CSP test socket equipped with adjustable pressure pads
CSP test socket equipped with adjustable pressure pads.
The CSP (Chip Scale Package) / Micro BGA (Ball Grid Array) test burn-in socket product series from Aries features a simple pressure pad compression design that accommodates various ranges of movement without applying excessive pressure to the device. It offers devices with maximum sizes of 6.5 mm², 13 mm², 27 mm², 40 mm², 55 mm², as well as 14 to 27 mm².
- Company:マイクロン
- Price:Other