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resin(tg) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
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resin Product List

16~30 item / All 124 items

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『Therplim』 Low Friction Grade

For complex shape members and high-performance molded members!

Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.

  • Other polymer materials

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UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

  • Other polymer materials
  • Other electronic parts

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Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

  • Other polymer materials
  • Coating Agent

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Polyester resin "Alapole"

Used for applications such as can paint, PCM, laminated cans, and adhesives!

"Arapor" is a high molecular weight polyester resin that offers excellent processability and adhesion to various substrates. The "high molecular weight type" can exhibit film-forming properties, toughness, and adhesion through the adjustment of "a wide range of glass transition temperatures (Tg)," "a broad range of molecular weights from low to high," "compatibility with various polymers," and "solubility adjustments to solvents." 【Features (Solvent-based Grade)】 ■ High molecular weight type → Improved intermolecular forces → Film-forming properties, toughness, adhesion ■ Random copolymerization → Suppression of crystallinity → Solubility, flexibility, adhesion ■ Varnish form (solvent-diluted) → Easy to handle *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic bearings
  • Plastic utensils and containers

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UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

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  • Coating Agent

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UV-curable resin, flexible type TRU-0202

It is a radical-type UV-curable resin. It has been given anaerobic and heat-curing properties. It is flexible and effective in preventing cracks.

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Structural materials and composite epoxy resin *Evaluation sample*

Essential for CFRP! Short curing time and high mechanical strength and toughness! Ideal for large items too!

High heat resistance, high Tg, high strength, high elongation rate, chemical resistance, room temperature curing, fast curing, etc. We offer a lineup of products tailored to on-site needs! In addition to the items listed in the catalog, we have a wide variety of products, so please feel free to contact us. 【Features】 ■ Short curing time is also possible (matrix resin for HP-RTM) ■ Capable of RTM molding, infusion molding, and filament winding molding ■ A lineup of composite and dissimilar material adhesives, as well as matrix resins for tow prepreg ■ Other products available: dispensers, extrusion machines, SGA, acrylic adhesives, urethane adhesives, bagging films, PFA films, peel plies     ★ Evaluation samples are also available ★ If you are interested, please apply through the "Contact Us" section below.

  • glue
  • plastic
  • Composite Materials

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Polyimide Therplim Low Friction Grade

Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.

Introducing our crystalline thermoplastic polyimide "Therplim Low Friction Grade." It is suitable for applications requiring a high Tg (185°C) and serves as an alternative to super engineering plastics like PEEK. * For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Crystalline polyester resin "ALTESTER SC grade"

[Heat-resistant material] Improved heat resistance during stretching due to crystallinity! A special grade of ALTESTER aimed at enhancing physical properties!

The "ALTESTER SC Grade" is a special grade designed to improve physical properties after stretching, possessing crystallinity. The resin has heat resistance with crystallinity and a glass transition temperature of over 100°C, exhibiting high Izod impact strength and excellent impact resistance even at low stretch. Additionally, the heat resistance of the stretched film surpasses that of PET, making it suitable for applications requiring high heat resistance. 【Features】 - Resin heat resistance: Crystalline with a glass transition temperature of over 100°C - Resin impact resistance: High Izod impact strength and excellent impact resistance even at low stretch - Stretched film heat resistance: Surpasses PET, suitable for applications requiring high heat resistance - Stretched film characteristics: Low density, low elastic modulus, low dielectric constant (compared to PET film) - Safety and hygiene: Under consideration for positive list inclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Thermosetting resin (cyanate monomer) 'CYTESTER'

A thermosetting cyanate monomer with excellent heat resistance and processability, achieving low dielectric constant and low dielectric loss tangent.

"CYTESTER" is a thermosetting resin with a high glass transition temperature, low dielectric constant, and low dielectric loss tangent. In addition to being used alone, it can also be combined with various thermosetting resins such as epoxy resins. Its features can be utilized in applications such as printed circuit boards, semiconductor encapsulation materials, adhesives, and composite materials. We offer grades suitable for each application. 【Features】 Monomer Cured Product ◎ Low melting viscosity ◎ High heat resistance (Tg≈300℃) ◎ Excellent solvent solubility ◎ Low thermal expansion rate ◎ Low dielectric constant / low dielectric loss tangent ◎ Electrical insulation *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Other polymer materials

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Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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