Last Updated： Aggregation Period:Dec 03, 2025～Dec 30, 2025
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16～30 item / All 134 items
For complex shape members and high-performance molded members!
Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.
The amount of inorganic fillers such as glass fibers, talc, and carbon black can be measured!
In "Thermogravimetric Analysis (TGA)," which is a type of thermal analysis, we measure the weight change of a sample when heated under specific conditions. Simultaneous measurement of Differential Thermal Analysis (DTA) is also possible. This allows us to capture chemical changes accompanied by weight changes such as decomposition, oxidation, and reduction, as well as changes without weight changes such as transitions and crystallization. 【Measurement Conditions】 ■ Temperature Range: Room Temperature to 1300℃ ■ Measurement Atmosphere: Air, N2 ■ Sample Amount: 10mg ■ Corresponding Standards: JIS K7120 (TG/DTA) *For more details, please refer to the related links or feel free to contact us.
Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!
We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.
High heat resistance, high light resistance, high elasticity epoxy compound.
TEPIC is a triad-based epoxy compound with a triazine skeleton. Compared to general-purpose epoxy resins, it excels in transparency, heat resistance, and light resistance, and has very unique characteristics such as high elasticity and high Tg. It has a wide range of applications, including LED peripheral materials and solder resist inks. Additionally, by adding a small amount of TEPIC to CFRP matrix resins, it is possible to improve compression properties, tensile properties, and interlaminar shear strength. *For more details, please download the PDF or feel free to contact us.*
Used for applications such as can paint, PCM, laminated cans, and adhesives!
"Arapor" is a high molecular weight polyester resin that offers excellent processability and adhesion to various substrates. The "high molecular weight type" can exhibit film-forming properties, toughness, and adhesion through the adjustment of "a wide range of glass transition temperatures (Tg)," "a broad range of molecular weights from low to high," "compatibility with various polymers," and "solubility adjustments to solvents." 【Features (Solvent-based Grade)】 ■ High molecular weight type → Improved intermolecular forces → Film-forming properties, toughness, adhesion ■ Random copolymerization → Suppression of crystallinity → Solubility, flexibility, adhesion ■ Varnish form (solvent-diluted) → Easy to handle *For more details, please refer to the PDF materials or feel free to contact us.
It is a di-functional urethane methacrylate with a methacrylate group.
This product is a di-functional urethane methacrylate with a methacrylate base. It is suitable as a base resin for thermosetting adhesives, anaerobic adhesives, and sealing/casting agents. - Due to its milder reactivity compared to acrylate bases, it has low exotherm, anaerobic curing properties, and low curing shrinkage. It is also characterized by high heat resistance and low toxicity due to its high Tg. - It has a structure that combines hydrolysis resistance from the ether backbone and toughness from the aromatic component. - It uses plant-derived raw materials, making it possible to consider environmentally friendly product development. It is supplied in liquid form. Please download the catalog for more details. We also offer free samples, web seminars, and product customization. Feel free to contact us.
It is a radical-type UV-curable resin. It has been given anaerobic and heat-curing properties. It is flexible and effective in preventing cracks.
TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing
Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).
Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.
Essential for CFRP! Short curing time and high mechanical strength and toughness! Ideal for large items too!
High heat resistance, high Tg, high strength, high elongation rate, chemical resistance, room temperature curing, fast curing, etc. We offer a lineup of products tailored to on-site needs! In addition to the items listed in the catalog, we have a wide variety of products, so please feel free to contact us. 【Features】 ■ Short curing time is also possible (matrix resin for HP-RTM) ■ Capable of RTM molding, infusion molding, and filament winding molding ■ A lineup of composite and dissimilar material adhesives, as well as matrix resins for tow prepreg ■ Other products available: dispensers, extrusion machines, SGA, acrylic adhesives, urethane adhesives, bagging films, PFA films, peel plies ★ Evaluation samples are also available ★ If you are interested, please apply through the "Contact Us" section below.
![[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K](https://image.mono.ipros.com/public/product/image/2001551950/IPROS11608113077360182993.jpg?w=280&h=280)
One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.
TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.
[Heat-resistant material] Improved heat resistance during stretching due to crystallinity! A special grade of ALTESTER aimed at enhancing physical properties!
The "ALTESTER SC Grade" is a special grade designed to improve physical properties after stretching, possessing crystallinity. The resin has heat resistance with crystallinity and a glass transition temperature of over 100°C, exhibiting high Izod impact strength and excellent impact resistance even at low stretch. Additionally, the heat resistance of the stretched film surpasses that of PET, making it suitable for applications requiring high heat resistance. 【Features】 - Resin heat resistance: Crystalline with a glass transition temperature of over 100°C - Resin impact resistance: High Izod impact strength and excellent impact resistance even at low stretch - Stretched film heat resistance: Surpasses PET, suitable for applications requiring high heat resistance - Stretched film characteristics: Low density, low elastic modulus, low dielectric constant (compared to PET film) - Safety and hygiene: Under consideration for positive list inclusion *For more details, please refer to the PDF document or feel free to contact us.
A thermosetting cyanate monomer with excellent heat resistance and processability, achieving low dielectric constant and low dielectric loss tangent.
"CYTESTER" is a thermosetting resin with a high glass transition temperature, low dielectric constant, and low dielectric loss tangent. In addition to being used alone, it can also be combined with various thermosetting resins such as epoxy resins. Its features can be utilized in applications such as printed circuit boards, semiconductor encapsulation materials, adhesives, and composite materials. We offer grades suitable for each application. 【Features】 Monomer Cured Product ◎ Low melting viscosity ◎ High heat resistance (Tg≈300℃) ◎ Excellent solvent solubility ◎ Low thermal expansion rate ◎ Low dielectric constant / low dielectric loss tangent ◎ Electrical insulation *For more details, please refer to the materials. Feel free to contact us with any inquiries.
A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.
"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.
Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.
"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.
