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resin(5v) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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resin Product List

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General-purpose potting resin TE-6302 low viscosity/high strength product

General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

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  • Other polymer materials
  • Other consumables

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High-performance spherical phenolic resin "LPS-V"

High-performance spherical phenolic resin "LPS-V"

It is a spherical phenolic resin with good fluidity and high filling capability.

The spherical phenolic resin "LPS Series" is a spherical form of the oldest type of thermosetting resin, phenolic resin, created through a special method. It allows for particle size control ranging from an average diameter of 5μm to 500μm. There are reactive uncured types, thermally insoluble cured types, and intermediate semi-cured types. Its spherical shape provides excellent flowability. 【Features】 - Spherical shape with good flowability, enabling high filling capacity - Carbon fibers fixed inside and on the surface of the spheres, allowing for the production of carbides in their original shape - High purity with no ash content For more details, please contact us or download the catalog.

  • Other polymer materials
  • plastic

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PC GF20% Black

PC GF20% Black

Filled with fiberglass, improving mechanical strength. Can also be used as a flame-retardant material.

"PC GF20% Black" is a polycarbonate resin filled with glass fiber, which enhances mechanical strength such as bending strength. It also has high flame retardancy (V-0/1.5mm) and is a light-blocking grade, similar to unfilled PC black. It is suitable for impellers, fins, housing covers, and metal alternative parts. 【Features】 ■ GF20% filled polycarbonate resin ■ Improved mechanical strength compared to standard PC grade ■ V-0 flame retardancy ■ High light-blocking performance *Please feel free to contact us for more details about the material.

  • others
  • Other polymer materials

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HyperCel STAR AX Ion Exchange Resin

HyperCel STAR AX Ion Exchange Resin

Advanced salt-resistant anion exchange chromatography resin boasting excellent recovery capability.

HyperCel STAR AX is a salt-tolerant anion exchange resin designed for bioprocessing. ■ High DBC (dynamic binding capacity) with a short residence time (less than 2 minutes) ■ Direct capture of proteins or removal of impurities from undiluted feedstock at moderate to high conductivity ■ Excellent selectivity across a wide range of conductivity ■ Rapid processing, improved economic efficiency of the process

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  • others

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Nylon fixative (fixation treatment for acid dyes)

Nylon fixative (fixation treatment for acid dyes)

Our "water-soluble phenolic resin" strongly bonds and adheres to nylon fibers and acidic dyes.

As an example of the applications of our water-soluble phenolic resin, we would like to introduce the "Nylon Fixing Agent." Our water-soluble phenolic resin is a resol resin made from dihydroxydiphenylsulfone (DHDPS) and phenolsulfonic acid. DHDPS has an electron-withdrawing sulfonyl group at its center, which gives it a much stronger hydrogen bonding capability at both ends compared to ordinary compounds like phenol, cresol, or tannic acid, allowing it to form strong hydrogen bonds with the azo groups of acidic dyes. By utilizing the ionic bonding strength between the terminal amino groups of nylon fibers and the sulfonic acid groups of the water-soluble phenolic resin, as well as the hydrogen bonding strength between the azo groups of acidic dyes and the hydroxyl groups of the water-soluble phenolic resin, the dye is fixed onto the fibers. *For more details, please refer to the PDF document or feel free to contact us.*

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Heating and Pressurizing Automatic Embedding Machine "Simple Met 4000"

Heating and Pressurizing Automatic Embedding Machine "Simple Met 4000"

Introducing a heating and pressure automatic embedding machine with high durability that can accommodate two units even in a small space!

The "Simple Met 4000" is a heating and pressurizing automatic embedding machine with dimensions W311×D662×H498mm (524mm when the door is open). The noise level reaches a maximum of 62db at a distance of 1 meter from the front of the machine during the up and down movement of the ram associated with the opening of the mold closure. Please feel free to contact us if you have any inquiries. 【Features】 ■ Increased productivity (high durability) ■ Time reduction (short embedding cycle) ■ Space-saving (can accommodate two units in a narrow space) ■ Comes with mold assembly *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K2

This is a two-component, room temperature curing epoxy resin for new product development. It has high thermal conductivity and flexibility. [Property table available]

TE-7172K2 is an epoxy resin with high thermal conductivity (3W/m·K) and flexibility. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical equipment where stress relief is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

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  • Other polymer materials
  • Other electronic parts

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-7172K3

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-7172K3

This is a two-component, room temperature curing epoxy resin for new product development. It has high thermal conductivity and flexibility. [Properties table available]

TE-7172K3 is an epoxy resin that has high thermal conductivity (3.3 W/m·K) and flexibility, and is a high thermal, high toughness type of TE-7172K2. It can be used as a heat dissipation insulating material and gap filler for electronic and electrical devices where stress relaxation is required. While there are similar products in silicone and urethane, you can also expect the unique chemical resistance, solvent resistance, and water resistance of epoxy.

  • Other polymer materials
  • Other electronic parts

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