放出、東京、名古屋など
  5. 4 Kogakuin University, a school corporation

process Product List

61～75 item / All 137 items

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For multi-material: Top HG bonding process

For multi-material: Top HG bonding process

Multi-material compatible! Joining resin and metal without using adhesives! A new technology for joining dissimilar materials!

The "Top HG Bonding Process" is an etching process for aluminum. By etching the aluminum surface, it allows for the bonding of resin and metal without the use of adhesives. ~For Multi-Material: Top HG Bonding Process~ What's amazing about it! - Achieves high adhesion - Usable with various types of rubber and resins (such as fluororubber and PBT/PPS resins) - Ideal for insert molding (integrated molding) products - Excellent anchor effect - 1.4 times bonding strength (compared to phosphoric anodizing) - Easy to manage analysis Our specialized sales representatives will propose the perfect chemicals and processes for you. Please feel free to consult us about anything.

  • Chemicals
  • aluminum

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Latest! Ultra-fine circuit formation process for semiconductor package substrates.

Latest! Ultra-fine circuit formation process for semiconductor package substrates.

New technology that responds to the miniaturization, thinness, lightweight, and high functionality of electronic devices! The latest process suitable for the fine patterning of semiconductor package substrates!

As the lightweight, thin, compact, and high-functionality of electronic devices progresses, semiconductor packages are required to have finer patterns. Semiconductor package substrates play roles such as providing electrical and mechanical connections, protecting semiconductors from external environments, and dissipating heat generated by semiconductor elements. Okuno Pharmaceutical Industry has newly developed a process that excels in fine circuit formation and connection reliability. From sample production to mass production, Okuno Pharmaceutical Industry coordinates surface treatment comprehensively. Please feel free to consult us about anything related to surface treatment.

  • Chemicals

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Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Technological innovation to reduce transmission loss! Copper plating process on glass substrates.

Developed an electroless copper plating process that achieves high adhesion on glass substrates with low dielectric loss!

Glass has high smoothness and insulation properties, making it excellent for signal transmission characteristics, and it is gaining attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various methods for forming adhesion layers, such as sputtering and sol-gel methods, have been researched to improve adhesion to glass materials. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows for all steps to be treated using wet methods.

  • Surface treatment contract service

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Electroless copper plating process for glass substrates for TGV surface treatment

Electroless copper plating process for glass substrates for TGV surface treatment

In collaboration with Panasonic Environmental Engineering Co., Ltd., we have newly developed an electroless copper plating process called "PLOPX" that achieves high adhesion on glass substrates!

Glass has high smoothness and insulation properties, making it excellent in signal transmission characteristics and attracting attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various adhesion layers have been researched for improving adhesion to glass materials, including sputtering methods and sol-gel methods. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows all steps to be treated using wet methods.

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High connection reliability electroless copper plating process for semiconductor package substrates

High connection reliability electroless copper plating process for semiconductor package substrates

Ensuring crystal continuity at the interface between the inner copper layer and the upper plating layer, achieving advanced reliable connectivity required by cutting-edge packages.

OPC FLET Copper is an electroless copper plating solution of the noncyanide Rochelle salt type, adapted for semi-additive processes. It excels in low film thickness and uniform deposition on material surfaces and within via holes, reducing circuit width narrowing during flash etching. Additionally, it suppresses deposition on copper surfaces, achieving continuity of crystals between inner layer copper and upper layer plated copper, making it an ideal plating solution for fine pattern and micro via hole formation in IC substrates. 【Features】 - Excellent connection reliability between upper layer plated copper and inner layer copper - Achieves low film thickness with uniform and stable deposition on material surfaces and via hole walls - Suppresses blister formation on low roughness materials, providing excellent peel strength - The film demonstrates high purity and low resistance values, not hindering subsequent pattern plating even at low film thickness

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Electroless copper plating process for liquid crystal polymers (LCP)

Electroless copper plating process for liquid crystal polymers (LCP)

Developed a process that combines surface modification and plating to ensure high adhesion for liquid crystal polymers (LCP), known as the top LECS process.

Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluorine-based resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) excels in electrical properties in the high-frequency range, has a low moisture absorption rate, and offers excellent dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to have difficulty securing copper plating adhesion.

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Achieving stable low reflectivity for aluminum! Top Alcroi process.

Achieving stable low reflectivity for aluminum! Top Alcroi process.

Okuno Pharmaceutical Industry, a leading company in surface treatment chemicals for aluminum, has newly developed a surface treatment technology that achieves low reflectance even on the long wavelength side!

In recent years, there has been an increase in the adoption of sensors that measure and monitor parameters such as force, sound, acceleration, temperature, light, color, pressure, magnetism, and speed in fields aimed at automation and labor reduction, such as Advanced Driver-Assistance Systems (ADAS), autonomous vehicles, and industrial robots. Additionally, there is growing demand for devices equipped with sensors in areas outside of automobiles, such as information communication and home appliances. Okuno Pharmaceutical Industry has developed a top-notch Alcroi process for high-precision sensor devices, sensing cameras, optical components, and optical equipment.

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Non-electrolytic copper plating process "OPC SUBLET process"

Non-electrolytic copper plating process "OPC SUBLET process"

Electroless copper plating process "OPC SUBLET process" that achieves high connection reliability.

In recent years, the application environment for printed circuit boards has expanded, particularly in fields related to electric vehicles and autonomous driving, where there is a strong demand for improved reliability of interlayer connections, heat resistance, and durability. Additionally, in response to environmental regulations such as the RoHS directive, there is a consideration to switch the solder used in assembly from low-melting-point Sn-Pb solder (melting point 183°C) to high-melting-point solders such as Sn-Ag (melting point approximately 220°C). Therefore, our company has newly developed an electroless copper plating process that can maintain connection reliability even under severe conditions such as high temperature and high pressure.

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Void-free final surface treatment, ICP-COA process

Void-free final surface treatment, ICP-COA process

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Aluminum electrode on wafer UBM formation plating process

Aluminum electrode on wafer UBM formation plating process

Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs processes such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. However, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor appearance of plating, and poor adhesion. Additionally, in recent years, as power semiconductors have progressed towards higher voltage and higher current, there has been a demand for further heat resistance in electroless plating films. In response, we have developed a new UBM formation plating process called "TORYZA EL PROCESS," which suppresses film reduction and localized corrosion of aluminum electrodes while providing excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment for UBM formation, "TORYZA EL SYSTEM," we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

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Electroless nickel-boron plating process for metal ink circuits on sintered substrates.

Electroless nickel-boron plating process for metal ink circuits on sintered substrates.

Electroless nickel-boron plating process on metal ink circuits on sintered substrates with excellent bath stability.

Optical communication module components and package components are advancing in fine wiring, and the required pattern quality for electroless nickel plating is becoming increasingly demanding. Our company has newly developed an electroless nickel-boron plating process on metal ink paste for sintered substrates that excels in pattern quality compared to conventional methods.

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Fine pattern compatible high joint reliability electroless nickel/gold plating process

Fine pattern compatible high joint reliability electroless nickel/gold plating process

An electroless nickel/gold plating process with excellent fine patterning, ideal for plating on fine wiring.

As electronic devices become lighter, thinner, smaller, and more functional, there is a demand for finer patterns on semiconductor package substrates that incorporate semiconductor components. Our company has developed a new electroless nickel/gold plating process that supports fine patterns, reducing the occurrence of voids and pinholes while ensuring high connection reliability.

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Electroless plating process for insulated circuit boards for power modules.

Electroless plating process for insulated circuit boards for power modules.

Electroless plating process for insulating circuit boards for power modules with excellent heat resistance.

In recent years, SiC and GaN devices have attracted attention as next-generation power semiconductors capable of high-temperature operation, and next-generation power modules equipped with these devices are expected to operate continuously at temperatures above 200°C. Therefore, coatings that have low nickel diffusion into solder even in high-temperature environments are in demand. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace conventional solder joints, and silver plating is being sought to improve bonding strength. In response, our company has newly developed an electroless plating process for insulating circuit boards for power modules.

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Hexavalent chromium-free pretreatment process "Top Zechrom PLUS Process"

Hexavalent chromium-free pretreatment process "Top Zechrom PLUS Process"

Decorative plating process for plastics that does not use environmentally harmful substances.

Metallic and luxurious plastic plating is a surface treatment technology widely adopted to enhance the design of automobiles, motorcycles, home appliances, and interior products such as kitchen and bathroom items. Our company has newly developed the "Top Zechrom PLUS Process," a hexavalent chromium-free pretreatment process that does not use hexavalent chromium, which is restricted under REACH regulations, nor expensive palladium. The "Top Zechrom PLUS Process," a decorative plating process for plastics that does not use environmentally harmful substances, achieves high etching power and adhesion. By simultaneously performing etching and catalyst application, it significantly shortens the process compared to conventional methods.

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Aluminum electrode on wafer UBM formation plating process

Aluminum electrode on wafer UBM formation plating process

Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs electroless Ni/Au plating and electroless Ni/Pd/Au plating; however, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor plating appearance, and adhesion issues. Additionally, in recent years, as power semiconductors have advanced towards higher voltage and higher current, there is an increasing demand for enhanced heat resistance in electroless plating films. In response, we have newly developed the "TORYZA EL PROCESS," a plating process for forming UBM on aluminum electrodes that suppresses film reduction and localized corrosion while exhibiting excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

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