We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for resin.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

resin Product List and Ranking from 435 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

resin Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 三菱ガス化学ネクスト（旧日本ユピカ） 本社 Tokyo//Resin/Plastic
  3. 吉田ＳＫＴ Aichi//Manufacturing and processing contract
  4. 4 三菱ガス化学株式会社　グリーン・エネルギー＆ケミカル事業部門 Tokyo//Chemical
  5. 5 ヤスハラケミカル Tokyo//Chemical
Go to Company Ranking

resin Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. [Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K 寺田
  2. Introduction of products from the Japan Catalyst Group (Revamping of the Ipros special site)
  3. Joint Surface Treatment Agent "Hitlock B" イチネンケミカルズ
  4. 4 Epoxy Resin Zero Mar Series for Sample Grinding [Made in Japan] アイエムティー
  5. 5 Liquid Bismaleimide Resin LMI-5000 OSAKA ORGANIC CHEMICAL IND., LTD.

resin Product List

1291～1305 item / All 1388 items

Displayed results
Biomass resin compatible with the reduction of 12 items of disposable plastic.

Biomass resin compatible with the reduction of 12 items of disposable plastic.

Response to the 12 items to be reduced based on the Plastic Resource Circulation Promotion Act, corn-derived biomass-based resin materials.

The biomass material developed in-house by VASU Corporation (a Hong Kong capital enterprise) is a resin material derived from biomass (corn starch) for which it holds a patent. Yashima Denso is a technical trading company that serves as the official domestic agent for VASU, providing support from resin materials to mass production delivery of molds and molded products. *Mold design and quality are supported by dedicated technical staff. In Japan, much of the biomass resin is often used for flexible packaging and bottles, and there are challenges such as coloring, odor, and strength in biomass resins for injection molding. VASU's materials offer grades suitable for injection molding, featuring excellent moldability, coloring performance, strength, cost, and reduced CO2 emissions during combustion based on actual measurements. Among the 12 targeted items, some samples are available for provision: Forks, spoons, straws, hairbrushes, toothbrushes, hangers, knives, stirrers, combs, razors, shower caps, clothing covers. ☆Environmental Standards RoHS, REACH, FDA, DIN EN 13432 (biodegradable), compliance with Ministry of Health, Labour and Welfare Notification No. 370, JORA Biomass Mark The above items have been addressed or are planned to be addressed.

  • サブ写真.PNG
  • Organic Natural Materials
  • plastic
  • Composite Materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High thermal conductivity epoxy resin TE-7163 (2Wm/k)

High thermal conductivity epoxy resin TE-7163 (2Wm/k)

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

  • Other polymer materials
  • Other consumables

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

  • Other polymer materials
  • Other consumables

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Room temperature short-term curing epoxy resin TE-6011K

Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

  • Other polymer materials
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

  • Other polymer materials
  • glue
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

  • Other polymer materials
  • glue
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Other electronic parts
  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

  • Other polymer materials

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
For design and educational use! 'Sample Blocks' that reveal the characteristics of various types of resins.

For design and educational use! 'Sample Blocks' that reveal the characteristics of various types of resins.

Would you like to deepen your understanding of the lesser-known characteristics, heat resistance temperatures, and changes of resin materials? It's a tool that helps prevent design mistakes and avoid processing troubles.

The "Sample Resin Block" produced by Takimoto Giken Kogyo is a material tool designed for training and educational purposes, as well as for design reference, to help understand the characteristics of the material, heat resistance temperature, and changes due to climate. Whether you are a new employee or a veteran, by simply looking at and touching it, you can gain a certain understanding of the characteristics of resin materials that you may not have known before, packed with our company's know-how. ★ It is also useful for material selection. ★ Have you ever had this experience? ■ For designers ■ Even after carefully selecting the material for the design, unexpected issues such as "thermal effects, warping, and distortion" occurred... ⇒ Since resin has water absorption properties, changes in the material can occur due to storage conditions and timing, such as expansion. Being aware of this in advance can help prevent design mistakes. ■ For equipment engineers ■ When explaining about resin, there have been detailed questions regarding the material that were difficult to explain with words or numbers... ⇒ By being able to show the sample block during meetings, it can help avoid troubles and complaints after processing. * For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • plastic

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Ultra-low transmission loss substrate (MEGTRON6)

Ultra-low transmission loss substrate (MEGTRON6)

Ultra-Low Transmission Loss Substrate (MEGTRON6)

Design will be conducted using high-frequency substrates and high-speed transmission substrates.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Equipment Management Cloud System "SmartF"

Equipment Management Cloud System "SmartF"

Low-cost x small start cloud-based facility management system.

"Smart F" is a cloud-based facility management system that allows for a small start with low cost and low risk. By visualizing all aspects of the manufacturing site, it reduces waste, losses, and man-hours, achieving a compression of management costs. ◆ Effects of introducing Smart F (example) - Reduces inventory work that takes one month to just one week. ◆ Main features (partial) - Equipment ledger management - Equipment operation monitoring/operation aggregation - Inspection management/maintenance planning management - Abnormality recording/manualization of procedures - Inventory management of maintenance parts - Preventive/predictive maintenance - Notification function to prevent parts shortages ◆ For customers facing these challenges - Want to minimize equipment troubles and downtime - Find handwritten or Excel input for equipment maintenance cumbersome - Unable to accumulate information and knowledge on equipment maintenance

  • IPROS40865532889460243602.png
  • SmartF_対象業務フロー.png
  • Production Management System
  • Process Control System
  • Cost Management System

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to resin

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.