Introducing products related to semiconductor manufacturing, including "vacuum chucks" and "heat comas"!
We would like to introduce our "Porous Adsorption Stage."
The "Vacuum Chuck" is used to hold wafers during die bonding. Additionally, to solve issues such as neighboring chip lift-off or rotation during pickup, we recommend the "Porous Chuck."
Furthermore, the "Heat Coma" allows for uniform adsorption across the entire surface without the need for adsorption holes by using porous materials in the work mounting area.
【Features】
<Vacuum Chuck>
■ Holds wafers during die bonding
■ Custom orders can accommodate various materials, shapes, and patterns
<Porous Chuck>
■ Capable of uniformly holding wafer sheets (chips) across the entire surface
■ Eliminates warping of wafer sheets
*For more details, please refer to the related links or feel free to contact us.
- Company:タイショー
- Price:Other