Test socket for LED use
Since there is no need for wire bonding in the inspection of individual LED chips, work efficiency has significantly improved.
【Features】 - Easy attachment and detachment of LED chips (before packaging) - Compatible with flip chip technology - After aging, chips can be directly mounted on the integrating sphere for measurement without removal - Easy attachment and detachment to the aging substrate - Heat-resistant materials are used considering the heat generation of LED chips, with heat dissipation measures in place *For more details, please feel free to contact us.
- Company:SDK
- Price:Other