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resin(tg) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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resin Product List

31～45 item / All 124 items

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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  • Other polymer materials

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EXTEM XH series for optical products related to 5G.

EXTEM XH series for optical products related to 5G.

Attention is also drawn to the ability to handle complex lens shapes and high productivity.

The EXTEM XH series developed by SABIC has been increasingly used in optical communication transceiver lenses and optical sensor receiving lenses, which are gaining attention in recent years for applications such as 5G. For the same applications, the company's ULTEM RESIN products (such as ULTEM 1010 and ULTEM DT1810EV) have been widely adopted by many customers and components around the world, but they were not compatible with lead-free soldering processes. This material, which is compatible with that process, is attracting attention for its ability to accommodate complex lens shapes and its high productivity compared to glass and thermosetting resin lenses. Additionally, it has gained recognition as a high-heat-resistant optical thermoplastic resin that was first registered in the Zemax OpticsStudio material database in March 2019, providing designers of optical sensors and lenses with a new groundbreaking material option beyond glass and epoxy resins. [Application Examples] Adopted for infrared sensor lenses used in proximity sensors and gesture recognition in electronic products such as smartphones and gaming consoles. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics

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Thermoplastic Polyimide Resin "Therplim"

Thermoplastic Polyimide Resin "Therplim"

Thermoplastic polyimide resin with unprecedented moldability and heat resistance.

Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Resin, plastic materials melting point, Tg (glass transition temperature) measurement (DSC)

Resin, plastic materials melting point, Tg (glass transition temperature) measurement (DSC)

Evaluation of melting point (Tm), glass transition temperature (Tg), crystallinity, and specific heat is possible!

Our company conducts "Differential Scanning Calorimetry (DSC)" to evaluate the thermal properties of resin materials, such as melting point (Tm) and glass transition temperature (Tg). The measurement conditions are as follows: temperature range from -100°C to 400°C, measurement atmosphere is Air or N2, and the sample amount is 5mg. Additionally, when performing material qualification of polyethylene (PE), the melting point is measured using DSC, allowing us to determine whether the sample is LDPE (Low-Density Polyethylene) or HDPE (High-Density Polyethylene) based on the differences in melting points. 【Measurement Conditions】 ■ Temperature Range: -100°C to 400°C ■ Measurement Atmosphere: Air, N2 ■ Sample Amount: 5mg ■ Applicable Standards - JIS K7121 Transition Temperature (Melting, Crystallization, Glass Transition) - JIS K7122 Transition Heat *For more details, please refer to the related links or feel free to contact us.

  • Contract Analysis

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

  • Other polymer materials
  • glue
  • Other electronic parts

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Souriau Resin & Metal Dustproof and Waterproof Round Connector (UTGX)

Souriau Resin & Metal Dustproof and Waterproof Round Connector (UTGX)

The latest version of connectors that are perfect for outdoor use, featuring UV resistance, dust and water protection, and vibration resistance!

【Product Overview】 A connector confirmed to be waterproof, UV-resistant, and shock-resistant (a hybrid of resin and metal). Ideal for applications such as building maintenance, off-road, construction equipment, agricultural machinery, smart agriculture, industrial equipment, mobile base stations, and renewable energy. 【Features】 - Easily detachable with one touch and provides a click sensation, improving work efficiency. - Common contacts can be used across all series of round connectors UTx, making inventory management of contacts simple even when using multiple types of connectors. - For customers who prefer delivery of cable assemblies, we can also provide harness delivery through our partners; additionally, our overseas factory is currently producing over-molded harness products.

  • Circular Connectors

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Resin, plastic materials standard testing <combustibility, thermal properties, permeability>

Resin, plastic materials standard testing <combustibility, thermal properties, permeability>

Corresponds to combustion tests, TG (thermogravimetric analysis), oxygen gas permeability tests, etc., according to standards such as JIS, ISO, and ASTM.

This document is a list of standard tests related to combustibility, thermal properties, and permeability. For combustibility, it includes tests such as horizontal combustion test for automobiles and vertical combustion test. For thermal properties, it covers methods like DSC (Differential Scanning Calorimetry) and DTA (Differential Thermal Analysis). For permeability, it lists standards for oxygen gas permeability and water vapor permeability. Please feel free to contact us if you have any inquiries. [Included Items (Partial)] ■ Horizontal combustion test for automobiles ■ Vertical combustion test ■ Horizontal combustion test ■ Oxygen index ■ DSC (Differential Scanning Calorimetry) ■ DTA (Differential Thermal Analysis) *For more details, please download the PDF or feel free to contact us.

  • Contract measurement

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Resin-based molded material Polybutylene Terephthalate 'PBT/GF30'

Resin-based molded material Polybutylene Terephthalate 'PBT/GF30'

Even after prolonged immersion, there is almost no decrease in physical properties! It is suitable for drive components that require lubricity.

"PBT/GF30" is a polybutylene terephthalate that excels in electrical insulation properties and has a high dielectric breakdown voltage, making it suitable for components in electronic precision equipment. It has high chemical resistance except to strong alkalis, and even after prolonged immersion, there is almost no degradation of physical properties, making it suitable for drive components that require sliding properties. It also has high friction and wear resistance, and when reinforced with glass fibers, it has low water absorption and thermal expansion coefficient, resulting in excellent dimensional stability at high temperatures. 【Specifications】 ■ Heat resistance: 210℃ ■ Tensile strength: 132 MPa ■ Chemical resistance: Excellent acid resistance, weak alkali resistance ■ Glass fiber content: 30% *For more details, please refer to the related link page or feel free to contact us.

  • others
  • Other polymer materials

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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Other electronic parts
  • glue

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SABIC ULTEM and EXTEM

SABIC ULTEM and EXTEM

Value in die-cast parts and stock shape materials

Did you know that Highheat ULTEM and EXTEM powders can be used as additives for optimizing the manufacturing processes of thermoplastic polyimide (TPI) stock shape products (rods, sheets) as well as die-cast components such as connectors, seal rings, screws, and bearings? Our powders help optimize viscosity, reduce curing time, and minimize product defects such as bubbles. They are also inherently compatible with TPI. Go to our dianhydrides and imides webpage: https://lnkd.in/gtGGF8X For inquiries and requests for materials, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics

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Heat-resistant ceramic adhesive

Heat-resistant ceramic adhesive

Heat-resistant ceramic adhesive

【Features】 ● It is a smooth one-component paste, making it easy to apply to various metals, ceramics, graphite, and more. ● It exhibits excellent resistance to oxidative and reductive atmospheres, various solvents, molten metals, X-rays, and radiation. ● It is used in industries such as electronics, semiconductor manufacturing, aerospace, and automotive manufacturing for applications including adhesion, coating, thermocouple bonding, and heat-resistant surface formation.

  • glue

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Recycled copolyester resin "PEPROLENE(TM)"

Recycled copolyester resin "PEPROLENE(TM)"

Plastic with transparency and impact resistance.

"PEPROLENE(TM)" is produced using our unique manufacturing method, maintaining transparency comparable to PC and PMMA while offering stronger surface scratch resistance, high impact resistance, heat resistance, and chemical resistance than PC. It is an environmentally friendly plastic that is BPA-free (contains no bisphenol). It has transparency and gloss similar to acrylic. Please feel free to contact us if you have any requests. 【Features】 - An excellent polymer with impact resistance comparable to polycarbonate and scratch resistance comparable to acrylic. - Chemical resistance including resistance to alkali, oil, and ammonia. - Higher heat resistance compared to PETG and PS, among others. *For more details, please download the PDF or feel free to contact us.

  • plastic

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High heat resistance, transparency, and safety hygiene of the transparent resin 'ALTESTER'.

High heat resistance, transparency, and safety hygiene of the transparent resin 'ALTESTER'.

[New Polyester Material] Polyester resin that can be used in high-temperature environments up to 135°C.

Mitsubishi Gas Chemical's "ALTESTER" is a polyester resin that is heat-resistant, transparent, and safe for health. We would like to introduce three series. "S Series" - Heat resistance up to 95°C - Relatively high elastic modulus, allowing for rigidity and stiffness in thin or small containers and molded products - Can be mixed transparently with various polyesters such as polycarbonate, PET, PET-G, and PBT, controlling various physical properties such as heat resistance, refractive index, crystallinity, and moldability - High melt strength, can also be used as a foaming agent "SN Series" - Heat resistance up to 110°C - Can be mixed transparently due to matching the refractive index with PET, usable as a modifier. Recyclable - Has UV absorption properties, can be used as a UV absorber. Can suppress mold contamination and improve production efficiency "SH Grade" - Glass transition temperature is 135°C, no deformation after boiling for 1 hour - Amorphous with high transparency, impact resistance improved compared to existing grades, comparable to A-PET - Compatible with various molding methods (extrusion, injection, blow) * For details, please download the catalog or feel free to contact us.

  • Other polymer materials

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Resin, plastic materials thermal gravimetric analysis (TGA)

Resin, plastic materials thermal gravimetric analysis (TGA)

The amount of inorganic fillers such as glass fibers, talc, and carbon black can be measured!

In "Thermogravimetric Analysis (TGA)," which is a type of thermal analysis, we measure the weight change of a sample when heated under specific conditions. Simultaneous measurement of Differential Thermal Analysis (DTA) is also possible. This allows us to capture chemical changes accompanied by weight changes such as decomposition, oxidation, and reduction, as well as changes without weight changes such as transitions and crystallization. 【Measurement Conditions】 ■ Temperature Range: Room Temperature to 1300℃ ■ Measurement Atmosphere: Air, N2 ■ Sample Amount: 10mg ■ Corresponding Standards: JIS K7120 (TG/DTA) *For more details, please refer to the related links or feel free to contact us.

  • Contract Analysis

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