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resin(tg) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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resin Product List

16～30 item / All 126 items

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Cutting processing material: PI resin (BPDA)

Cutting processing material: PI resin (BPDA)

Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!

We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.

  • Other polymer materials

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High-performance epoxy compound "TEPIC"

High-performance epoxy compound "TEPIC"

High heat resistance, high light resistance, high elasticity epoxy compound.

TEPIC is a triad-based epoxy compound with a triazine skeleton. Compared to general-purpose epoxy resins, it excels in transparency, heat resistance, and light resistance, and has very unique characteristics such as high elasticity and high Tg. It has a wide range of applications, including LED peripheral materials and solder resist inks. Additionally, by adding a small amount of TEPIC to CFRP matrix resins, it is possible to improve compression properties, tensile properties, and interlaminar shear strength. *For more details, please download the PDF or feel free to contact us.*

  • Chemicals

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Polyester resin "Alapole"

Polyester resin "Alapole"

Used for applications such as can paint, PCM, laminated cans, and adhesives!

"Arapor" is a high molecular weight polyester resin that offers excellent processability and adhesion to various substrates. The "high molecular weight type" can exhibit film-forming properties, toughness, and adhesion through the adjustment of "a wide range of glass transition temperatures (Tg)," "a broad range of molecular weights from low to high," "compatibility with various polymers," and "solubility adjustments to solvents." 【Features (Solvent-based Grade)】 ■ High molecular weight type → Improved intermolecular forces → Film-forming properties, toughness, adhesion ■ Random copolymerization → Suppression of crystallinity → Solubility, flexibility, adhesion ■ Varnish form (solvent-diluted) → Easy to handle *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic bearings
  • Plastic utensils and containers

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UV-curable resin with a methacrylate group

UV-curable resin with a methacrylate group

It is a di-functional urethane methacrylate with a methacrylate group.

This product is a di-functional urethane methacrylate with a methacrylate base. It is suitable as a base resin for thermosetting adhesives, anaerobic adhesives, and sealing/casting agents. - Due to its milder reactivity compared to acrylate bases, it has low exotherm, anaerobic curing properties, and low curing shrinkage. It is also characterized by high heat resistance and low toxicity due to its high Tg. - It has a structure that combines hydrolysis resistance from the ether backbone and toughness from the aromatic component. - It uses plant-derived raw materials, making it possible to consider environmentally friendly product development. It is supplied in liquid form. Please download the catalog for more details. We also offer free samples, web seminars, and product customization. Feel free to contact us.

  • plastic

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Structural materials and composite epoxy resin *Evaluation sample*

Structural materials and composite epoxy resin *Evaluation sample*

Essential for CFRP! Short curing time and high mechanical strength and toughness! Ideal for large items too!

High heat resistance, high Tg, high strength, high elongation rate, chemical resistance, room temperature curing, fast curing, etc. We offer a lineup of products tailored to on-site needs! In addition to the items listed in the catalog, we have a wide variety of products, so please feel free to contact us. 【Features】 ■ Short curing time is also possible (matrix resin for HP-RTM) ■ Capable of RTM molding, infusion molding, and filament winding molding ■ A lineup of composite and dissimilar material adhesives, as well as matrix resins for tow prepreg ■ Other products available: dispensers, extrusion machines, SGA, acrylic adhesives, urethane adhesives, bagging films, PFA films, peel plies 　　　　★ Evaluation samples are also available ★ If you are interested, please apply through the "Contact Us" section below.

  • glue
  • plastic
  • Composite Materials

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

  • Resin container

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Crystalline polyester resin "ALTESTER SC grade"

Crystalline polyester resin "ALTESTER SC grade"

[Heat-resistant material] Improved heat resistance during stretching due to crystallinity! A special grade of ALTESTER aimed at enhancing physical properties!

The "ALTESTER SC Grade" is a special grade designed to improve physical properties after stretching, possessing crystallinity. The resin has heat resistance with crystallinity and a glass transition temperature of over 100°C, exhibiting high Izod impact strength and excellent impact resistance even at low stretch. Additionally, the heat resistance of the stretched film surpasses that of PET, making it suitable for applications requiring high heat resistance. 【Features】 - Resin heat resistance: Crystalline with a glass transition temperature of over 100°C - Resin impact resistance: High Izod impact strength and excellent impact resistance even at low stretch - Stretched film heat resistance: Surpasses PET, suitable for applications requiring high heat resistance - Stretched film characteristics: Low density, low elastic modulus, low dielectric constant (compared to PET film) - Safety and hygiene: Under consideration for positive list inclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Thermosetting resin (cyanate monomer) 'CYTESTER'

Thermosetting resin (cyanate monomer) 'CYTESTER'

A thermosetting cyanate monomer with excellent heat resistance and processability, achieving low dielectric constant and low dielectric loss tangent.

"CYTESTER" is a thermosetting resin with a high glass transition temperature, low dielectric constant, and low dielectric loss tangent. In addition to being used alone, it can also be combined with various thermosetting resins such as epoxy resins. Its features can be utilized in applications such as printed circuit boards, semiconductor encapsulation materials, adhesives, and composite materials. We offer grades suitable for each application. 【Features】 Monomer Cured Product ◎ Low melting viscosity ◎ High heat resistance (Tg≈300℃) ◎ Excellent solvent solubility ◎ Low thermal expansion rate ◎ Low dielectric constant / low dielectric loss tangent ◎ Electrical insulation *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Other polymer materials

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Thermoplastic polyimide resin "Saprime"

Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Thermoplastic polyimide resin "Saprime Powder"

Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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  • Other polymer materials

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Terpene phenol resin "YS Polystar"

Terpene phenol resin "YS Polystar"

In addition to various elastomer-based formulations, it is also used for improving the physical properties of acrylic adhesives and epoxy-based products.

"YS Polystar" is a terpene phenol resin co-polymerized from terpene monomers and phenol, which are biomass raw materials. In addition to the wide compatibility of terpene resins, by varying the degree of modification by grade, it can dissolve in a wide range of bases from low polarity to high polarity materials, exhibiting properties such as improved adhesion to difficult bonding surfaces like polyolefin resins. Furthermore, the high softening point grade demonstrates effectiveness in improving heat resistance and fixation as an additive for adhesives and sealants due to its high Tg, and also proves effective in enhancing vibration damping in various rubber molded products, as well as improving flowability and paintability in engineering plastics. [Features] - Thermoplastic adhesive resin (tacky fire) and additive for olefin modification - Capable of addressing high polarity and difficult adhesion with high softening point resin - Bead form *For more details, please download the PDF or feel free to contact us.

  • Chemicals

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EXTEM XH series for optical products related to 5G.

EXTEM XH series for optical products related to 5G.

Attention is also drawn to the ability to handle complex lens shapes and high productivity.

The EXTEM XH series developed by SABIC has been increasingly used in optical communication transceiver lenses and optical sensor receiving lenses, which are gaining attention in recent years for applications such as 5G. For the same applications, the company's ULTEM RESIN products (such as ULTEM 1010 and ULTEM DT1810EV) have been widely adopted by many customers and components around the world, but they were not compatible with lead-free soldering processes. This material, which is compatible with that process, is attracting attention for its ability to accommodate complex lens shapes and its high productivity compared to glass and thermosetting resin lenses. Additionally, it has gained recognition as a high-heat-resistant optical thermoplastic resin that was first registered in the Zemax OpticsStudio material database in March 2019, providing designers of optical sensors and lenses with a new groundbreaking material option beyond glass and epoxy resins. [Application Examples] Adopted for infrared sensor lenses used in proximity sensors and gesture recognition in electronic products such as smartphones and gaming consoles. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics

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