IC30 Series (DIP)
Implementation IC socket
Introducing the IC socket IC30 series (DIP) for implementation.
- Company:山一電機
- Price:Other
Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.
271~285 item / All 589 items
Implementation IC socket
Introducing the IC socket IC30 series (DIP) for implementation.
Implementation IC socket
Introducing the IC socket IC149 series (QFP) for implementation.
Plastronics Cam Lever Open Top BGA Socket
●Standard lineup ●Ideal for manual testing of multi-pin BGA ●Optimal for analysis as no lid is required ●Contact method with single-side contact prevents damage to the ball mounting surface
Plastronics H-pin contact socket
To support high current applications, we have released a new series of products. The H-pin utilizes the burn-in process and repurposes the clam-shell body of existing QFN sockets, enabling cost reduction. The H-pin is compatible with QFN, LGA, BCC, etc., down to a pitch of 0.4 mm.
Just set it on the electric drill driver! Quickly remove rust from bolts on site!
The powerful brush inside the socket easily polishes rust on the screw threads, hardened bolt lubricants, and paint in about 10 seconds per piece.
The EAO 84 series accessory items have added a robust and sophisticatedly designed USB 3.0 socket.
The EAO 84 series accessory items have been enhanced with a robust and sophisticatedly designed USB 3.0 socket, making it suitable for applications that require a maximum IP65 protection.
We have a track record of deliveries to major domestic semiconductor manufacturers.
**Features** - By compacting the socket mechanism, the socket size has been minimized, reducing the mounting area on the circuit board. - You can select suitable contacts that match your usage conditions (contacts for room temperature applications are available). - It has a PKG separation mechanism to address sticking issues that occur during burn-in testing. - By machining the socket adapter, it can accommodate a variety of package shapes. **Specifications** - Contact pressure: 11–14g/pin (for high temperature) 17–22g/pin (for room temperature) - Initial contact resistance: 200–300mΩ - Operating temperature: -40 to +150℃ - Maximum allowable current: 0.6amp *For more details, please feel free to contact us.*
We offer a diverse lineup tailored to your needs! Centered around electrification, we provide sockets for high-demand power devices even in small quantities!
We would like to introduce the "Power Device Socket" made by SDK. It features tracking resistance due to special materials, with a withstand voltage of 5kV and heat-resistant design specifications. A diverse lineup and customized design and manufacturing are available according to your needs. The "Busbar Type" can be used in high-temperature environments and supports large currents. Additionally, the freedom of arrangement has been improved, making maintenance easier. 【Lineup】 ■C001 Series (3-terminal socket) ・TO220, TO-3P, TO247-3L ■C082 Series (4-terminal socket) ・TO247-4L *For more details, please refer to the PDF materials or feel free to contact us.
Select the right materials according to the target device and testing environment! Production is possible from just one piece!
We propose sockets that are compatible with almost all packages. For custom products made through machining, production can be done from a quantity of one. Depending on the production quantity, we can also create molded sockets by starting a mold. We accommodate a wide range of packages, from small packages under 1.0mm to ICs exceeding 1,000 pins. We excel in various mechanical designs, so please feel free to consult us if you have any concerns. 【Features】 ■ Proposing sockets compatible with almost all packages ■ Capable of creating molded sockets by starting a mold ■ Selecting appropriate materials according to the target devices and testing environments ■ Wide compatibility from small packages under 1.0mm to ICs exceeding 1,000 pins ■ Expertise in various mechanical designs *For more details, please refer to the PDF materials or feel free to contact us.
Connect multiple pipes simultaneously with a single connection operation! You can establish an automated and unmanned system for pipe connection and separation.
The "Multi Coupler" MALC-01 type can be used as a standalone socket. The "Multi Coupler" MALC-01 type, MALC-SP type, and HSP type can be used in combination with plugs and sockets, and since the dimensions between plates are standardized to 30mm, they can be installed on the same plate. An eccentricity of up to φ2mm is permissible, so precise alignment during installation is not required. In addition to the MALC-01 type for low pressure, there are also the MALC-SP type for medium pressure and the MALC-HSP type for high pressure. 【Featured Products】 1. MALC-01 type (for low pressure) 2. MALC-SP type (for medium pressure) 3. MALC-HSP type (for high pressure) *For more details, please refer to the PDF document or feel free to contact us.
Easily automate conventional electrical appliances.
【Remote On/Off】 Turn electrical appliances on/off remotely from your mobile phone. 【Time-Based On/Off】 Create a schedule to automatically turn remote appliances on/off. 【Power Consumption Measurement】 Measuring power consumption and flexible scheduling helps save energy and reduce electricity costs. 【Overload Protection】 Overload protection prevents damage to connected appliances, safety fuses, and the smart socket itself from overcurrent. 【User-Friendly】 Switching and setting devices on/off via NFC technology from a mobile phone or PC.
Burn-in socket
Wells Cti provides innovative interconnect solutions. The various sockets, carriers, clips, contactors, and design services included in this solution meet the extensive requirements for burn-in, testing, and thermal management of ICs, accommodating a wide range of both new and old packages. Since its establishment in 1948, Wells Cti has been a leading supplier of burn-in sockets for the IC industry and a global supplier of IC carriers and flat-pack contactors for the military/aerospace market.
A simple modification of the existing burn-in system will enable temperature management using isocket technology.
The IsoSocket Oven Upgrade Module is a module that simply integrates all the infrastructure necessary for IsoSocket installation into one box, enabling easy and quick upgrades of existing burn-in systems. Benefits of use: - Temperature management via IsoSocket is possible with simple modifications to existing ovens. - Low-risk installation method. - Quick upgrades of ovens are possible through the use of modular components. - Reduced burden of infrastructure development. - A low-cost solution as an alternative to procuring new equipment for competing systems.
Test socket for QFN packages compatible with narrow pitch. For improving the yield of semiconductor components.
The QFN semiconductor package is essential for miniaturizing precision equipment. The Burn-In Socket 'Series 790' allows for quality testing to be conducted with higher precision and efficiency to avoid defective products. - Supports terminal pitches of 0.4, 0.5, 0.8, and 1.0 mm - Open-top type, ideal for both automatic and manual insertion/removal - Usable in harsh environmental tests such as HAST and THB - Improves positioning accuracy for fine-pitch devices These features enhance the accuracy of burn-in testing.
This is an open-top socket series with a rich lineup corresponding to each pitch of fine-pitch BGA/LGA devices.
- We offer a wide range of variations of BGA/LGA devices with terminal pitches of 0.4mm, 0.5mm, 0.65mm, and 0.8mm. - It is an open-top type suitable for both automatic insertion and manual insertion of devices. - It adopts a push-type surface mount method that makes it easy to remove from the substrate. - Some models employ a full-cover latch mechanism to prevent warping of devices at high temperatures. - It can also be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive punched contacts.